4
IXD611
IXYS reserves the right to change limits, test conditions, and dimensions.
Symbol Definition Min Max Units
V
HS
High side floating supply offset voltage -200 650 V
V
CH
High side floating absolute voltage -0.3 35 V
V
HGO
High side floating output voltage V
HS
- 0.3 V
CH
+ 0.3 V
V
CL
Low side fixed supply voltage -0.3 35 V
V
LGO
Low side output voltage -0.3 V
CL
+ 0.3 V
V
DG
Logic supply offset voltage (P7, S7 only) V
LS
- 0.7 V
LS
+ 0.7 V
V
IN
Logic input voltage(HIN & LIN) LS - 0.3 V
CL
+ 0.3 V
dV
HS
/dt Allowable offset supply voltage transient 50 V/ns
P
D
Package power dissipation@ T
A
≤ 25C 8 pin PDIP 1.0 W
8 pin SOIC 0.625 W
14 pin PDIP 1.6 W
14 pin SOIC 1.0 W
R
THJA
Thermal resistance, junction-to-ambient 8 pin PDIP 125
o
C/W
8 pin SOIC 200
o
C/W
14 pin PDIP 75
o
C/W
14 pin SOIC 120
o
C/W
T
J
Junction Temperature 150
o
C
T
S
Storage temperature -55 150
o
C
T
L
Lead temperature (soldering, 10 s) 300
o
C
Absolute Maximum Ratings
Recommended Operating Conditions
Symbol Definition Min Max Units
V
HS
High side floating supply offset voltage -200 600 V
V
CH
High side floating supply absolute voltage 10 30 V
V
HGO
High side floating output voltage V
HS
V
CH
V
V
CL
Low side fixed supply voltage 10 30 V
V
LGO
Low side output voltage 0 V
CL
V
V
DG
Logic supply offset voltage (P7, S7 only) V
LS
- 0.3 V
LS
+ 0.3 V
V
IN
Logic input voltage(HIN, LIN) V
DG
or LS V
CL
V
T
A
Ambient Temperature -40 125
o
C