NXP Semiconductors
MF1S50YYX_V1
MIFARE Classic EV1 1K - Mainstream contactless smart card IC for fast and easy solution development
MF1S50yyX_V1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved.
Product data sheet Rev. 3.2 — 23 May 2018
COMPANY PUBLIC 279232 3 / 36
5 Ordering information
Table 2. Ordering information
PackageType number
Name Description Version
MF1S5001XDUD/V1 FFC Bump 8 inch wafer, 120 μm thickness, on film frame carrier, electronic fail die
marking according to SECS-II format), Au bumps, 7-byte UID
-
MF1S5001XDUD2/V1 FFC Bump 12 inch wafer, 120 μm thickness, on film frame carrier, electronic fail die
marking according to SECS-II format), Au bumps, 7-byte UID
-
MF1S5001XDUF/V1 FFC Bump 8 inch wafer, 75 μm thickness, on film frame carrier, electronic fail die
marking according to SECS-II format), Au bumps, 7-byte UID
-
MF1S5000XDA4/V1 MOA4 plastic leadless module carrier package; 35 mm wide tape, 7-byte UID SOT500-2
MF1S5000XDA8/V1 MOA8 plastic leadless module carrier package; 35 mm wide tape, 7-byte UID SOT500-4
MF1S5031XDUD/V1 FFC Bump 8 inch wafer, 120 μm thickness, on film frame carrier, electronic fail die
marking according to SECS-II format), Au bumps, 4-byte non-unique ID
-
MF1S5031XDUD2/V1 FFC Bump 12 inch wafer, 120 μm thickness, on film frame carrier, electronic fail die
marking according to SECS-II format), Au bumps, 4-byte non-unique ID
-
MF1S5031XDUF/V1 FFC Bump 8 inch wafer, 75 μm thickness, on film frame carrier, electronic fail die
marking according to SECS-II format), Au bumps, 4-byte non-unique ID
-
MF1S5030XDA4/V1 MOA4 plastic leadless module carrier package; 35 mm wide tape,
4-byte non-unique ID
SOT500-2
MF1S5030XDA8/V1 MOA8 plastic leadless module carrier package; 35 mm wide tape,
4-byte non-unique ID
SOT500-4
6 Block diagram
001aan006
RF
INTERFACE
UART
ISO/IEC 14443
TYPE A
LOGIC UNIT
RNG
CRC
EEPROM
CRYPTO1
POWER ON
RESET
VOLTAGE
REGULATOR
CLOCK
INPUT FILTER
RESET
GENERATOR
Figure 2. Block diagram of MF1S50yyX/V1