13
LTC1142/LTC1142L/LTC1142HV
current. When a load step occurs, V
OUT
shifts by an
amount equal to I
LOAD
• ESR, where ESR is the effective
series resistance of C
OUT
. I
LOAD
also begins to charge
or discharge C
OUT
until the regulator loop adapts to the
current change and returns V
OUT
to its steady- state
value. During this recovery time V
OUT
can be monitored
for overshoot or ringing which would indicate a stability
problem. The Pin 27 (13) external components shown in
the Figure 1 circuit will prove adequate compensation for
most applications.
A second, more severe transient is caused by switching in
loads with large (>1µF) supply bypass capacitors. The
discharged bypass capacitors are effectively put in parallel
with C
OUT
, causing a rapid drop in V
OUT
. No regulator can
deliver enough current to prevent this problem if the load
switch resistance is low and it is driven quickly. The only
solution is to limit the rise time of the switch drive so that
the load rise time is limited to approximately 25
C
LOAD
.
Thus a 10µF capacitor would require a 250µs rise time,
limiting the charging current to about 200mA.
Efficiency Considerations
The percent efficiency of a switching regulator is equal to
the output power divided by the input power times 100%.
It is often useful to analyze individual losses to determine
what is limiting the efficiency and which change would
produce the most improvement. Percent efficiency can be
expressed as:
%Efficiency = 100% – (L1 + L2 + L3 + ...)
where L1, L2, etc., are the individual losses as a percent-
age of input power. (For high efficiency circuits only small
errors are incurred by expressing losses as a percentage
of output power.)
Although all dissipative elements in the circuit produce
losses, three main sources usually account for most of the
losses in LTC1142 circuits:
1. LTC1142 DC bias current
2. MOSFET gate charge current
3. I
2
R losses
1. The DC supply current is the current which flows into
V
IN
(pin 24 for the 3.3V section, Pin 10 for the 5V
section) less the gate charge current. For V
IN
= 10V the
LTC1142 DC supply current for each section is 160µA
with no load, and increases proportionally with load up
to a constant 1.6mA after the LTC1142 has entered
continuous mode. Because the DC bias current is
drawn from V
IN
, the resulting loss increases with input
voltage. For V
IN
= 10V the DC bias losses are generally
less than 1% for load currents over 30mA. However, at
very low load currents the DC bias current accounts for
nearly all of the loss.
2. MOSFET gate charge current results from switching
the gate capacitance of the power MOSFETs. Each time
a MOSFET gate is switched from low to high to low
again, a packet of charge dQ moves from V
IN
to ground.
The resulting dQ/dt is a current out of V
IN
which is
typically much larger than the DC supply current. In
continuous mode, I
GATE(CHG)
= f (Q
N
+ Q
P
). The typical
gate charge for a 0.1 N-channel power MOSFET is
25nC, and for a P-channel about twice that value. This
results in I
GATE(CHG)
= 7.5mA in 100kHz continuous
operation, for a 2% to 3% typical mid-current loss with
V
IN
= 10V.
Note that the gate charge loss increases directly with
both input voltage and operating frequency. This is the
principal reason why the highest efficiency circuits
operate at moderate frequencies. Furthermore, it ar-
gues against using larger MOSFETs than necessary to
control I
2
R losses, since overkill can cost efficiency as
well as money!
3. I
2
R losses are easily predicted from the DC resistances
of the MOSFET, inductor, and current shunt. In continu-
ous mode the average output current flows through L
and R
SENSE
, but is “chopped” between the P-channel
and N-channel MOSFETs. If the two MOSFETs have
approximately the same R
DS(ON)
, then the resistance of
one MOSFET can simply be summed with the resis-
tances of L and R
SENSE
to obtain I
2
R losses. For
example, if each R
DS(ON)
= 0.1, R
L
= 0.15, and
R
SENSE
= 0.05, then the total resistance is 0.3. This
results in losses ranging from 3% to 12% as the output
current increases from 0.5A to 2A. I
2
R losses cause the
efficiency to roll off at high output currents.
APPLICATIO S I FOR ATIO
WUU
U
14
LTC1142/LTC1142L/LTC1142HV
Figure 5 shows how the efficiency losses in one section of
a typical LTC1142 regulator end up being apportioned.
The gate charge loss is responsible for the majority of the
efficiency lost in the mid-current region. If Burst Mode
operation was not employed at low currents, the gate
charge loss alone would cause efficiency to drop to
unacceptable levels. With Burst Mode
operation, the DC
supply current represents the lone (and unavoidable) loss
component which continues to become a higher percent-
age as output current is reduced. As expected, the I
2
R
losses dominate at high load currents.
Other losses including C
IN
and C
OUT
ESR dissipative
losses, MOSFET switching losses, Schottky conduction
losses during dead-time and inductor core losses, gener-
ally account for less than 2% total additional loss.
and δ
P
= δ
N
= 0.007(63 – 25) = 0.27. The required R
DS(ON)
for each MOSFET can now be calculated:
PCh- R
N- Ch R
DS(ON)
DS(ON)
==
==
12 0 25
52 127
012
12 0 25
52 127
0 085
2
2
(. )
()(. )
.
(. )
()(. )
.
The P-channel requirement can be met by a Si9430DY,
while the N-channel requirement is exceeded by a
Si9410DY. Note that the most stringent requirement for
the N-channel MOSFET is with V
OUT
= 0 (i.e., short circuit).
