LPC2292_2294 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 8 — 8 June 2011 28 of 54
NXP Semiconductors
LPC2292/2294
16/32-bit ARM microcontrollers with external memory interface
communication channel allows the JTAG port to be used for sending and receiving data
without affecting the normal program flow. The debug communication channel data and
control registers are mapped in to addresses in the EmbeddedICE logic.
The JTAG clock (TCK) must be slower than
1
6
of the CPU clock (CCLK) for the JTAG
interface to operate.
6.20.2 Embedded trace
Since the LPC2292/2294 have significant amounts of on-chip memory, it is not possible to
determine how the processor core is operating simply by observing the external pins. The
Embedded Trace Macrocell (ETM) provides real-time trace capability for deeply
embedded processor cores. It outputs information about processor execution to the trace
port.
The ETM is connected directly to the ARM core and not to the main AMBA system bus. It
compresses the trace information and exports it through a narrow trace port. An external
trace port analyzer must capture the trace information under software debugger control.
Instruction trace (or PC trace) shows the flow of execution of the processor and provides a
list of all the instructions that were executed. Instruction trace is significantly compressed
by only broadcasting branch addresses as well as a set of status signals that indicate the
pipeline status on a cycle by cycle basis. Trace information generation can be controlled
by selecting the trigger resource. Trigger resources include address comparators,
counters and sequencers. Since trace information is compressed the software debugger
requires a static image of the code being executed. Self-modifying code cannot be traced
because of this restriction.
6.20.3 RealMonitor
RealMonitor is a configurable software module, developed by ARM Inc., which enables
real-time debug. It is a lightweight debug monitor that runs in the background while users
debug their foreground application. It communicates with the host using the Debug
Communications Channel (DCC), which is present in the EmbeddedICE logic. The
LPC2292/2294 contain a specific configuration of RealMonitor software programmed into
the on-chip flash memory.
LPC2292_2294 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 8 — 8 June 2011 29 of 54
NXP Semiconductors
LPC2292/2294
16/32-bit ARM microcontrollers with external memory interface
7. Limiting values
[1] The following applies to Table 6:
a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated
maximum.
b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to V
SS
unless
otherwise noted.
[2] Internal rail.
[3] External rail.
[4] Including voltage on outputs in 3-state mode.
[5] Only valid when the V
DD(3V3)
supply voltage is present.
[6] Not to exceed 4.6 V.
[7] Per supply pin.
[8] The peak current is limited to 25 times the corresponding maximum current.
[9] Per ground pin.
[10] Dependent on package type.
[11] Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor.
Table 6. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
Symbol Parameter Conditions Min Max Unit
V
DD(1V8)
supply voltage (1.8 V)
[2]
0.5 +2.5 V
V
DD(3V3)
supply voltage (3.3 V)
[3]
0.5 +3.6 V
V
DDA(3V3)
analog supply voltage (3.3 V) 0.5 +4.6 V
V
IA
analog input voltage 0.5 +5.1 V
V
I
input voltage 5 V tolerant I/O pins
[4][5]
0.5 +6.0 V
other I/O pins
[4][6]
0.5 V
DD(3V3)
+ 0.5 V
I
DD
supply current
[7][8]
- 100 mA
I
SS
ground current
[8][9]
- 100 mA
T
j
junction temperature - 150 C
T
stg
storage temperature
[10]
65 +150 C
P
tot(pack)
total power dissipation (per
package)
based on package heat
transfer, not device
power consumption
-1.5 W
V
esd
electrostatic discharge voltage human body model
[11]
all pins 2000 +2000 V
LPC2292_2294 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 8 — 8 June 2011 30 of 54
NXP Semiconductors
LPC2292/2294
16/32-bit ARM microcontrollers with external memory interface
8. Static characteristics
Table 7. Static characteristics
T
amb
=
40
C to +125
C, unless otherwise specified.
Symbol Parameter Conditions Min Typ
[1]
Max Unit
V
DD(1V8)
supply voltage (1.8 V)
[2]
1.65 1.8 1.95 V
V
DD(3V3)
supply voltage (3.3 V)
[3]
3.0 3.3 3.6 V
V
DDA(3V3)
analog supply voltage
(3.3 V)
2.5 3.3 3.6 V
Standard port pins, RESET
, RTCK
I
IL
LOW-level input current V
I
= 0 V; no pull-up - - 3 A
I
IH
HIGH-level input current V
I
=V
DD(3V3)
; no pull-down - - 3 A
I
OZ
OFF-state output current V
O
=0V, V
O
=V
DD(3V3)
;
no pull-up/down
--3A
I
latch
I/O latch-up current (0.5V
DD(3V3)
) < V
I
<
(1.5V
DD(3V3)
); T
j
< 125 C
100 - - mA
V
I
input voltage
[4][5]
[6]
0-5.5V
V
O
output voltage output active 0 - V
DD(3V3)
V
V
IH
HIGH-level input voltage 2.0 - - V
V
IL
LOW-level input voltage - - 0.8 V
V
hys
hysteresis voltage 0.4 - - V
V
OH
HIGH-level output voltage I
OH
= 4 mA
[7]
V
DD(3V3)
0.4 - - V
V
OL
LOW-level output voltage I
OL
=4 mA
[7]
--0.4V
I
OH
HIGH-level output current V
OH
=V
DD(3V3)
0.4 V
[7]
4- -mA
I
OL
LOW-level output current V
OL
=0.4V
[7]
4--mA
I
OHS
HIGH-level short-circuit
output current
V
OH
=0V
[8]
--45 mA
I
OLS
LOW-level short-circuit
output current
V
OL
=V
DD(3V3)
[8]
--50mA
I
pd
pull-down current V
I
=5V
[9]
10 50 150 A
I
pu
pull-up current V
I
=0V
[10]
15 50 85 A
V
DD(3V3)
< V
I
< 5 V
[9]
000A

LPC2294HBD144/01,5

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
ARM Microcontrollers - MCU ARM7 256KF/16KR/4CAN
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