REV. A –3
AD974
A Grade B Grade
Parameter Conditions Min Typ Max Min Typ Max Units
DIGITAL OUTPUTS
Data Format Serial 16 Bits
Data Coding Straight Binary
V
OL
I
SINK
= 1.6 mA +0.4 +0.4 V
V
OH
I
SOURCE
= 500 µA+4 +4 V
Output Capacitance High-Z State 15 15 pF
Leakage Current High-Z State
V
OUT
= 0 V to V
DIG
±5 ±5 µA
POWER SUPPLIES
Specified Performance
V
DIG
+4.75 +5 +5.25 +4.75 +5 +5.25 V
V
ANA
+4.75 +5 +5.25 +4.75 +5 +5.25 V
I
DIG
4.5 4.5 mA
I
ANA
14 14 mA
Power Dissipation
PWRD LOW 120 120 mW
PWRD HIGH 50 50 µW
TEMPERATURE RANGE
Specified Performance T
MIN
to T
MAX
–40 +85 –40 +85 °C
NOTES
1
LSB means Least Significant Bit. With a ±10 V input, one LSB is 305 µV.
2
Typical rms noise at worst case transitions and temperatures.
3
Full-Scale Error is expressed as the % difference between the actual full-scale code transition voltage and the ideal full-scale transition voltage, and includes the effect
of offset error. For bipolar input, the Full-Scale Error is the worst case of either the –Full-Scale or +Full-Scale code transition voltage errors. For unipolar input
ranges, Full-Scale Error is with respect to the +Full-Scale code transition voltage.
4
External 2.5 V reference connected to REF.
5
All specifications in dB are referred to a full-scale ±10 V input.
6
Full-Power Bandwidth is defined as full-scale input frequency at which Signal-to-(Noise + Distortion) degrades to 60 dB, or 10 bits of accuracy.
7
Recovers to specified performance after a 2 × FS input overvoltage.
Specifications subject to change without notice.
TIMING SPECIFICATIONS
Parameter Symbol Min Typ Max Units
Convert Pulsewidth t
1
50 ns
R/C, CS to BUSY Delay t
2
100 ns
BUSY LOW Time t
3
4.0 µs
BUSY Delay after End of Conversion t
4
50 ns
Aperture Delay t
5
40 ns
Conversion Time t
6
3.8 4.0 µs
Acquisition Time t
7
1.0 µs
Throughput Time t
6
+ t
7
5 µs
R/C Low to DATACLK Delay t
8
220 ns
DATACLK Period t
9
220 ns
DATA Valid Setup Time t
10
50 ns
DATA Valid Hold Time t
11
20 ns
EXT. DATACLK Period t
12
66 ns
EXT. DATACLK HIGH t
13
20 ns
EXT. DATACLK LOW t
14
30 ns
R/C, CS to EXT. DATACLK Setup Time t
15
20 t
12
+ 5 ns
R/C to CS Setup Time t
16
10 ns
EXT. DATACLK to SYNC Delay t
17
15 66 ns
EXT. DATACLK to DATA Valid Delay t
18
25 66 ns
CS to EXT. DATACLK Rising Edge Delay t
19
10 ns
Previous DATA Valid after CS, R/C Low t
20
3.5 µs
BUSY to EXT. DATACLK Setup Time t
21
5ns
Final EXT. DATACLK to BUSY Rising Edge t
22
1.7 µs
A0, A1 to WR1, WR2 Setup Time t
23
10 ns
A0, A1 to WR1, WR2 Hold Time t
24
10 ns
WR1, WR2 Pulsewidth t
25
50 ns
Specifications subject to change without notic e.
