MT5VDDT1672AY-335K1

PDF: 09005aef808143d9/Source: 09005aef806e1c40 Micron Technology, Inc., reserves the right to change products or specifications without notice.
DD5C8_16_32x72A.fm - Rev. F 10/07 EN
10 ©2002 Micron Technology, Inc. All rights reserved.
64MB, 128MB, 256MB (x72, ECC, SR) 184-Pin DDR SDRAM UDIMM
Electrical Specifications
Table 12: IDD Specifications and Conditions – 256MB
Values are shown for the MT46V32M16 DDR SDRAM only and are computed from values specified in the
512Mb (32 Meg x 16) component data sheet
Parameter/Condition Symbol -40B -335 -265 Units
Operating one bank active-precharge current:
t
RC =
t
RC (MIN);
t
CK =
t
CK (MIN); DQ, DM, and DQS inputs changing once per clock cycle;
Address and control inputs changing once every two clock cycles
IDD0 775 650 575 mA
Operating one bank active-read-precharge current: BL = 2;
t
RC =
t
RC (MIN);
t
CK =
t
CK (MIN); IOUT = 0mA; Address and control inputs
changing once per clock cycle
IDD1 975 800 725 mA
Precharge power-down standby current: All device banks idle; Power-
down mode;
t
CK =
t
CK (MIN); CKE = LOW
IDD2P 25 25 25 mA
Idle standby current: CS# = HIGH; All device banks idle;
t
CK =
t
CK (MIN);
CKE = HIGH; Address and other control inputs
changing once per clock
cycle; V
IN
=V
REF
for DQ, DQS, and DM
IDD2F 275 225 200 mA
Active power-down standby current: One device bank active; Power-
down mode;
t
CK =
t
CK (MIN); CKE = LOW
IDD3P 225 175 150 mA
Active standby current: CS# = HIGH; CKE = HIGH; One device bank
active;
t
RC =
t
RAS (MAX);
t
CK =
t
CK (MIN); DQ, DM, and DQS inputs
changing twice per clock cycle; Address and other control inputs changing
once per clock cycle
IDD3N 300 250 225 mA
Operating burst read current: BL = 2; Continuous burst reads; One
device bank active; Address and control inputs changing once per clock
cycle;
t
CK =
t
CK (MIN); IOUT =0mA
IDD4R 1,050 825 725 mA
Operating burst write current: BL = 2; Continuous burst writes; One
device bank active; Address and control inputs changing once per clock
cycle;
t
CK =
t
CK (MIN); DQ, DM, and DQS inputs changing twice per clock
cycle
IDD4W 1,075 975 675 mA
Auto refresh current
t
REFC =
t
RFC (MIN)
IDD5 1,725 1,450 1,400 mA
t
REFC = 7.8125µs
IDD5A 55 50 50 mA
Self refresh current: CKE 0.2V
IDD6302525mA
Operating bank interleave read current: Four device bank interleaving
reads; BL = 4 with auto precharge;
t
RC =
t
RC (MIN);
t
CK =
t
CK (MIN);
Address and control inputs change only during active READ or WRITE
commands
IDD7 2,400 2,025 1,750 mA
PDF: 09005aef808143d9/Source: 09005aef806e1c40 Micron Technology, Inc., reserves the right to change products or specifications without notice.
DD5C8_16_32x72A.fm - Rev. F 10/07 EN
11 ©2002 Micron Technology, Inc. All rights reserved.
64MB, 128MB, 256MB (x72, ECC, SR) 184-Pin DDR SDRAM UDIMM
Serial Presence-Detect
Serial Presence-Detect
Notes: 1. To avoid spurious start and stop conditions, a minimum delay is placed between SCL = 1 and
the falling or rising edge of SDA.
2. This parameter is sampled.
3. For a restart condition or following a WRITE cycle.
4. The SPD EEPROM WRITE cycle time (
t
WRC) is the time from a valid stop condition of a write
sequence to the end of the EEPROM internal ERASE/PROGRAM cycle. During the WRITE
