FS781/82/84
Document #: 38-07029 Rev. *F Page 11 of 12
© Cypress Semiconductor Corporation, 2005. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
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Package Drawing and Dimensions (continued)
8
PIN1ID
SEATING
PLANE
1
BSC.
BSC
0°-8°
PLANE
GAUGE
2.90[0.114]
1.10[0.043] MAX.
0.65[0.025]
0.20[0.008]
0.05[0.002]
6.50[0.256]
0.076[0.003]
6.25[0.246]
4.50[0.177]
4.30[0.169]
3.10[0.122]
0.15[0.006]
0.19[0.007]
0.30[0.012]
0.09[[0.003]
0.25[0.010]
0.70[0.027]
0.50[0.020]
0.95[0.037]
0.85[0.033]
DIMENSIONS IN MM[INCHES] MIN.
MAX.
8-Lead Thin Shrunk Small Outline Package (4.40 MM Body) Z8
51-85093-*A
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