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AMMC-2008-W50

P1-P3P4-P6P7-P7
4
AMMC-2008 Typical Scattering Parameters
[1]
(T
chuck
= 25°C, V
sel1
= -3 V, V
sel2
= 0 V)
RF Out1: OFF (terminated in 50-ohms), RF Out2: ON
Freq. S
11
S
21
S
12
S
22
GHz dB Mag Phase dB Mag Phase dB Mag Phase dB Mag Phase
1 -16.23 0.154 -8 -1.66 0.826 -3 -1.64 0.828 -3 -16.34 0.152 -10
2 -16.65 0.147 -12 -1.71 0.821 -5 -1.71 0.821 -5 -16.72 0.146 -17
3 -16.83 0.144 -14 -1.73 0.820 -7 -1.72 0.821 -7 -16.91 0.143 -22
4 -17.01 0.141 -18 -1.74 0.819 -9 -1.72 0.820 -9 -17.03 0.141 -29
5 -17.23 0.138 -22 -1.74 0.818 -11 -1.73 0.819 -12 -17.09 0.140 -35
6 -17.38 0.135 -24 -1.72 0.821 -13 -1.70 0.822 -13 -17.34 0.136 -40
7 -17.47 0.134 -28 -1.69 0.823 -16 -1.68 0.824 -16 -17.21 0.138 -46
8 -17.66 0.131 -32 -1.66 0.826 -18 -1.65 0.827 -18 -17.23 0.138 -52
9 -17.96 0.127 -35 -1.62 0.830 -20 -1.65 0.827 -21 -17.44 0.134 -58
10 -18.17 0.123 -37 -1.59 0.833 -23 -1.60 0.831 -23 -17.46 0.134 -61
11 -18.41 0.120 -42 -1.60 0.832 -25 -1.62 0.830 -25 -17.34 0.136 -68
12 -18.84 0.114 -44 -1.66 0.826 -27 -1.63 0.829 -28 -17.71 0.130 -73
13 -18.72 0.116 -45 -1.57 0.835 -30 -1.57 0.834 -30 -17.60 0.132 -76
14 -19.23 0.109 -49 -1.59 0.833 -32 -1.60 0.832 -33 -17.66 0.131 -83
15 -19.04 0.112 -51 -1.50 0.842 -35 -1.54 0.837 -35 -17.53 0.133 -84
16 -19.14 0.110 -56 -1.46 0.845 -37 -1.51 0.841 -37 -17.31 0.136 -89
17 -19.49 0.106 -60 -1.50 0.841 -40 -1.52 0.840 -40 -17.48 0.134 -96
18 -19.62 0.105 -65 -1.56 0.836 -43 -1.47 0.845 -43 -17.21 0.138 -99
19 -19.95 0.101 -68 -1.56 0.835 -45 -1.52 0.839 -45 -17.22 0.138 -104
20 -20.35 0.096 -71 -1.48 0.843 -48 -1.54 0.838 -48 -17.16 0.139 -109
21 -20.25 0.097 -75 -1.47 0.844 -50 -1.51 0.840 -50 -17.16 0.139 -113
22 -20.49 0.095 -80 -1.49 0.842 -53 -1.53 0.838 -53 -17.11 0.139 -118
23 -20.88 0.090 -83 -1.51 0.840 -55 -1.54 0.837 -56 -16.98 0.142 -122