During a continuous short circuit, the worst case
N-channel dissipation rises to:
P
N
= I
SC(AVG)
2
• R
DS(ON)
• (1 + δ
N
)
With the 0.05 sense resistor, I
SC(AVG)
= 2A will result,
increasing the 0.085 N-channel dissipation to 450mW at
a die temperature of 73°C.
C
IN
will require an RMS current rating of at least 1A at
temperature, and C
OUT
will require an ESR of 0.05 for
optimum efficiency.
Now allow V
IN
to drop to its minimum value. At lower input
voltages the operating frequency will decrease and the
P-channel will be conducting most of the time, causing its
power dissipation to increase. At V
IN(MIN)
= 7V:
f
MIN
= (1/2.92µs)[1 – (5V/ 7V)] = 98kHz
P
VA
V
mV
P
==
5 0 12 2 1 27
7
435
2
(. )( )(. )
A similar calculation for the 3.3V section results in the
component values shown in Figure 14.
LTC1142HV-ADJ/LTC1142L-ADJ
Adjustable Applications
When an output voltage other than 3.3V or 5V is required,
the LTC1142 adjustable version is used with an external
resistive divider from V
OUT
to V
FB
, Pin 2 (16). The regu-
lated output voltage is determined by:
V
R
R
OUT
=+
125 1
2
1
.
APPLICATIO S I FOR ATIO
WUU
U
Design Example
As a design example, assume V
IN
= 12V (nominal), 5V
section, I
MAX
= 2A and f = 200kHz; R
SENSE
, C
T
and L can
immediately be calculated:
R
SENSE
= 100mV/2 = 0.05
t
OFF
= (1/200kHz) • [1 – (5/12)] = 2.92µs
C
T5
= 2.92µs/(1.3 • 10
4
) = 220pF
L2
MIN
= 5.1 • 10
5
• 0.05 • 220pF • 5V = 28µH
Assume that the MOSFET dissipations are to be limited to
P
N
= P
P
= 250mW.
If T
A
= 50°C and the thermal resistance of each MOSFET
is 50°C/W, then the junction temperatures will be 63°C
Figure 5. Efficiency Loss
OUTPUT CURRENT (A)
0.01
EFFICIENCY/LOSS (%)
90
95
1
1142 F05
85
80
0.03
0.1
0.3
3
100
GATE CHARGE
1/2 LTC1142 I
Q
I
2
R
15
LTC1142/LTC1142L/LTC1142HV
To prevent stray pickup a 100pF capacitor is suggested
across R1 located close to the LTC1142HV-ADJ/LTC1142L-
ADJ as in Figure 6. The external divider network must be
placed across C
OUT
with the negative plate of C
OUT
returned
to signal ground. Refer to the Board Layout Checklist.
the layout diagram of Figure 7. In general each block
should be self-contained with little cross coupling for best
performance. Check the following in your layout:
1. Are the signal and power grounds segregated? The
LTC1142 signal ground [Pin 3 (17) for the LTC1142, Pin
4 (18) for LTC1142-ADJ] must return to the (–) plate
of
C
OUT
. The power ground returns to the source of the
N-channel MOSFET, anode of the Schottky diode,
and (–) plate of C
IN
, which should have as short lead
lengths as possible.
2. Does the LTC1142 Sense
, Pin 28 (14) connect to a
point close to R
SENSE
and the (+) plate of C
OUT
?
3. Are the Sense
and Sense
+
leads routed together with
minimum PC trace spacing? The 1000pF capacitor
between Pins 1 (15) and 28 (14) should be as close as
possible to the LTC1142. Ensure accurate current sens-
APPLICATIO S I FOR ATIO
WUU
U
Figure 6. LTC1142-ADJ External Feedback Network
Figure 7. LTC1142 Layout Diagram (see Board Layout Checklist)
Board Layout Checklist
When laying out the printed circuit board, the following
checklist should be used to ensure proper operation of the
LTC1142. These items are also illustrated graphically in
R
SENSE
100pF
R2
R1
+
C
OUT
V
OUT
V
FB
[PIN 2(16)]
SGND
[PIN 4(18)]
1142 F06
+
1000pF
28
27
26
25
24
23
22
21
20
19
18
17
16
15
SENSE
3
I
TH3
INTV
CC3
C
T3
V
IN3
NDRIVE 5
PGND5
SGND5
SHDN5
SENSE
+
5
LTC1142
1
2
3
4
5
6
7
8
9
10
11
12
13
14
+
+
PDRIVE 3
NC
NC
PDRIVE 5
NC
NC
NC
V
IN3
NC
V
IN5
1000pF
3300pF
3300pF
1k
1k
C
T5
+
C
OUT3
R
SENSE3
+
V
OUT3
+
V
IN3
C
IN3
L1
N-CH
P-CH
1µF
1µF
P-CH
N-CH
C
IN5
D1
D2
L2
+
C
OUT5
+
+
V
IN5
R
SENSE5
V
OUT5
1142 F07
SHDN (5V OUTPUT)
SGND3
SHDN (3.3V OUTPUT)
BOLD LINES INDICATE HIGH CURRENT PATHS
SENSE
+
3
SHDN3
PGND3
NDRIVE 3
V
IN5
C
T5
INTV
CC5
I
TH5
SENSE
5
C
T3
+
SENSE RESISTOR PCB PATTERN
SENSE
+
SENSE

LTC1142HVCG-ADJ#TRPBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
Switching Voltage Regulators Adj HV Dual Hi Eff Sw Reg Control
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union