ISL55110, ISL55111
4
FN6228.8
January 29, 2015
Submit Document Feedback
Absolute Maximum Ratings (T
A
= +25°C) Thermal Information
V
H
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14.0V
V
DD
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.5V
VIN-A, VIN-B, PD, ENABLE
. . . . . . . . . . . . . . . . (GND - 0.5V) to (V
DD
+ 0.5V)
OA, OB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (GND - 0.5) to (VH + 0.5V)
Maximum Peak Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300mA
ESD Rating
Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3kV
Recommended Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C
Drive Supply Voltage (V
H
) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5V to 13.2V
Logic Supply Voltage (V
DD)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.7V to 5.5V
Ambient Temperature (T
A
) . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C
Junction Temperature (T
J
) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +150°C
Thermal Resistance
JA
(°C/W)
JC
(°C/W)
16 Ld (4x4) QFN Package (Notes 5
, 6) . . . 45 3.0
8 Ld TSSOP Package (Notes 4
, 7) . . . . . . . 140 46
Maximum Junction Temperature (Plastic Package) . . . . . . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . . . . . . . . . -65°C to +150°C
Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see TB493
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product
reliability and result in failures not covered by warranty.
NOTES:
4.
JA
is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
5.
JA
is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech
Brief TB379
.
6. For
JC
, the “case temp” location is the center of the exposed metal pad on the package underside.
7. Fo r
JC
, the “case temp” location is taken at the package top center.
IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typical values are for information purposes only. Unless otherwise
noted, all tests are at the specified temperature and are pulsed tests, therefore: T
J
= T
C
= T
A
DC Electrical Specifications V
H
= +12V, V
DD
= 2.7V to 5.5V, T
A
= +25°C, unless otherwise specified.
PARAMETER DESCRIPTION TEST CONDITIONS
MIN
(Note 8)TYP
MAX
(Note 8)UNITS
LOGIC CHARACTERISTICS
VIX_LH Logic Input Threshold - Low-to-High l
IH
= 1µA: VIN-A, VIN-B 1.32 1.42 1.52 V
VIX_HL Logic Input Threshold - High-to-Low l
IL
= 1µA: VIN-A, VIN-B 1.12 1.22 1.32 V
VHYS Logic Input Hysteresis VIN-A, VIN-B 0.2 V
VIH Logic Input High Threshold PD 2.0 VDD V
VIL Logic Input Low Threshold PD 0 0.8 V
VIH Logic Input High Threshold ENABLE
- QFN only 2.0 VDD V
VIL Logic Input Low Threshold ENABLE
- QFN only 0 0.8 V
IIX_H Input Current Logic High VIN-A, VIN-B = VDD 10 20 nA
IIX_L Input Current Logic Low VIN-A, VIN-B = 0V 10 20 nA
II_H Input Current Logic High PD = VDD 10 20 nA
II_L Input Current Logic Low PD = 0V 10 15 nA
II_H Input Current Logic High ENABLE
= VDD (QFN only) 12 µA
II_L Input Current Logic Low ENABLE
= 0V (QFN only) -25 nA
DRIVER CHARACTERISTICS
r
DS
Driver Output Resistance OA, OB 3 6 Ω
I
DC
Driver Output DC Current (>2s) 100 mA
I
AC
Peak Output Current Design Intent; verified via
simulation.
3.5 A
VOH to VOL Driver Output Swing Range OA or OB = “1”, voltage
referenced to GND
313.2V
