LTC4270/LTC4271
28
42701fd
For more information www.linear.com/LTC4270
TYPICAL APPLICATION
0.01µF
200V
0.01µF
200V
1
2
3
4
5
6
7
8
RJ45
CONNECTOR
3.3V –54V
100Ω
100Ω
T2
T3
3.3V –54V
ISOLATED
GND
–54V
100Ω
100Ω
GP0
GP1
MID
RESET
MSD
INT
AUTO
SCL
AD0
AD1
AD2
AD3
AD6
DGND
V
EE
VSSK
CAP1
CAP2
DND
DPD
CND
CPD
DNA
AGND
DPA
CNA
CPA
OUT12
OUT1
GATE1
SENSE1
GATE12
SENSE12
XIO0 XIO1
42701 F16
SDAIN
SDAOUT
LTC4271
LTC4270
V
DD33
3.3V 0.1µF F
F
SMCJ58A
+
>47µF
SYSTEM
BULK CAP
S1B
1
11
12
2
T1
0.25Ω, 1%
RS
0.22µF
100V
X7R
S1B
FDMC3612
0.01µF
200V
0.01µF
200V
0.01µF
200V
0.01µF
200V
75Ω75Ω
75Ω75Ω
1
2
3
4
5
6
7
8
RJ45
CONNECTOR
PHY
(NETWORK
PHYSICAL
LAYER
CHIP)
SMAJ58A
F
0.1µF
–54V
ISOLATED
2nF 2kV
F
100V
X7R
10Ω
LTC4270/LTC4271
29
42701fd
For more information www.linear.com/LTC4270
PACKAGE DESCRIPTION
4.00 0.10
(4 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION
(WGGD-X)—TO BE APPROVED
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE, IF PRESENT
PIN 1
TOP MARK
(NOTE 6)
0.40 0.10
2423
1
2
BOTTOM VIEW—EXPOSED PAD
2.45 0.10
(4-SIDES)
0.75 0.05
R = 0.115
TYP
0.25 0.05
0.50 BSC
0.200 REF
0.00 – 0.05
(UF24) QFN 0105
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0.70 0.05
0.25 0.05
0.50 BSC
2.45 0.05
(4 SIDES)
3.10 0.05
4.50 0.05
PACKAGE OUTLINE
PIN 1 NOTCH
R = 0.20 TYP OR
0.35 × 45° CHAMFER
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
UF Package
24-Lead Plastic QFN (4mm × 4mm)
(Reference LTC DWG # 05-08-1697)
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
LTC4270/LTC4271
30
42701fd
For more information www.linear.com/LTC4270
PACKAGE DESCRIPTION
UKG Package
52-Lead Plastic QFN (7mm × 8mm)
(Reference LTC DWG # 05-08-1729 Rev Ø)
7.00 0.10
(2 SIDES)
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
PIN 1 TOP MARK
(SEE NOTE 6)
PIN 1 NOTCH
R = 0.30 TYP OR
0.35 × 45°C
CHAMFER
0.40 0.10
5251
1
2
BOTTOM VIEW—EXPOSED PAD
TOP VIEW
SIDE VIEW
6.50 REF
(2 SIDES)
8.00 0.10
(2 SIDES)
5.50 REF
(2 SIDES)
0.75 0.05
0.75 0.05
R = 0.115
TYP
R = 0.10
TYP
0.25 0.05
0.50 BSC
0.200 REF
0.00 – 0.05
6.45 0.10
5.41 0.10
0.00 – 0.05
(UKG52) QFN REV Ø 0306
5.50 REF
(2 SIDES)
5.41 0.05
6.45 0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.70 0.05
6.10 0.05
7.50 0.05
6.50 REF
(2 SIDES)
7.10 0.05 8.50 0.05
0.25 0.05
0.50 BSC
PACKAGE OUTLINE
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.

LTC4270BIUKG#PBF

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Power Switch ICs - POE / LAN PoE+ 25.5W 12-Port PSE Controller (Ethernet interface)
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union