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AMMC-2008-W50
P1-P3
P4-P6
P7-P7
Figure 11. Chip
Bias/RF
Bond Pad Locations. (dimensions
in micrometers)
Figure 12. Chip
Assembly
Diagram.
630
545
100
285
RF_I
RF_01
Vsel2
Vsel1
RF_02
285
834
465
96
930
265
665
RF
IN
RF
OUT1
RF
OUT2
V
SEL1
V
SEL2
RF_01
RF_1
RF_02
>68 pF
Chip
Capacitor
Ordering Information
AMMC-2008-W10 = 10 devices per tr
ay
AMMC-2008-W50 = 50 devices per tr
ay
For pr
oduct information and a complete list of distributors, please go t
o our web site:
ww
w
.avagotech.com
Av
ago
, Avago
T
echnologies, and the A logo ar
e trademarks of Av
ago T
echnologies Limited in the United States and other coun
tries.
Data subject to change. C
opyright © 2005-2008 A
vago
T
echnologies Limited. All rights reserved.
Obsoletes 5989-3928EN
A
V02-1260EN - June 23, 2008
P1-P3
P4-P6
P7-P7
AMMC-2008-W50
Mfr. #:
Buy AMMC-2008-W50
Manufacturer:
Broadcom / Avago
Description:
RF Switch ICs Switch GaAs SPDT
Lifecycle:
New from this manufacturer.
Delivery:
DHL
FedEx
Ups
TNT
EMS
Payment:
T/T
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Union
Products related to this Datasheet
AMMC-2008-W50
AMMC-2008-W10