cycle, the EEPROM bus interface circuit is disabled, SDA remains HIGH due to pull-up resis-
tance, and the EEPROM does not respond to its slave address.
Serial Presence-Detect Data
For the latest serial presence-detect data, refer to Microns SPD page:
www.micron.com/SPD.
Table 13: Serial Presence-Detect EEPROM DC Operating Conditions
Parameter/Condition Symbol Min Max Units
Supply voltage
V
DDSPD 2.3 3.6 V
Input high voltage: Logic 1; All inputs
V
IH VDDSPD × 0.7 VDDSPD + 0.5 V
Input low voltage: Logic 0; All inputs
V
IL –1.0 VDDSPD × 0.3 V
Output low voltage: I
OUT = 3mA
VOL –0.4V
Input leakage current: V
IN = GND to VDD
ILI –10µA
Output leakage current: V
OUT = GND to VDD
ILO –10µA
Standby current: SCL = SDA = V
DD - 0.3V; All other inputs = VSS or VDD
ISB –30µA
Power supply current: SCL clock frequency = 100 kHz
I
CC –2.0mA
Table 14: Serial Presence-Detect EEPROM AC Operating Conditions
Parameter/Condition Symbol Min Max Units Notes
SCL LOW to SDA data-out valid
t
AA 0.2 0.9 µs 1
Time the bus must be free before a new transition can start
t
BUF 1.3 µs
Data-out hold time
t
DH 200 ns
SDA and SCL fall time
t
F 300 ns 2
Data-in hold time
t
HD:DAT 0 µs
Start condition hold time
t
HD:STA 0.6 µs
Clock HIGH period
t
HIGH 0.6 µs
Noise suppression time constant at SCL, SDA inputs
t
I–50ns
Clock LOW period
t
LOW 1.3 µs
SDA and SCL rise time
t
R–0.3µs2
SCL clock frequency
f
SCL 400 kHz
Data-in setup time
t
SU:DAT 100 ns
Start condition setup time
t
SU:STA 0.6 µs 3
Stop condition setup time
t
SU:STO 0.6 µs
WRITE cycle time
t
WRC 10 ms 4
®
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
prodmktg@micron.com www.micron.com Customer Comment Line: 800-932-4992
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of
their respective owners.
This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth
herein. Although considered final, these specifications are subject to change, as further product development and data
characterization sometimes occur.
64MB, 128MB, 256MB (x72, ECC, SR) 184-Pin DDR SDRAM UDIMM
Module Dimensions
PDF: 09005aef808143d9/Source: 09005aef806e1c40 Micron Technology, Inc., reserves the right to change products or specifications without notice.
DD5C8_16_32x72A.fm - Rev. F 10/07 EN
12 ©2002 Micron Technology, Inc. All rights reserved.
Module Dimensions
Figure 3: 184-Pin DDR UDIMM
Notes: 1. All dimensions are in millimeters (inches); MAX/MIN or typical (TYP) where noted.
2. The dimensional diagram is for reference only. Refer to the JEDEC MO document for addi-
tional design dimensions.
U1
U2
U4 U5
U6
No components this side of module
31.90 (1.256)
31.60 (1.244)
17.78 (0.70)
TYP
2.0 (0.079) R
(4X)
Pin 92
Front view
Back view
1.37 (0.054)
1.17 (0.046)
133.50 (5.256)
133.20 (5.244)
10.0 (0.394)
TYP
3.18 (0.125)
MAX
U3
Pin 1
2.5 (0.098) D
(2X)
2.31 (0.091) TYP
6.35 (0.25) TYP
120.65 (4.75)
1.27 (0.05)
TYP
2.21 (0.087) TYP
1.02 (0.04)
TYP
0.9 (0.035) R
64.77 (2.55)
TYP
49.53 (1.95)
TYP
Pin 184
Pin 93
1.0 (0.039) TYP
73.28 (2.88)
TYP
3.8 (0.15) TYP

MT5VDDT1672AY-335K1

Mfr. #:
Manufacturer:
Micron
Description:
MODULE DDR SDRAM 128MB 184UDIMM
Lifecycle:
New from this manufacturer.
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