Data Sheet HMC554ALC3B
Rev. 0 | Page 25 of 26
APPLICATIONS INFORMATION
TYPICAL APPLICATION CIRCUIT
Figure 84 shows the typical application circuit for the
HMC554ALC3B. The HMC554ALC3B is a passive device
and does not require any external components. The IF pin
is internally dc-coupled. The RF and LO pins are internally
ac-coupled. When IF operation to dc is not required, using an
external series capacitor is recommended, of a value chosen to
pass the necessary IF frequency range. When IF operation to dc
is required, do not exceed the IF source and sink current rating
specified in the Absolute Maximum Ratings section.
GND
GND
RF
GND
NIC
NIC
NIC
GND
LO
LO RF
IF
GND
IF
GND
HMC554ALC3B
1
7
8
9
101112
4
2
3
56
13895-084
Figure 84. Typical Application Circuit
EVALUATION PCB INFORMATION
Use RF circuit design techniques for the circuit board used in
the application. Ensure that signal lines have 50 Ω impedance,
and connect the package ground leads and the exposed pad
directly to the ground plane (see Figure 84). Use a sufficient
number of via holes to connect the top and bottom ground
planes. The evaluation circuit board shown in Figure 85 is
available from Analog Devices, Inc., upon request.
Table 7. List of Materials for Evaluation PCB
EV1HMC554ALC3B
Item Description
J1, J2 PCB mount SRI 2.92 mm connectors
J3 PCB mount Johnson SMA connector
U1 HMC554ALC3B
PCB
1
117611-1 evaluation board on Rogers 4350
1
117611-1 is the raw bare PCB identifier. Reference EV1HMC554ALC3B when
ordering complete evaluation PCB.
J1
J3
IF
LO RF
117611–1
U1
J2
554A
13895-085
Figure 85. Evaluation PCB Top Layer
