NXP Semiconductors
MF1S50YYX_V1
MIFARE Classic EV1 1K - Mainstream contactless smart card IC for fast and easy solution development
MF1S50yyX_V1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved.
Product data sheet Rev. 3.2 — 23 May 2018
COMPANY PUBLIC 279232 30 / 36
16 Bare die outline
For more details on the wafer delivery forms, see Ref. 9.
Chip Step (8 inches)
Bump size
aaa-012193
typ. 658
(1)
578
660 715
1. Laser dicing: The air gap and thus the step size may vary due to varying foil expansion
2. All dimensions in µm, pad locations measured from metal ring edge (see detail)
Figure 25. Bare die outline MF1S50yyXDUz/V1
17 Abbreviations
Table 33. Abbreviations and symbols
Acronym Description
ACK ACKnowledge
ATQA Answer To reQuest, Type A
CRC Cyclic Redundancy Check
CT Cascade Tag (value 88h) as defined in ISO/IEC 14443-3 Type A
EEPROM Electrically Erasable Programmable Read-Only Memory
FDT Frame Delay Time
FFC Film Frame Carrier
IC Integrated Circuit
LCR L = inductance, Capacitance, Resistance (LCR meter)
LSB Least Significant Bit