24 -21.54 0.084 -88 -1.57 0.835 -58 -1.58 0.833 -58 -16.96 0.142 -126
25 -21.60 0.083 -93 -1.57 0.834 -61 -1.56 0.836 -60 -16.96 0.142 -131
26 -21.64 0.083 -98 -1.55 0.837 -63 -1.51 0.840 -63 -16.88 0.143 -135
27 -21.32 0.086 -100 -1.59 0.832 -66 -1.51 0.841 -66 -16.92 0.143 -140
28 -21.58 0.083 -108 -1.55 0.837 -68 -1.54 0.837 -68 -16.82 0.144 -144
29 -22.10 0.079 -113 -1.58 0.833 -71 -1.58 0.833 -71 -16.83 0.144 -149
30 -22.02 0.079 -120 -1.58 0.833 -74 -1.61 0.831 -73 -16.81 0.144 -155
31 -22.09 0.079 -127 -1.63 0.829 -76 -1.55 0.836 -76 -16.83 0.144 -160
32 -21.66 0.083 -131 -1.75 0.818 -79 -1.53 0.839 -79 -16.84 0.144 -166
33 -21.85 0.081 -139 -1.64 0.828 -81 -1.62 0.830 -82 -16.82 0.144 -168
34 -22.36 0.076 -146 -1.58 0.834 -84 -1.64 0.828 -84 -16.83 0.144 -174
35 -21.91 0.080 -156 -1.60 0.832 -87 -1.64 0.828 -87 -16.75 0.145 180
36 -21.19 0.087 -162 -1.66 0.826 -90 -1.63 0.829 -90 -16.74 0.146 174
37 -20.74 0.092 -168 -1.67 0.825 -93 -1.64 0.828 -93 -16.67 0.147 166
38 -20.81 0.091 -174 -1.67 0.825 -94 -1.63 0.829 -95 -16.78 0.145 161
39 -20.63 0.093 175 -1.69 0.823 -98 -1.63 0.829 -98 -16.68 0.147 154
40 -19.95 0.101 165 -1.69 0.823 -101 -1.65 0.827 -101 -16.80 0.145 145
41 -19.16 0.110 162 -1.75 0.818 -104 -1.68 0.824 -104 -16.84 0.144 138
42 -19.26 0.109 158 -1.67 0.825 -107 -1.75 0.817 -107 -17.08 0.140 129
43 -19.29 0.108 153 -1.63 0.828 -110 -1.78 0.815 -110 -17.13 0.139 122
44 -19.00 0.112 144 -1.58 0.833 -113 -1.75 0.818 -113 -17.32 0.136 115
45 -18.09 0.125 137 -1.97 0.797 -117 -1.75 0.817 -116 -17.20 0.138 105
46 -17.09 0.140 137 -2.01 0.793 -119 -1.89 0.805 -119 -17.04 0.141 96
47 -17.08 0.140 134 -1.81 0.812 -121 -1.96 0.798 -123 -17.23 0.138 88
48 -16.94 0.142 128 -1.62 0.830 -124 -2.00 0.795 -125 -17.59 0.132 81
49 -16.32 0.153 122 -1.71 0.821 -129 -1.96 0.798 -127 -17.23 0.138 75
50 -15.74 0.163 115 -1.81 0.812 -134 -1.87 0.807 -131 -16.86 0.144 63
Note:
1. Data obtained from on-wafer measurements.
5
AMMC-2008 Typical Scattering Parameters
[1]
(T
chuck
= 25°C, V
sel1
= 0V, V
sel2
= -3V)
RF Out1: ON, RF Out2: OFF (terminated in 50-ohms)
Freq. S
11
S
21
S
12
S
22
GHz dB Mag Phase dB Mag Phase dB Mag Phase dB Mag Phase
1 -15.47 0.168 -7 -53.97 0.002 94 -54.90 0.002 102 -4.66 0.585 178
2 -15.80 0.162 -14 -49.29 0.003 90 -49.25 0.003 90 -4.63 0.587 176
3 -16.20 0.155 -19 -45.20 0.005 86 -45.17 0.006 84 -4.58 0.590 174
4 -16.77 0.145 -24 -42.97 0.007 79 -43.04 0.007 78 -4.52 0.594 172
5 -17.21 0.138 -26 -41.36 0.009 73 -41.65 0.008 73 -4.44 0.600 170
6 -17.29 0.137 -28 -39.87 0.010 74 -39.74 0.010 73 -4.36 0.605 167
7 -17.22 0.138 -32 -38.16 0.012 65 -38.21 0.012 65 -4.29 0.610 165
8 -17.78 0.129 -38 -38.42 0.012 60 -38.37 0.012 61 -4.22 0.615 162
9 -18.23 0.123 -39 -37.60 0.013 58 -37.43 0.013 60 -4.15 0.620 159
10 -17.84 0.128 -40 -37.25 0.014 58 -36.97 0.014 58 -4.09 0.624 157
11 -17.76 0.129 -51 -36.70 0.015 52 -36.70 0.015 53 -4.04 0.628 154
12 -18.94 0.113 -59 -36.35 0.015 54 -36.50 0.015 54 -4.00 0.631 151
13 -20.14 0.098 -54 -36.41 0.015 53 -36.33 0.015 53 -3.97 0.633 148
14 -19.90 0.101 -51 -36.38 0.015 54 -36.31 0.015 54 -3.96 0.634 145
15 -18.88 0.114 -54 -35.72 0.016 47 -35.32 0.017 47 -3.94 0.635 142
16 -18.46 0.119 -65 -35.61 0.017 42 -35.49 0.017 44 -3.95 0.635 139
17 -18.70 0.116 -77 -35.90 0.016 42 -35.62 0.017 44 -3.95 0.635 136
18 -19.74 0.103 -87 -36.35 0.015 42 -36.51 0.015 40 -3.96 0.634 133
19 -21.80 0.081 -97 -37.22 0.014 46 -37.14 0.014 44 -3.99 0.632 130
20 -25.02 0.056 -90 -37.44 0.013 48 -37.33 0.014 48 -4.01 0.630 127
21 -23.45 0.067 -73 -37.49 0.013 47 -37.13 0.014 50 -4.03 0.629 124
22 -21.47 0.084 -82 -37.20 0.014 49 -37.01 0.014 50 -4.07 0.626 122
23 -21.65 0.083 -96 -38.25 0.012 52 -38.04 0.013 52 -4.11 0.623 119
24 -22.59 0.074 -106 -38.34 0.012 60 -38.34 0.012 59 -4.17 0.619 116
25 -22.63 0.074 -115 -38.35 0.012 68 -38.11 0.012 66 -4.17 0.619 113
26 -23.52 0.067 -132 -37.89 0.013 75 -37.42 0.013 74 -4.22 0.615 110
27 -27.01 0.045 -138 -36.88 0.014 83 -36.76 0.015 82 -4.26 0.613 107
28 -28.96 0.036 -108 -36.46 0.015 82 -36.14 0.016 82 -4.27 0.612 105
29 -24.73 0.058 -108 -35.27 0.017 84 -35.25 0.017 83 -4.31 0.609 101
30 -23.06 0.070 -137 -35.16 0.017 87 -35.00 0.018 86 -4.33 0.607 99
31 -23.94 0.064 -161 -34.51 0.019 93 -34.27 0.019 91 -4.37 0.605 96
32 -25.49 0.053 -167 -33.58 0.021 99 -33.56 0.021 91 -4.38 0.604 93
33 -25.94 0.050 180 -32.38 0.024 98 -32.74 0.023 95 -4.43 0.601 90
34 -28.94 0.036 152 -31.34 0.027 93 -31.68 0.026 94 -4.45 0.599 87
35 -40.23 0.010 119 -31.18 0.028 95 -31.04 0.028 96 -4.49 0.596 84
36 -27.64 0.041 -114 -30.30 0.031 95 -30.18 0.031 94 -4.52 0.594 81
37 -21.32 0.086 -148 -29.79 0.032 96 -29.50 0.034 91 -4.52 0.594 78
38 -20.15 0.098 175 -28.94 0.036 92 -29.27 0.034 90 -4.58 0.590 75
39 -22.12 0.078 144 -28.77 0.036 96 -28.93 0.036 93 -4.58 0.590 73
40 -24.36 0.061 144 -28.03 0.040 92 -28.05 0.040 91 -4.57 0.591 69
