MPX5100
Sensors
10 Freescale Semiconductor
Pressure
CASE 867-08
ISSUE N
UNIBODY PACKAGE
CASE 867C-05
ISSUE F
UNIBODY PACKAGE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
STYLE 1:
PIN 1. V
OUT
2. GROUND
3. V
CC
4. V1
5. V2
6. V
EX
R
X
123456
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 1.145 1.175 29.08 29.85
B 0.685 0.715 17.40 18.16
C 0.405 0.435 10.29 11.05
D 0.027 0.033 0.68 0.84
F 0.048 0.064 1.22 1.63
G 0.100 BSC 2.54 BSC
J 0.014 0.016 0.36 0.41
K 0.695 0.725 17.65 18.42
L 0.290 0.300 7.37 7.62
N 0.420 0.440 10.67 11.18
P 0.153 0.159 3.89 4.04
Q 0.153 0.159 3.89 4.04
R 0.063 0.083 1.60 2.11
S
U 0.910 BSC 23.11 BSC
V 0.182 0.194 4.62 4.93
W 0.310 0.330 7.87 8.38
X 0.248 0.278 6.30 7.06
PORT #2 VACUUM (P2)
PORT #1 POSITIVE
PORT #1
PIN 1
PORT #2
POSITIVE
VACUUM
PRESSURE
SEATING
PLANE
SEATING
PLANE
–T– –T–
P
G
C
J
N
B
F
D
W
V
L
U
6 PL
S
K
–Q–
–A–
M
Q
M
0.25 (0.010) T
M
A
M
0.13 (0.005)
PRESSURE (P1)
0.220 0.240 5.59 6.10
(P1)
(P2)
PIN 1
F
G
N
L
R
123456
6 PL
D
SEATING
PLANE
-T-
M
A
M
0.136 (0.005) T
POSITIVE PRESSURE
(P1)
C
B
M
J
S
-A-
STYLE 1:
PIN 1. VOUT
2. GROUND
3. VCC
4. V1
5. V2
6. VEX
STYLE 3:
PIN 1. OPEN
2. GROUND
3. +VOUT
4. +VSUPPLY
5. -VOUT
6. OPEN
STYLE 2:
PIN 1. OPEN
2. GROUND
3. -VOUT
4. VSUPPLY
5. +VOUT
6. OPEN
MAX
MILLIMETERSINCHES
16.00
13.56
5.59
0.84
1.63
0.100 BSC 2.54 BSC
0.40
18.42
30˚ NOM 30˚ NOM
12.57
11.43
DIM
A
B
C
D
F
G
J
L
M
N
R
S
MIN
0.595
0.514
0.200
0.027
0.048
0.014
0.695
0.475
0.430
0.090
MAX
0.630
0.534
0.220
0.033
0.064
0.016
0.725
0.495
0.450
0.105
MIN
15.11
13.06
5.08
0.68
1.22
0.36
17.65
12.07
10.92
2.29 2.66
NOTES:
1.
2.
3.
DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
CONTROLLING DIMENSION: INCH.
DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
