LPC2292_2294 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 8 — 8 June 2011 13 of 54
NXP Semiconductors
LPC2292/2294
16/32-bit ARM microcontrollers with external memory interface
P3[17]/A17 48
[7]
N5
[7]
O A17 — External memory address line 17.
P3[18]/A18 47
[7]
M5
[7]
O A18 — External memory address line 18.
P3[19]/A19 46
[7]
L5
[7]
O A19 — External memory address line 19.
P3[20]/A20 45
[7]
K5
[7]
O A20 — External memory address line 20.
P3[21]/A21 44
[7]
N4
[7]
O A21 — External memory address line 21.
P3[22]/A22 41
[7]
K4
[7]
O A22 — External memory address line 22.
P3[23]/A23/
XCLK
40
[7]
N3
[7]
I/O A23 — External memory address line 23.
O XCLK — Clock output.
P3[24]/CS3
36
[7]
M2
[7]
O CS3LOW-active Chip Select 3 signal.
(Bank 3 addresses range 0x8300 0000 to 0x83FF FFFF)
P3[25]/CS2 35
[7]
M1
[7]
O CS2LOW-active Chip Select 2 signal.
(Bank 2 addresses range 0x8200 0000 to 0x82FF FFFF)
P3[26]/CS1 30
[7]
K2
[7]
O CS1LOW-active Chip Select 1 signal.
(Bank 1 addresses range 0x8100 0000 to 0x81FF FFFF)
P3[27]/WE
29
[7]
K1
[7]
O WELOW-active Write enable signal.
P3[28]/BLS3
/
AIN7
28
[6]
J4
[6]
O BLS3LOW-active Byte Lane Select signal (Bank 3).
I AIN7 — ADC, input 7. This analog input is always connected
to its pin.
P3[29]/BLS2
/
AIN6
27
[6]
J3
[6]
O BLS2LOW-active Byte Lane Select signal (Bank 2).
I AIN6 — ADC, input 6. This analog input is always connected
to its pin.
P3[30]/BLS1
97
[7]
E13
[7]
O BLS1LOW-active Byte Lane Select signal (Bank 1).
P3[31]/BLS0
96
[7]
F10
[7]
O BLS0LOW-active Byte Lane Select signal (Bank 0).
TD1 22
[7]
H2
[7]
O TD1: CAN1 transmitter output.
RESET
135
[8]
C5
[8]
I External Reset input: A LOW on this pin resets the device,
causing I/O ports and peripherals to take on their default
states, and processor execution to begin at address 0. TTL
with hysteresis, 5 V tolerant.
XTAL1 142
[9]
C3
[9]
I Input to the oscillator circuit and internal clock generator
circuits.
XTAL2 141
[9]
B3
[9]
O Output from the oscillator amplifier.
V
SS
3, 9, 26, 38,
54, 67, 79,
93, 103, 107,
111, 128
C2, E4, J2,
N2, N7, L10,
K12, F13,
D11, B13,
B11, D7
I Ground: 0 V reference.
V
SSA
139 C4 I Analog ground: 0 V reference. This should nominally be the
same voltage as V
SS
, but should be isolated to minimize noise
and error.
V
SSA(PLL)
138 B4 I PLL analog ground: 0 V reference. This should nominally be
the same voltage as V
SS
, but should be isolated to minimize
noise and error.
V
DD(1V8)
37, 110 N1, A12 I 1.8 V core power supply: This is the power supply voltage
for internal circuitry.
Table 4. Pin description
…continued
Symbol Pin (LQFP) Pin
(TFBGA)
[1]
Type Description
LPC2292_2294 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 8 — 8 June 2011 14 of 54
NXP Semiconductors
LPC2292/2294
16/32-bit ARM microcontrollers with external memory interface
[1] LPC2294 only.
[2] 5 V tolerant pad providing digital I/O functions with TTL levels and hysteresis and 10 ns slew rate control.
[3] SSP interface available on LPC2292/2294/01 only.
[4] 5 V tolerant pad providing digital I/O functions with TTL levels and hysteresis and 10 ns slew rate control. If configured for an input
function, this pad utilizes built-in glitch filter that blocks pulses shorter than 3 ns.