41 -21.84 0.081 155 -27.57 0.042 94 -27.62 0.042 91 -4.61 0.588 66
42 -21.32 0.086 140 -26.55 0.047 91 -26.98 0.045 91 -4.62 0.588 63
43 -24.37 0.060 129 -26.08 0.050 87 -26.38 0.048 90 -4.64 0.586 61
44 -24.69 0.058 147 -25.07 0.056 83 -25.67 0.052 87 -4.70 0.582 57
45 -19.69 0.104 143 -26.09 0.050 84 -25.23 0.055 85 -4.68 0.583 54
46 -17.83 0.128 129 -25.55 0.053 86 -25.02 0.056 83 -4.65 0.586 52
47 -19.34 0.108 122 -23.64 0.066 86 -24.44 0.060 81 -4.67 0.584 49
48 -20.09 0.099 122 -22.36 0.076 81 -24.04 0.063 79 -4.68 0.583 46
49 -19.24 0.109 117 -22.70 0.073 74 -23.62 0.066 79 -4.70 0.582 43
50 -19.75 0.103 114 -22.76 0.073 66 -23.00 0.071 76 -4.66 0.585 39
Note:
1. Data obtained from on-wafer measurements.
6
Figure 9. AMMC-2008 Schematic.
Mesh can be attached using a 2 mil round tracking tool
and a tool force of approximately 22 grams with an ultra-
sonic power of roughly 55 dB for a duration of 76 ± 8 mS.
A guided wedge at an ultrasonic power level of 64 dB can
be used for the 0.7 mil wire. The recommended wire bond
stage temperature is 150 ± 2°C.
The chip is 100 mm thick and should be handled with
care.
This MMIC has exposed air bridges on the top surface.
Handle at edges or with a custom collet (do not pick up
die with vacuum on die center.)
This MMIC is also static sensitive and ESD handling precau-
tions should be taken.
For more information, see Avago Application Note 5228
Notes:
1. Ablebond 84-1 LM1 silver epoxy is recommended.
2. Eutectic attach is not recommended and may jeopardize reliability
of the device.
Recommended Operation Conditions
V
sel1
V
sel2
RF Out1 RF Out2
0.6 > 0 > -0.4 -3.5 > -3>-2.5 ON OFF
-3.5>-3>-2.5 0.6>0>-0.4 OFF ON
0.6>0>-0.4 0.6>0>-0.4 OFF OFF
-3.5>-3>-2.5 -3.5>-3>-2.5 OFF OFF
Figure 10. Biasing Diagram.
RF
Output 1
RF
Input
RF
Output 2
Vsel 2 Vsel 1
RF Input
RF Out
p
ut 1
RF Output 2
Vsel 1
Vsel
2
Operation
The RF Input and Output ports may be DC or AC-coupled.
If DC-coupled, the voltages on the Input and Output
ports must be 0 ± 0.25 volts for guaranteed switch per-
formance.
Assembly Techniques
The chip should be attached directly to the ground plane
using electrically conductive epoxy
[1,2]
. For conductive
epoxy, the amount should be just enough to provide a thin
llet around the bottom perimeter of the die. The ground
plane should be free of any residue that may jeopardize
electrical or mechanical attachment. Caution should be
taken to not exceed the Absolute Maximum Rating for
assembly temperature and time.
Thermosonic wedge bonding is the preferred method for
wire attachment to the bond pads. The RF connections
should be kept as short as possible to minimize induc-
tance. Gold mesh or double-bonding with 0.7 mil gold
wire is recommended.
P1-P3P4-P6P7-P7

AMMC-2008-W50

Mfr. #:
Buy AMMC-2008-W50
Manufacturer:
Broadcom / Avago
Description:
RF Switch ICs Switch GaAs SPDT
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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