LQW2BHN15NK13L Datasheet LQW2BHN21NK13L, LQW2BHN15NK13L, LQW2BHN18NK13L | P7-P9

Spec No. JELF243A-0038M-01 P.7/9

MURATA MFG.CO.,LTD

Reference

Only

11.5 Solder Volume

・Solder shall be used not to be exceed the upper limits as shown below.

・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.

Exceeding solder volume may cause the failure of mechanical or electrical performance.

1/3T≦t≦T

T : Lower flange thickness

11.6 Product’s location

The following shall be considered when designing and laying out P.C.B.'s.

(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to

warping the board.

［Products direction］

Products shall be located in the sideways

direction (Length:a＜b) to the mechanical

stress.

(2) Products location on P.C.B. separation

Products (A,B,C,D) shall be located carefully

so that products are not subject to the

mechanical stress due to warping the board.

Because they may be subjected the mechanical

stress in order of A＞C＞B  D.

11.7 Cleaning Conditions

Products shall be cleaned on the following conditions.

(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA.)

(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance

phenomenon at the mounted products and P.C.B.

Power : 20 W / l max. Frequency : 28kHz to 40kHz Time : 5 min max.

(3) Cleaner

1. Alcohol type cleaner

Isopropyl alcohol (IPA)

2. Aqueous agent

PINE ALPHA ST-100S

(4) There shall be no residual flux and residual cleaner after cleaning.

In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized

water in order to remove the cleaner.

(5) Other cleaning Please contact us.

11.8 Resin coating

The inductance value may change due to high cure-stress of resin to be used for coating/molding products.

An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin,

or operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine

by hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit.

So, please pay your careful attention when you select resin in case of coating/molding the products with the resin.

Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted

on your board.

Upper Limit

Recommendable

〈

Poor example

〉

〈

Good example

〉

Seam

Slit

Length:a



Spec No. JELF243A-0038M-01 P.8/9

MURATA MFG.CO.,LTD

Reference

Only

11.9 Caution for use

・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush , shall not be touched

to the winding portion to prevent the breaking of wire.

・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of

the core

11.10 Handling of a substrate

After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the

substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to

the substrate.

Excessive mechanical stress may cause cracking in the product.

Bending Twisting

11.11 Storage and Handing Requirements

(1) Storage period

Use the products within 12 months after delivered.

Solderability should be checked if this period is exceeded.

(2) Storage conditions

・Products should be stored in the warehouse on the following conditions.

Temperature : -10°C to 40°C

Humidity : 15% to 85% relative humidity No rapid change on temperature and humidity

The electrode of the products is coated with solder. Don't keep products in corrosive gases

such as sulfur,chlorine gas or acid, or it may cause oxidization of electrode, resulting in

poor solderability.

・Products should not be stored on bulk packaging condition to prevent the chipping of the

core and the breaking of winding wire caused by the collision between the products.

・Products should be stored on the palette for the prevention of the influence from humidity,

dust and so on.

・Products should be stored in the warehouse without heat shock, vibration, direct sunlight

and so on.

(3) Handling Condition

Care should be taken when transporting or handling product to avoid excessive vibration or

mechanical shock.

12. △

Notes

(1)Please make sure that your product has been evaluated in view of your specifications with our product being

mounted to your product.

(2)You are requested not to use our product deviating from the reference specifications.

(3)The contents of this reference specification are subject to change without advance notice.

Please approve our product specifications or transact the approval sheet for product specifications

before ordering.

Spec No. JELF243A-0038M-01 P.9/9

MURATA MFG.CO.,LTD

Reference

Only

(1) Residual elements and stray elements of test fixture can be described by F-parameter shown in following.

A B V

C D I

(2) The impedance of chip coil Zx and measured value Zm can be described by input/output current/voltage.

， I

(3) Thus,the relation between Zx and Zm is following;

Zm-β where, α= D / A =1

1-ZmΓ

β= B / D =Zsm-(1-Yom Zsm)Zss

Γ= C / A =Yom

Zsm:measured impedance of short chip

Zss:residual impedance of short chip (0.771nH)

Yom:measured admittance when opening the fixture

(4) Lx and Qx shall be calculated with the following equation.

Im(Zx) Im(Zx)

Lx :Inductance of chip coil

2πf ， Re(Zx) Qx:Q of chip coil

f :Measuring frequency

Zm=

Zx=



Lx=

Qx=

ProductTest fixtureTest Head

P1-P3 P4-P6 P7-P9

LQW2BHN15NK13L

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Fixed Inductors 0805 15nH +/-10% Chip Inducto

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LQW2BHN15NK13L

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