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LQW2BHN15NK13L

P1-P3P4-P6P7-P9
Spec No. JELF243A-0038M-01 P.4/9
MURATA MFG.CO.,LTD
Reference
Only
9.2 Specification of Taping
(1) Packing quantity (standard quantity)
2,000 pcs / reel
(2) Packing Method
Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Plastic tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater,
and are not continuous. The specified quantity per reel is kept.
9.3 Pull Strength
Plastic tape
10N min.
Cover tape
9.4 Peeling off force of cover tape
Speed of Peeling off 300mm / min
Peeling off force
0.1N to 0.7N
(minimum value is typical)
9.5 Dimensions of Leader-tape,Trailer and Reel
There shall be leader-tape ( cover tape ) and trailer-tape (empty tape) as follows.
(in mm)
9.6 Marking for reel
Customer part number, MURATA part number, Inspection number(1) ,RoHS Marking (2),
Quantity etc ･･･
1) <Expression of Inspection No.>
□□ OOOO 
(1) (2) (3)
(1) Factory Code
(2) Date First digit : Year / Last digit of year
Second digit : Month / Jan. to Sep. 1 to 9, Oct. to Dec. O,N,D
Third, Fourth digit : Day
(3)
Serial No.
2) <Expression of RoHS Marking > ROHS – Y (△)
(1) (2)
(1)
RoHS regulation conformity parts.
(2) MURATA classification number
9.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS Marking (2) ,Quantity, etc ･･･
165 to 180 degree
F
Cover tape
Plastic tape
Empty tape
190 min.
Leader
Trailer
Cover tape
2.0±0.5
13.0±0.2
21.0±0.8
180±
60±
9±
13±1.4
1
0
0
3
Direction of feed
210 min.
160 min.
1
0
Label
Spec No. JELF243A-0038M-01 P.5/9
MURATA MFG.CO.,LTD
Reference
Only
9.8. Specification of Outer Case
Outer Case Dimensions
(mm)
Standard Reel Quantity
in Outer Case (Reel)
W D H
186 186 93 5
Above Outer Case size is typical. It depends on a quantity of an order
10. ！ Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially
high reliability for the prevention of defects which might directly cause damage to the third party's life,
body or property.
(1) Aircraft equipment (6) Transportation equipment (vehicles, trains, ships, etc.)
(2) Aerospace equipment (7) Traffic signal equipment
(3) Undersea equipment (8) Disaster prevention / crime prevention equipment
(4) Power plant control equipment (9) Data-processing equipment
(5) Medical equipment (10) Applications of similar complexity and /or reliability
requirements to the applications listed in the above
11. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
11.1 Land pattern designing
Recommended land patterns for reflow soldering are as follows:
These have been designed for Electric characteristics and solderability.
Please follow the recommended patterns. Otherwise, their performance which includes electrical performance
or solderability may be affected, or result to "position shift" in soldering process.
(in mm)
11.2 Flux, Solder
・Use rosin-based flux.
Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).
Don’t use water-soluble flux.
・Use Sn-3.0Ag-0.5Cu solder.
・Standard thickness of solder paste : 200μm to 300μm.
a 0.8
b 3.0
c 1.2
W
D
Label
H
a
b
c
Chip Coil
Solder resist
Land
Spec No. JELF243A-0038M-01 P.6/9
MURATA MFG.CO.,LTD
Reference
Only
11.3 Flow soldering / Reflow soldering conditions
・Pre-heating should be in such a way that the temperature difference between solder and product surface
is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the
temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality.
・Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
・Soldering profile
(1)Flow soldering profile
Standard Profile Limit Profile
Pre-heating 150℃、60s min.
Heating 250℃､4s～6s 265℃±3℃､5s
Cycle of flow 2 times 2 times
(2)Reflow soldering profile
Standard Profile Limit Profile
Pre-heating 150°C～180°C 、90s±30s
Heating above 220°C､30s～60s above 230°C､60s max.
Peak temperature 245°C±3°C 260°C,10s
Cycle of reflow 2 times 2 times
11.4 Reworking with soldering iron.
The following conditions must be strictly followed when using a soldering iron.
Pre-heating 150°C,1 min
Tip temperature 350°C max.
Soldering iron output 80W max.
Tip diameter Φ3mm max.
Soldering time 3(+1,-0)s
Times 2 times
Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the
crack on the products due to the thermal shock.
265℃±3℃
Heating Time
150
Limit Profile
Standard Profile
(s)Time.
Temp.
(℃)
60s min.
250℃
Limit Profile
Standard Profile
90s±30s
230℃
260℃
245℃±3℃
220℃
30s～60s
60s max.
180
150
Temp.
(s)
(℃)
Time.
P1-P3P4-P6P7-P9

LQW2BHN15NK13L

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Description:
Fixed Inductors 0805 15nH +/-10% Chip Inducto
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