NCP3126
http://onsemi.com
3
Table 2. MAXIMUM RATINGS
Rating Symbol Min Max Unit
Main Supply Voltage Input V
IN
−0.3 15 V
Bootstrap Supply Voltage vs GND VBST −0.3 15 V
Bootstrap Supply Voltage vs Ground (spikes ≤ 50 ns) VBST spike −5.0 35 V
Bootstrap Pin Voltage vs V
SW
VBST−V
SW
−0.3 15 V
High Side Switch Max DC Current IV
SW
0 3.0 A
V
SW
Pin Voltage V
SW
−0.3 30 V
Switching Node Voltage Excursion (200 mA)
V
SWLIM
−2.0 35 V
Switch Pin voltage (spikes < 50 ns) V
SWtr
−5.0 40 V
FB Pin Voltage VFB −0.3 5.5 < V
CC
V
COMP/DISABLE VCOMP/DIS −0.3 5.5 < V
CC
V
Low Side Driver Pin Voltage VISET −0.3 15 < V
CC
V
Low Side Driver Pin Voltage (spikes v 200 ns) VISET Spike −2 15 < V
CC
V
Rating Symbol Rating Unit
Thermal Resistance, Junction−to−Ambient (Note 2)
(Note 3)
R
q
JA
110
183
°C/W
Thermal Resistance, Junction−to−Case
R
q
JC
170 °C/W
Storage Temperature Range T
stg
−55 to 150 °C
Junction Operating Temperature T
J
−40 to 125 °C
Lead Temperature Soldering (10 sec):
Reflow (SMD styles only) Pb−Free
RF 260 peak °C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. The maximum package power dissipation limit must not be exceeded.
2. The value of qJA is measured with the device mounted on 1 in
2
FR−4 board with 1 oz. copper, in a still air environment with T
A
= 25°C. The
value in any given application depends on the user’s specific board design.
3. The value of qJA is measured with the device mounted on minimum footprint, in a still air environment with T
A
= 25°C. The value in any given
application depends on the user’s specific board design.
4. 60−180 seconds minimum above 237°C.
