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LTC3720EGN#TRPBF

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24
22
LTC3720
3720f
Figure 11. LTC3720 Layout Diagram
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
RUN/SS
V
ON
PGOOD
V
RNG
FCB
I
TH
SGND
I
ON
V
FB
SGND
V
FB
V
OSENSE
VID0
VID1
BOOST
TG
SW
SENSE
+
SENSE
–
PGND
BG
INTV
CC
V
IN
EXTV
CC
V
CC
VID4
VID3
VID2
LTC3720
INT V
CC
INT V
CC
V
IN
R
ON
C
ION
R
C
R
F
10Ω
C
SS
C
C1
C
C2
C
B
C
F
D
B
POWER GOOD
+
+
V
OUT
V
IN
C
OUT
C
IN
SGND
L1
1µH
D1
M1
M2
3720 F11
BOLD LINES INDICATE HIGH CURRENT PATHS
PC Board Layout Checklist
When laying out the printed circuit board, use the follow-
ing checklist to ensure proper operation of the controller.
These items are also illustrated in Figure 11.
• Segregate the signal and power grounds. All small
signal components should return to the SGND pin at
one point which is then tied to the PGND pin close to the
source of M2.
• Place M2 as close to the controller as possible, keeping
the SENSE
–
, BG and SENSE
+
traces short.
•
Connect the input capacitor(s) C
IN
close to the power
MOSFETs. This capacitor carries the MOSFET AC
current. Minimize the loop area formed by C
IN
, M1 and
M2.
APPLICATIO S I FOR ATIO
WUUU
• Keep the high dV/dT SW, BOOST and TG nodes away
from sensitive small-signal nodes.
• Connect the INTV
CC
decoupling capacitor C
VCC
closely
to the INTV
CC
and PGND pins.
• Connect the top driver boost capacitor C
B
closely to the
BOOST and SW pins.
• Connect the V
IN
pin decoupling capacitor C
F
closely to
the V
IN
and PGND pins.
• VID0-VID4 interface circuitry must return to SGND.
23
LTC3720
3720f
U
PACKAGE DESCRIPTIO
GN Package
28-Lead Plastic SSOP (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1641)
.386 – .393*
(9.804 – 9.982)
GN28 (SSOP) 0502
12
3
4
5
6
7
8 9 10 11 12
.229 – .244
(5.817 – 6.198)
.150 – .157**
(3.810 – 3.988)
202122232425262728
19
18
17
13 14
16
15
.016 – .050
(0.406 – 1.270)
.015
± .004
(0.38 ± 0.10)
×
45
°
0
°
– 8
°
TYP
.0075 – .0098
(0.191 – 0.249)
.053 – .069
(1.351 – 1.748)
.008 – .012
(0.203 – 0.305)
.004 – .009
(0.102 – 0.249)
.0250
(0.635)
BSC
.033
(0.838)
REF
.254 MIN
RECOMMENDED SOLDER PAD LAYOUT
.150 – .165
.0250 TYP.0165
±
.0015
.045
±
.005
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
INCHES
(MILLIMETERS)
NOTE:
1. CONTROLLING DIMENSION: INCHES
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
24
LTC3720
3720f
LINEAR TECHNOLOGY CORPORATION 2002
LT/TP 0203 2K • PRINTED IN USA
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900
●
FAX: (408) 434-0507
●
www.linear.com
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LTC3720EGN#TRPBF

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Manufacturer:
Analog Devices / Linear Technology
Description:
Switching Voltage Regulators Single-Phase Buck Controller
Lifecycle:
New from this manufacturer.
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