[5] Open-drain 5 V tolerant digital I/O I
2
C-bus 400 kHz specification compatible pad. It requires external pull-up to provide an output
functionality. Open-drain configuration applies to all output functions on this pin.
[6] 5 V tolerant pad providing digital I/O (with TTL levels and hysteresis and 10 ns slew rate control) and analog input function. If configured
for a digital input function, this pad utilizes built-in glitch filter that blocks pulses shorter than 3 ns. When configured as an ADC input,
digital section of the pad is disabled.
[7] 5 V tolerant pad with built-in pull-up resistor providing digital I/O functions with TTL levels and hysteresis and 10 ns slew rate control.
The pull-up resistor’s value ranges from 60 k to 300 k.
[8] 5 V tolerant pad providing digital input (with TTL levels and hysteresis) function only.
[9] Pad provides special analog functionality.
V
DDA(1V8)
143 A2 I Analog 1.8 V core power supply: This is the power supply
voltage for internal circuitry. This should be nominally the
same voltage as V
DD(1V8)
but should be isolated to minimize
noise and error.
V
DD(3V3)
2, 31, 39, 51,
57, 77, 94,
104, 112, 119
B1, K3, M3,
M6, N8, K10,
F12, C13,
A11, B9
I 3.3 V pad power supply: This is the power supply voltage for
the I/O ports.
V
DDA(3V3)
14 F3 I Analog 3.3 V pad power supply: This should be nominally
the same voltage as V
DD(3V3)
but should be isolated to
minimize noise and error.
Table 4. Pin description
…continued
Symbol Pin (LQFP) Pin
(TFBGA)
[1]
Type Description
LPC2292_2294 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 8 — 8 June 2011 15 of 54
NXP Semiconductors
LPC2292/2294
16/32-bit ARM microcontrollers with external memory interface
6. Functional description
6.1 Architectural overview
The ARM7TDMI-S is a general purpose 32-bit microprocessor, which offers high
performance and very low power consumption. The ARM architecture is based on RISC
principles, and the instruction set and related decode mechanism are much simpler than
those of microprogrammed CISC. This simplicity results in a high instruction throughput
and impressive real-time interrupt response from a small and cost-effective processor
core.
Pipeline techniques are employed so that all parts of the processing and memory systems
can operate continuously. Typically, while one instruction is being executed, its successor
is being decoded, and a third instruction is being fetched from memory.
The ARM7TDMI-S processor also employs a unique architectural strategy known as
Thumb, which makes it ideally suited to high-volume applications with memory
restrictions, or applications where code density is an issue.
The key idea behind Thumb is that of a super-reduced instruction set. Essentially, the
ARM7TDMI-S processor has two instruction sets:
The standard 32-bit ARM set
A 16-bit Thumb set
The Thumb set’s 16-bit instruction length allows it to approach twice the density of
standard ARM code while retaining most of the ARM’s performance advantage over a
traditional 16-bit processor using 16-bit registers. This is possible because Thumb code
operates on the same 32-bit register set as ARM code.
Thumb code is able to provide up to 65 % of the code size of ARM, and 160 % of the
performance of an equivalent ARM processor connected to a 16-bit memory system.
6.2 On-chip flash program memory
The LPC2292/2294 incorporate a 256 kB flash memory system respectively. This memory
may be used for both code and data storage. Programming of the flash memory may be
accomplished in several ways. It may be programmed In System via the serial port. The
application program may also erase and/or program the flash while the application is
running, allowing a great degree of flexibility for data storage field firmware upgrades, etc.
When the on-chip bootloader is used, 248 kB of flash memory is available for user code.
The LPC2292/2294 flash memory provides a minimum of 100000 erase/write cycles and
20 years of data retention.
On-chip bootloader (as of revision 1.64) provides Code Read Protection (CRP) for the
LPC2292/2294 on-chip flash memory. When the CRP is enabled, the JTAG debug port,
external memory boot and ISP commands accessing either the on-chip RAM or flash
memory are disabled. However, the ISP flash erase command can be executed at any
time (no matter whether the CRP is on or off). Removal of CRP is achieved by erasure of
full on-chip user flash. With the CRP off, full access to the chip via the JTAG and/or ISP is
restored.

LPC2294HBD144/01,5

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
ARM Microcontrollers - MCU ARM7 256KF/16KR/4CAN
Lifecycle:
New from this manufacturer.
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