(f
S
= 200 kHz, V
DIG
= V
ANA
= +5 V, –40C to +85C)
REV. A
AD974
–4–
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD974 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
ABSOLUTE MAXIMUM RATINGS
1
Analog Inputs
VxA, VxB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 V
CAP . . . . . . . . . . . . . . . . +V
ANA
+ 0.3 V to AGND2 – 0.3 V
REF . . . . . . . . . . . . . . . . . . . . Indefinite Short to AGND2,
Momentary Short to V
ANA
Ground Voltage Differences
DGND, AGND1, AGND2 . . . . . . . . . . . . . . . . . . . ±0.3 V
Supply␣ Voltages
V
ANA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7 V
V
DIG
to V
ANA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±7 V
V
DIG
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7 V
Digital Inputs . . . . . . . . . . . . . . . . . . . –0.3 V to V
DIG
+ 0.3 V
Internal␣ Power␣ Dissipation
2
PDIP (N), SOIC (R), SSOP (RS) . . . . . . . . . . . . . 700 mW
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . .+150°C
Storage Temperature Range N, R . . . . . . . . –65°C to +150°C
Lead Temperature Range
(Soldering␣ 10␣ sec) . . . . . . . . . . . . . . . . . . . . . . . . . .+300°C
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2
Specification is for device in free air:
28-Lead PDIP: θ
JA
= 100°C/W, θ
JC
= 31°C/W
28-Lead SOIC: θ
JA
= 75°C/W, θ
JC
= 24°C/W
28-Lead SSOP: θ
JA
= 109°C/W, θ
JC
= 39°C/W
PIN CONFIGURATION
SOIC, DIP AND SSOP
TOP VIEW
(Not to Scale)
28
27
26
25
24
23
22
21
20
19
18
17
16
15
1
2
3
4
5
6
7
8
9
10
11
12
13
14
AD974
DGND
EXT/INT
PWRD
V
DIG
R/C
AGND2
REF
AGND1
V3A
V3B
V4A
CAP
BIP
V4B
SYNC
DATACLK
DATA
WR2
WR1
CS
BUSY
V2B
V2A
V1B
V1A
A1
A0
V
ANA
Figure 1. Load Circuit for Digital Interface Timing
ORDERING GUIDE
Temperature Package Package
Model Range Max INL Min S/(N+D) Description Options
AD974AN –40°C to +85°C ±3.0 LSB 83 dB 28-Lead Plastic DIP N-28B
AD974BN –40°C to +85°C ±2.0 LSB 85 dB 28-Lead Plastic DIP N-28B
AD974AR –40°C to +85°C ±3.0 LSB 83 dB 28-Lead SOIC R-28
AD974BR –40°C to +85°C ±2.0 LSB 85 dB 28-Lead SOIC R-28
AD974ARS –40°C to +85°C ±3.0 LSB 83 dB 28-Lead SSOP RS-28
AD974BRS –40°C to +85°C ±2.0 LSB 85 dB 28-Lead SSOP RS-28
REV. A
AD974
–5–
PIN FUNCTION DESCRIPTIONS
Pin No. Mnemonic Description
1 AGND1 Analog Ground. Used as the ground reference point for the REF pin.
2–5, 25–28 VxA, VxB Analog Input. Refer to Table I for input range configuration.
6 BIP Bipolar Offset. Connect VxA inputs to provide Bipolar input range.
7 CAP Reference Buffer Output. Connect a 2.2 µF tantalum capacitor between CAP and Analog
Ground.
8 REF Reference Input/Output. The internal +2.5 V reference is available at this pin. Alternatively an
external reference can be used to override the internal reference. In either case, connect a 2.2 µF
tantalum capacitor between REF and Analog Ground.
9 AGND2 Analog Ground.
10 R/C Read/Convert Input. Used to control the conversion and read modes. With CS LOW, a falling
edge on R/C holds the analog input signal internally and starts a conversion; a rising edge enables
the transmission of the conversion result.
11 V
DIG
Digital Power Supply. Nominally +5 V.
12 PWRD Power-Down Input. When set to a logic HIGH, power consumption is reduced and conversions
are inhibited. The conversion result from the previous conversion is stored in the onboard shift
register.
13 EXT/INT Digital select input for choosing the internal or an external data clock. With EXT/INT tied LOW,
after initiating a conversion, 16 DATACLK pulses transmit the previous conversion result as
shown in Figure 3. With EXT/INT set to a Logic HIGH, output data is synchronized to an
external clock signal connected to the DATACLK input. Data is output as indicated in Figure 4
through Figure 9.
14 DGND Digital Ground.
15 SYNC Digital output frame synchronization for use with an external data clock (EXT/INT = Logic
HIGH). When a read sequence is initiated, a pulse one DATACLK period wide is output
synchronous to the external data clock.
16 DATACLK Serial data clock input or output, dependent upon the logic state of the EXT/INT pin. When
using the internal data clock (EXT/INT = Logic LOW), a conversion start sequence will initiate
transmission of 16 DATACLK periods. Output data is synchronous to this clock and is valid on
both its rising and falling edges (Figure 3). When using an external data clock (EXT/INT = Logic
HIGH), the CS and R/C signals control how conversion data is accessed.
17 DATA The serial data output is synchronized to DATACLK. Conversion results are stored in an on-
chip register. The AD974 provides the conversion result, MSB first, from its internal shift regis-
ter. When using the internal data clock (EXT/INT = Logic LOW), DATA is valid on both the
rising and falling edges of DATACLK. Using an external data clock (EXT/INT = Logic HIGH)
allows previous conversion data to be accessed during a conversion (Figures 5, 7 and 9) or the
conversion result can be accessed after the completion of a conversion (Figures 4, 6 and 8).
18, 19 WR1, WR2 Multiplexer Write Inputs. These inputs are internally ORed to generate the mux latch inputs.
The latch is transparent when WR1 and WR2 are tied low.
20 CS Chip Select Input. With R/C LOW, a falling edge on CS will initiate a conversion. With R/C
HIGH, a falling edge on CS will enable the serial data output sequence.
21 BUSY Busy Output. Goes LOW when a conversion is started, and remains LOW until the conversion is
completed and the data is latched into the on-chip shift register.
22, 23 A1, A0 Address multiplexer inputs latched with the WR1, WR2 inputs.
A1 A0 Data Available from Channel
00AIN 1
01AIN 2
10AIN 3
11AIN 4
24 V
ANA
Analog Power Supply. Nominally +5 V.

AD974BR

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Analog to Digital Converters - ADC 4CH 16-Bit 200 kSPS
Lifecycle:
New from this manufacturer.
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