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8302AMI-01LF

P1-P3P4-P6P7-P9P10-P10
8302I-01 Data Sheet
©2016 Integrated Device Technology, Inc Revision A March 7, 20167
TABLE 6. PACKAGE DIMENSIONS
Reference Document: JEDEC Publication 95, MS-012
PACKAGE OUTLINE - SUFFIX M FOR 8 LEAD SOIC
SYMBOL
Millimeters
MINIMUN MAXIMUM
N8
A 1.35 1.75
A1 0.10 0.25
B 0.33 0.51
C 0.19 0.25
D 4.80 5.00
E 3.80 4.00
e 1.27 BASIC
H 5.80 6.20
h 0.25 0.50
L 0.40 1.27
α
0° 8°
8302I-01 Data Sheet
©2016 Integrated Device Technology, Inc Revision A March 7, 20168
TABLE 7. ORDERING INFORMATION
Part/Order Number Marking Package Shipping Packaging Temperature
83054AGI-01LF 054AI01L 16 lead “Lead Free” TSSOP Tray -40°C to +85°C
83054AGI-01LFT 054AI01L 16 lead “Lead Free” TSSOP Tape and Reel -40°C to +85°C
8302I-01 Data Sheet
©2016 Integrated Device Technology, Inc Revision A March 7, 20169
REVISION HISTORY SHEET
Rev Table Page Description of Change Date
AT7 8
10
Updated datasheet’s header/footer with IDT from ICS.
Removed ICS prefi x from Part/Order Number column.
Added Contact Page.
7/29/10
A
T7
1
8
Features section - removed reference to leaded package.
Ordering Information - removed quantity from tape and reel. Deleted LF note
below table.
Updated header and footer.
3/9/16
P1-P3P4-P6P7-P9P10-P10

8302AMI-01LF

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Buy 8302AMI-01LF
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Description:
Clock Buffer 2 LVCMOS OUT BUFFER
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New from this manufacturer.
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