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HMC554ALC3B

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P26
HMC554ALC3B Data Sheet
Rev. 0 | Page 4 of 26
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
RF Input Power 25 dBm
LO Input Power
26 dBm
IF Input Power 25 dBm
IF Source/Sink Current 3 mA
Reflow Temperature 260°C
Maximum Junction Temperature 175°C
Continuous Power Dissipation, P
DISS
(T
A
= 85°C, Derate 3.7 mW/°C Above 85°C)
333 mW
Operating Temperature Range −40°C to +85°C
Storage Temperature Range −65°C to +150°C
Electrostatic Discharge (ESD) Sensitivity
Human Body Model (HBM) 250 V; Class 0B
Field Induced Charged Device Model
(FICDM)
1250 V; Class IV
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to PCB design and
operating environment. Careful attention to PCB thermal
design is required.
θ
JA
is the natural convection junction to ambient thermal
resistance measured in a one cubic foot sealed enclosure. θ
JC
is
the junction to case thermal resistance.
Table 3. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
E-12-4
1
120 195 °C/W
1
Test Condition 1: JEDEC standard JESD51-2.
ESD CAUTION
Data Sheet HMC554ALC3B
Rev. 0 | Page 5 of 26
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
1
GND
7
GND
8
RF
9
GND
10
NIC
11
NIC
12
NIC
4
GND
2
LO
3
GND
5
IF
6
GND
PACKAGE
BASE
GND
NOTES
1. NOT INTERNALLY CONNECTED. THESE PINS
CAN BE CONNECTED TO RF/DC GROUND.
PERFORMANCE IS NOT AFFECTED.
2. EXPOSED PAD. THE EXPOSED PAD MUST BE
CONNECTED TO RF/DC GROUND.
HMC554ALC3B
TOP VIEW
(Not to Scale)
13895-002
Figure 2. Pin Configuration
Table 4. Pin Function Descriptions
Pin No. Mnemonic Description
1, 3, 4, 6, 7, 9 GND Ground. These pins and package bottom must be connect to RF/dc ground.
2 LO Local Oscillator Port. This pin is ac-coupled and matched to 50 Ω.
5
IF
Intermediate Frequency Port. This pin is dc-coupled. For applications not requiring operation to dc, dc
block this port externally using a series capacitor of a value chosen to pass the necessary IF frequency
range. For operation to dc, this pin must not source/sink more than 3 mA of current or die malfunction
and possible die failure may result.
8 RF Radio Frequency Port. This pin is ac-coupled and matched to 50 Ω.
10, 11, 12 NIC Not Internally Connected. These pins can be connected to RF/dc ground. Performance is not affected.
EPAD
Exposed Pad. The exposed pad must be connected to RF/dc ground.
INTERFACE SCHEMATICS
GND
13895-003
Figure 3. GND Interface Schematic
LO
13895-004
Figure 4. LO Interface Schematic
IF
13895-005
Figure 5. IF Interface Schematic
RF
13895-006
Figure 6. RF Interface Schematic
HMC554ALC3B Data Sheet
Rev. 0 | Page 6 of 26
TYPICAL PERFORMANCE CHARACTERISTICS
DOWNCONVERTER PERFORMANCE, IF = 100 MHz
Upper Sideband (Low-Side LO)
–5
–14
–13
–12
–11
–10
–9
–8
–7
–6
10 11 12 13 14 15 16 17 18 19 20
CONVERSION GAIN (dB)
RF FREQUENCY
T
A
= +85°C
T
A
= +25°C
T
A
= –40°C
13895-007
Figure 7. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 13 dBm
10 11 12 13 14 15 16 17 18 19 20
RF FREQUENCY
T
A
= +85°C
T
A
= +25°C
T
A
= –40°C
30
25
0
5
10
15
20
INPUT IP3 (dBm)
13895-011
Figure 8. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
14
0
2
4
6
8
10
12
10 11 12 13 14 15 16 17 18 19 20
NOISE FIGURE (dB)
RF FREQUENCY
T
A
= +85°C
T
A
= +25°C
T
A
= –40°C
13895-009
Figure 9. Noise Figure vs. RF Frequency at Various Temperatures,
LO = 13 dBm
–5
–14
–13
–12
–11
–10
–9
–8
–6
–7
CONVERSION GAIN (dB)
10 11 12 13
14 15 16
17 18 19 20
RF FREQUENCY
LO = 15dBm
LO = 13dBm
LO = 11dBm
LO = 9dBm
13895-010
Figure 10. Conversion Gain vs. RF Frequency at Various LO Power Levels,
T
A
= 25°C
30
25
0
5
10
15
20
10 11 12 13 14 15 16 17 18 19 20
INPUT IP3 (dBm)
RF FREQUENCY
LO = 15dBm
LO = 13dBm
LO = 11dBm
LO = 9dBm
13895-008
Figure 11. Input IP3 vs. RF Frequency at Various LO Power Levels,
T
A
= 25°C
10 11 12 13 14 15 16 17 18 19 20
RF FREQUENCY
LO = 15dBm
LO = 13dBm
LO = 11dBm
LO = 9dBm
14
0
2
4
6
8
10
12
NOISE FIGURE (dB)
13895-012
Figure 12. Noise Figure vs. RF Frequency at Various LO Power Levels,
T
A
= 25°C
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P26

HMC554ALC3B

Mfr. #:
Buy HMC554ALC3B
Manufacturer:
Analog Devices Inc.
Description:
RF Mixer Mixers
Lifecycle:
New from this manufacturer.
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