9397 750 13429 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 06 — 2 August 2004 4 of 13
Philips Semiconductors
PHB/PHD66NQ03LT
N-channel TrenchMOS™ logic level FET
5. Thermal characteristics
5.1 Transient thermal impedance
Table 4: Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
th(j-mb)
thermal resistance from junction to mounting
base
Figure 4 - - 1.6 K/W
R
th(j-a)
thermal resistance from junction to ambient
SOT404 mounted on a printed-circuit board;
minimum footprint; vertical in still
air
- 50 - K/W
SOT428 mounted on a printed-circuit board;
minimum footprint; vertical in still
air
- 75 - K/W
mounted on a printed-circuit board;
SOT404 minimum footprint; vertical
in still air
- 50 - K/W
Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse duration.
03ag18
10
-2
10
-1
1
10
10
-5
10
-4
10
-3
10
-2
10
-1
1 10
t
p
(s)
Z
th(j-mb)
(K/W)
single pulse
δ
= 0.5
0.2
0.1
0.05
0.02
t
p
T
P
t
t
p
T
δ =
9397 750 13429 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 06 — 2 August 2004 5 of 13
Philips Semiconductors
PHB/PHD66NQ03LT
N-channel TrenchMOS™ logic level FET
6. Characteristics
Table 5: Characteristics
T
j
=25
°
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Static characteristics
V
(BR)DSS
drain-source breakdown voltage I
D
= 250 µA; V
GS
=0V
T
j
=25°C 25--V
T
j
= 55 °C 22--V
V
GS(th)
gate-source threshold voltage I
D
= 1 mA; V
DS
=V
GS
; Figure 9 and 10
T
j
=25°C 1 1.5 2 V
T
j
= 175 °C 0.5 - - V
T
j
= 55 °C - - 2.2 V
I
DSS
drain-source leakage current V
DS
=25V; V
GS
=0V
T
j
=25°C --10µA
T
j
= 175 °C - - 500 µA
I
GSS
gate-source leakage current V
GS
= ±15 V; V
DS
= 0 V - 10 100 nA
R
DSon
drain-source on-state resistance V
GS
= 10 V; I
D
=25A;Figure 6 and 8
T
j
=25°C - 9.1 10.5 m
T
j
= 175 °C - 16.4 18.9 m
V
GS
=5V; I
D
=25A;Figure 6 and 8 - 11.2 13.6 m
Dynamic characteristics
Q
g(tot)
total gate charge I
D
= 50 A; V
DS
=15V; V
GS
=5V;
Figure 11
-12-nC
Q
gs
gate-source charge - 4.5 - nC
Q
gd
gate-drain (Miller) charge - 3.6 - nC
C
iss
input capacitance V
GS
=0V; V
DS
= 25 V; f = 1 MHz;
Figure 13
- 860 - pF
C
oss
output capacitance - 330 - pF
C
rss
reverse transfer capacitance - 145 - pF
t
d(on)
turn-on delay time V
DS
=15V; R
L
= 0.6 ;
V
GS
=5V;R
G
= 5.6
- 1525ns
t
r
rise time - 90 135 ns
t
d(off)
turn-off delay time - 25 40 ns
t
f
fall time - 2540ns
Source-drain diode
V
SD
source-drain (diode forward) voltage I
S
= 25 A; V
GS
=0V;Figure 12 - 0.95 1.2 V
t
rr
reverse recovery time I
S
= 10 A; dI
S
/dt = 100 A/µs;
V
GS
=0V;V
R
=25V
-32-ns
Q
r
recovered charge - 20 - nC
9397 750 13429 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 06 — 2 August 2004 6 of 13
Philips Semiconductors
PHB/PHD66NQ03LT
N-channel TrenchMOS™ logic level FET
T
j
=25°CT
j
=25°C
Fig 5. Output characteristics: drain current as a
function of drain-source voltage; typical values.
Fig 6. Drain-source on-state resistance as a function
of drain current; typical values.
T
j
=25°C and 175 °C; V
DS
> I
D
xR
DSon
Fig 7. Transfer characteristics: drain current as a
function of gate-source voltage; typical values.
Fig 8. Normalized drain-source on-state resistance
factor as a function of junction temperature.
03ag20
0
20
40
60
80
0 0.5 1 1.5 2
V
DS
(V)
I
D
(A)
5 V
T
j
= 25
°
C
V
GS
= 3 V
10 V
3.5 V
6 V
4 V
4.5 V
03ag21
0
5
10
15
20
25
0 20406080
I
D
(A)
R
DSon
(m
)
V
GS
= 4.5 V
T
j
= 25
°
C
5V
10 V
6 V
03ag22
0
20
40
60
80
012345
V
GS
(V)
I
D
(A)
V
DS
> I
D
x R
DSon
T
j
= 25
°
C
175
°
C
03af18
0
0.5
1
1.5
2
-60 0 60 120 180
T
j
(
°
C)
a
a
R
DSon
R
DSon 25 C
°
()
-----------------------------
=

PHD66NQ03LT,118

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
MOSFET N-CH 25V 66A DPAK
Lifecycle:
New from this manufacturer.
Delivery:
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