AD5532
Rev. D | Page 8 of 20
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C unless otherwise noted.
Table 5.
Parameter
1
Rating
V
DD
to AGND
−0.3 V to +17 V
V
SS
to AGND
+0.3 V to −17 V
AV
CC
to AGND, DAC_GND
−0.3 V to +7 V
DV
CC
to DGND
−0.3 V to +7 V
Digital Inputs to DGND
−0.3 V to DV
CC
+ 0.3 V
Digital Outputs to DGND
−0.3 V to DV
CC
+ 0.3 V
REF_IN to AGND, DAC_ GND
−0.3 V to AV
CC
+ 0.3 V
V
IN
to AGND, DAC_GND
−0.3 V to AV
CC
+ 0.3 V
V
OUT
0–31 to AGND
V
SS
− 0.3 V to V
DD
+ 0.3 V
OFFS_IN to AGND
V
SS
− 0.3 V to V
DD
+ 0.3 V
OFFS_OUT to AGND AGND - 0.3 V to AV
CC
+ 0.3 V
AGND to DGND
−0.3 V to +0.3 V
Operating Temperature Range
Industrial
−40°C to +85°C
Storage Temperature Range
−65°C to +150°C
Junction Temperature (T
J
max) 150°C
74-Lead CSPBGA Package,
θ
JA
Thermal Impedance
41°C/W
Reflow Soldering
Peak Temperature
AD5532ABC-x 220°C
AD5532ABCZ-x 260°C
Time at Peak Temperature 10 sec to 40 sec
Max Power Dissipation
(150°C − T
A
)/θ
JA
mW
2
Max Continuous Load Current at
T
J
= 70°C, per Channel Group
15 mA
3
1
Transient currents of up to 100 mA do not cause SCR latch-up.
2
This limit includes load power.
3
This maximum allowed continuous load current is spread over 8 channels
and channels are grouped as follows:
Group 1: Channels 3, 4, 5, 6, 7, 8, 9, 10
Group 2: Channels 14, 16, 18, 20. 21, 24, 25, 26
Group 3: Channels 15, 17, 19, 22, 23, 27, 28, 29
Group 4: Channels 0, 1, 2, 11, 12, 13, 30, 31
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
For higher junction temperatures derate as follows:
TJ (°C) Max Continuous Load Current per Group (mA)
70 15.5
90 9.025
100 6.925
110 5.175
125 3.425
135 2.55
150 1.5
ESD CAUTION