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HMC554ALC3B

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P26
10 GHz to 20 GHz, GaAs, MMIC,
Double Balanced Mixer
Data Sheet
HMC554ALC3B
Rev. 0 Document Feedback
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 ©2018 Analog Devices, Inc. All rights reserved.
Technical Support www.analog.com
FEATURES
Conversion loss: 8.5 dB
LO to RF Isolation: 37 dB
Input IP3: 20 dBm
RoHS compliant, 2.90 mm × 2.90 mm, 12-terminal LCC package
APPLICATIONS
Microwave and very small aperture terminal (VSAT) radios
Test equipment
Military electronic warfare (EW); electronic countermeasure
(ECM); and command, control, communications and
intelligence (C3I)
FUNCTIONAL BLOCK DIAGRAM
1
GND
7
GND
8
RF
9
GND
10
NIC
11
NIC
12
NIC
4
GND
2
LO
3
GND
5
IF
6
GND
PACKAGE
BASE
GND
HMC554ALC3B
13895-001
Figure 1.
GENERAL DESCRIPTION
The HMC554ALC3B is a general-purpose, double-balanced
mixer in a leadless RoHS compliant LCC package that can be
used as an upconverter or downconverter between 10 GHz and
20 GHz. This mixer is fabricated in a gallium arsenide (GaAs)
metal semiconductor field effect transistor (MESFET) process,
and requires no external components or matching circuitry. The
HMC554ALC3B provides excellent local osciallator (LO) to
radio frequency (RF) and LO to intermediate frequency (IF)
isolation due to optimized balun structures. The RoHS
compliant HMC554ALC3B eliminates the need for wire bonding,
and is compatible with high volume surface-mount manufacturing
techniques.
HMC554ALC3B Data Sheet
Rev. 0 | Page 2 of 26
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
Absolute Maximum Ratings ............................................................ 4
Thermal Resistance ...................................................................... 4
ESD Caution .................................................................................. 4
Pin Configuration and Function Descriptions ............................. 5
Interface Schematics..................................................................... 5
Typical Performance Characteristics ............................................. 6
Downconverter Performance, IF = 100 MHz ........................... 6
Downconverter Performance, IF = 3000 MHz ...................... 10
Upconverter Performance, IF
IN
= 100 MHz ........................... 13
Upconverter Performance, IF
IN
= 3000 MHz ......................... 16
Isolation and Return Loss ......................................................... 19
IF Bandwidth—Downconverter ............................................... 21
Spurious and Harmonics Performance ................................... 23
Theory of Operation ...................................................................... 24
Applications Information .............................................................. 25
Typical Application Circuit ....................................................... 25
Evaluation PCB Information .................................................... 25
Outline Dimensions ....................................................................... 26
Ordering Guide .......................................................................... 26
REVISION HISTORY
4/2018—Revisio
n 0: Initial Version
Data Sheet HMC554ALC3B
Rev. 0 | Page 3 of 26
SPECIFICATIONS
T
A
= 25°C, IF = 100 MHz, LO = 13 dBm, upper side band. All measurements performed as a downconverter, unless otherwise noted, on the
evaluation printed circuit board (PCB).
Table 1.
Parameter Symbol Min Typ Max Unit
FREQUENCY
RF Pin 10 20 GHz
IF Pin DC 6 GHz
LO Pin 10 20 GHz
LO AMPLITUDE 9 13 15 dBm
10 GHz to 20 GHz PERFORMANCE
Downconverter
Conversion Loss 8.5 11.5 dB
Single Sideband Noise Figure SSB NF 9.5 dB
Input Third-Order Intercept IP3 19 20 dBm
Input 1 dB Compression Point P1dB 21 dBm
Input Second-Order Intercept
IP2
46
Upconverter IF
IN
Conversion Loss 7 dB
Input Third-Order Intercept IP3 19.5 dBm
Input 1 dB Compression Point P1dB 10 dBm
Isolation
RF to IF
24
41
dB
LO to RF 25 37 dB
LO to IF 23 41 dB
12 GHz to 16 GHz PERFORMANCE
Downconverter
Conversion Loss 8 dB
Single Sideband Noise Figure SSB NF 9 dB
Input Third-Order Intercept IP3 16 19.5 dBm
Input 1 dB Compression Point
P1dB
20
Input Second-Order Intercept IP2 45 dBm
Upconverter IF
IN
Conversion Loss 6.5 dB
Input Third-Order Intercept IP3 18 dBm
Input 1 dB Compression Point P1dB 10 dBm
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P26

HMC554ALC3B

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