Spec No. JELF243A-0038M-01 P.2/9
MURATA MFG.CO.,LTD
Reference
Only
6.Electrical Performance
No. Item Specification Test Method
6.1 Inductance
Inductance shall meet item 3. Measuring Equipment : Agilent 4191A or equivalent
Measuring Frequency : <L>100MHz
<Q>250MHz
Measuring Method: See P.9
[Electrical Performance:Measuring Method of
Inductance/ Q]
6.2 Q Q shall meet item 3.
6.3 DC Resistance DC Resistance shall meet item 3. Measuring Equipment : Digital multi meter
6.4 Self Resonant
Frequency
(S.R.F)
S.R.F shall meet item 3. Measuring Equipment : Agilent 5230A or equivalent
6.5 Rated Current Self temperature rise shall be
limited to 20 °C max.
Inductance Change : within ± 10%
The rated current is applied.
7.Mechanical Performance
No. Item Specification Test Method
7.1 Shear Test Chip coil shall not be damaged after
tested as test method.
Substrate:Glass-epoxy substrate
Applied Direction :
Force:10N
Hold Duration:5s±1s
7.2 Bending Test Chip coil shall not be damaged after
tested as test method.
Substrate:Glass-epoxy substrate
(100mm×40mm×1.6mm)
Speed of Applying Force:1mm / s
Deflection:2mm
Hold Duration:30 s
7.3 Vibration Oscillation Frequency :
10Hz ~ 55Hz ~ 10Hz for 1 min
Total Amplitude:1.5mm
Testing Time:A period of 2 hours in each of
3 mutually perpendicular
directions. (Total 6h)
7.4 Solderability The wetting area of the electrode
shall be at least 90% covered with
new solder coating.
Flux:Ethanol solution of rosin 25(wt)%
(Immersed for 5s to 10s)
Solder:Sn-3.0Ag-0.5Cu
Pre-Heating:150°C±10°C / 60s to 90s
Solder Temperature:240°C±5°C
Immersion Time:3s±1s
3.0
0.8
1.2
(in mm)
Chip Ciol
Pattern
Substrate
Solder resist
F
Chip Coil
Substrate
45
R340
F
Deflection
45
Product
Pressure jig
(in mm)