M93C46, M93C56, M93C66, M93C76, M93C86 Package mechanical data
Doc ID 4997 Rev 12 29/34
Figure 14. UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
2 x 3 mm, outline
1. Drawing is not to scale.
2. The central pad (area E2 by D2 in the above illustration) is pulled, internally, to V
SS
. It must not be allowed
to be connected to any other voltage or signal line on the PCB, for example during the soldering process.
3. The circle in the top view of the package indicates the position of pin 1
.
Table 26. UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
2 x 3 mm, data
Symbol
millimeters inches
(1)
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Typ Min Max Typ Min Max
A 0.550 0.450 0.600 0.0217 0.0177 0.0236
A1 0.020 0.000 0.050 0.0008 0.0000 0.0020
b 0.250 0.200 0.300 0.0098 0.0079 0.0118
D 2.000 1.900 2.100 0.0787 0.0748 0.0827
D2 (rev MB) 1.600 1.500 1.700 0.0630 0.0591 0.0669
D2 (rev MC) 1.200 1.600 0.0472 0.0630
E 3.000 2.900 3.100 0.1181 0.1142 0.1220
E2 (rev MB) 0.200 0.100 0.300 0.0079 0.0039 0.0118
E2 (rev MC) 1.200 1.600 0.0472 0.0630
e 0.500 0.0197
K 0.300 0.0118
L 0.300 0.500 0.0118 0.0197
L1 0.150 0.0059
L3 0.300 0.0118
eee
(2)
2. Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from
measuring.
0.080 0.0031
D
E
ZW_MEe
A
A1
eee
L1
e
b
D2
L
E2
L3
L1
e b
D2
L
E2
L3
Pin 1
K
K
MB MC
