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FIGURE 24. tpdR vs V
DD
FIGURE 25. tpdF vs V
DD
FIGURE 26. tpdR vs V
H
FIGURE 27. tpdF vs V
H
FIGURE 28. tSkewR vs TEMPERATURE FIGURE 29. tSkewF vs TEMPERATURE
Typical Performance Curves (See Typical Performance Curves Discussion” on page 11) (Continued)
20
18
16
14
12
10
8
6
4
2
0
2.5 3.5 5.5
V
DD
(V)
PROPAGATION DELAY (ns)
V
H
= 12.0V
4.5
1000pF
100pF/1k
20
18
16
14
12
10
8
6
4
2
0
36 12
V
H
(V)
PROPAGATION DELAY (ns)
V
DD
= 3.3V
9
1000pF
100pF/1k
20
18
16
14
12
10
8
6
4
2
0
36 12
V
H
(V)
PROPAGATION DELAY (ns)
V
DD
= 3.3V
9
1000pF
100pF/1k
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
-40 -10 +20 +50 +85
PACKAGE TEMP (°C)
tSkewR (ns)
330pF
680pF
V
DD
= 3.6V
V
H
= 12.0V
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
-40 -10 +20 +50 +85
PACKAGE TEMP (°C)
tSkewF (ns)
330pF
680pF
V
DD
= 3.6V
V
H
= 12.0V
ISL55110, ISL55111
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Typical Performance Curves
Discussion
r
ON
The r
ON
source is tested by placing the device in constant drive
high condition and connecting a -50mA constant current
source to the driver output. The voltage drop is measured from
V
H
to driver output for r
ON
calculations.
The r
ON
sink is tested by placing the device in constant driver
low condition and connecting a +50mA constant current
source. The voltage drop from driver out to ground is measured
for r
ON
calculations.
Dynamic Tests
All dynamic tests are conducted with ISL55110 and ISL55111
evaluation board(s) (ISL55110_11EVAL2Z). Driver loads are
soldered to the evaluation board. Measurements are collected
with P6245 active FET Probes and TDS5104 oscilloscope.
Pulse stimulus is provided by HP8131 pulse generator.
The ISL55110 and ISL55111 evaluation boards provide test
point fields for leadless connection to either an active FET
probe or differential probe. “TP - IN_A/_B” test points are used
for monitoring pulse input stimulus. “TP - OA/OB” allows
monitoring of driver output waveforms. C
6
and C
7
are the
usual placement for driver loads. R
3
and R
4
are not populated
and are provided for user-specified, more complex load
characterization.
Pin Skew
Pin skew measurements are based on the difference in
propagation delay of the two channels. Measurements are
made on each channel from the 50% point on the stimulus
point to the 50% point on the driver output. The difference in
the propagation delay for Channel A and Channel B is
considered to be skew.
Both rising propagation delay and falling propagation delay are
measured and report as tSkewR and tSkewF.
50MHz Tests
50MHz Tests reported as no load actually include evaluation
board parasitics and a single TEK 6545 FET probe. However, no
driver load components are installed and C
6
through C
9
and
R
3
through R
6
are not populated.
FIGURE 30. tSkewR vs V
DD
FIGURE 31. tSkewF vs V
DD
FIGURE 32. tSkewR vs V
H
FIGURE 33. tSkewF vs V
H
Typical Performance Curves (See Typical Performance Curves Discussion” on page 11) (Continued)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
2.5 3.5 5.5
V
DD
(V)
SKEW (ns)
V
H
= 12.0V
4.5
330pF
680pF
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
2.5 3.5 5.5
V
DD
(V)
SKEW (ns)
V
H
= 12.0V
4.5
680pF
330pF
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
36 12
V
H
(V)
SKEW (ns)
V
DD
= 3.3V
9
680pF
330pF
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
36 12
V
H
(V)
SKEW (ns)
V
DD
= 3.3V
9
330pF
680pF
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General
The most dynamic measurements are presented in three
ways:
1. Over-temperature with a V
DD
of 3.6V and V
H
of 12V.
2. At ambient with V
H
set to 12V and V
DD
data points of 2.5V,
3.5V, 4.5V and 5.50V.
3. The ambient tests are repeated with V
DD
of 3.3V and V
H
data points of 3V, 6V, 9V and 12V.
FIGURE 34. ISL55110_11EVAL2Z (QFN) EVALUATION BOARD

ISL55110IVZ-T7A

Mfr. #:
Manufacturer:
Renesas / Intersil
Description:
Gate Drivers ULTRASOUND DRVR IN 8LD
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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