Analog Integrated Circuit Device Data
Freescale Semiconductor 13
MM912_P812
PIN CONNECTIONS
MAXIMUM RATINGS
MAXIMUM RATINGS
ANALOG MC33812 PARAMETRICS
The detailed MC33812 specifications can be found in the MC33812 data sheet. See MC33812.
MICROCONTROLLER S12P PARAMETRICS
The detailed S12P specifications can be found in the MC9S12P128 reference manual. See MC9S12P128.
Table 5. MM912_P812 Maximum Ratings
All voltages are with respect to ground, unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Symbol Rating Value Unit Notes
ELECTRICAL RATINGS
V
ESD1
V
ESD2
V
ESD3
V
ESD4
ESD Voltage
Human Body Model
Machine Model
Charge Device Model (Corner pins)
Charge Device Model
±2000
±200
±750
±500
V
(11)
THERMAL RATINGS
T
A
T
J
T
C
Operating Temperature
Ambient
Junction
Case
-40 to 125
-40 to 150
-40 to 125
°C
T
STG
Storage Temperature
-55 to 150
°C
P
D
Power Dissipation (T
A
= 25°C)
1.7 W
(14)
T
SOLDER
Peak Package Reflow Temperature During Solder Mounting
Note 13
°C
(12),
(13)
R
θ
JA
R
θ
JL
R
θ
JC
Thermal Resistance
Junction-to-Ambient
Junction- to-Lead
Junction-to-Flag
75
8.0
1.2
°C/W
Notes
11. ESD testing is performed in accordance with the Human Body Model (HBM) (C
ZAP
= 100 pF, R
ZAP
= 1500 Ω), the Machine Model (MM)
(C
ZAP
= 200 pF, R
ZAP
= 0 Ω), and the Charge Device Model (CDM), Robotic (C
ZAP
= 4.0 pF).
12. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
13. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts (i.e. MC33xxxD enter 33xxx), and review parametrics.
14. This parameter is guaranteed by design but is not production tested.
