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MPX5100DP

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P17
MPX5100
Sensors
Freescale Semiconductor 7
Pressure
Transfer Function (MPX5100A)
Nominal Transfer Value: V
OUT
= V
S
(P x 0.009 - 0.095)
± (Pressure Error x Temp. Mult. x 0.009 x V
S
)
V
S
= 5.0 V ± 0.25 V
Temperature Error Multiplier
MPX5100A
Temp Multiplier
4.0
3.0
2.0
0.0
1.0
-40 -20 0 20 40 60
13012010080 140
- 40 3
0 to 85°C 1
+125° 3
Break Points
Temperature in °C
Note: The Temperature Multiplier is a linear response from 0° to -40°C and from 85° to 125°C.
Series
Pressure Error Band
Pressure in kPa
3.0
2.0
1.0
-1.0
-2.0
-3.0
0.0
0 20 40 60 80 100
130
Pressure Error (max)
15 to 115 kPa ± 2.5 kPa
Error (kPa)
Error Limits for Pressure
MPX5100A
Series
MPX5100
Sensors
8 Freescale Semiconductor
Pressure
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing fluoro silicone gel
which protects the die from harsh media. The MPX pressure
sensor is designed to operate with positive differential
pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
table below.
SURFACE MOUNTING INFORMATION
Minimum Recommended Footprint for Surface Mounted Applications
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct
footprint, the packages will self align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and
shorting between solder
Figure 6. Small Outline Package Footprint
Part Number Case Type Pressure (P1) Side Identifier
MPX5100A, MPX5100D 867 Stainless Steel Cap
MPX5100DP 867C Side with Part Marking
MPX5100AP, MPX5100GP 867B Side with Port Attached
MPXV5100GC6U 482A Side with Port Attached
MPXV5100GC7U 482C Side with Port Attached
MPXV5100DP 1351 Side with Part Marking
MPXV5100GP 1369 Side with Port Attached
MPX5100
Sensors
Freescale Semiconductor 9
Pressure
PACKAGE DIMENSIONS
CASE 482A-01
ISSUE A
SMALL OUTLINE PACKAGE
CASE 482C-03
ISSUE B
SMALL OUTLINE PACKAGE
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 10.540.4250.415 10.79
B 10.540.4250.415 10.79
C 12.700.5200.500 13.21
D 0.960.0420.038 1.07
G 0.100 BSC 2.54 BSC
H 0.002 0.010 0.05 0.25
J 0.009 0.011 0.23 0.28
K 0.061 0.071 1.55 1.80
M 0 7 0 7
N 0.444 0.448 11.28 11.38
S 0.709 0.725 18.01 18.41
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5
TYPICAL DRAFT.
S
D
G
8 PL
4
5
8
1
S
B
M
0.25 (0.010) A
S
T
–A–
–B–
C
M
J
K
PIN 1 IDENTIFIER
H
SEATING
PLANE
–T–
N
V
W
V 0.245 0.255 6.22 6.48
W 0.115 0.125 2.92 3.17
MILLIMETERSINCHES
0.100 BSC 2.54 BSC
DIM
A
B
C
D
G
J
K
M
N
S
V
W
MIN
0.415
0.415
0.500
0.026
0.009
0.100
0˚
0.444
0.540
0.245
0.115
MAX
0.425
0.425
0.520
0.034
0.011
0.120
15˚
0.448
0.560
0.255
0.125
MIN
10.54
10.54
12.70
0.66
0.23
2.54
0˚
11.28
13.72
6.22
2.92
MAX
10.79
10.79
13.21
0.864
0.28
3.05
15˚
11.38
14.22
6.48
3.17
PIN 1
IDENTIFIER
K
SEATING
PLANE
-T-
W
DETAIL X
S
G
4
5
8
1
-A-
-B-
N
C
V
M
J
D
8 PL
S
B
M
0.25 (0.010) A
S
T
DETAIL X
NOTES:
1.
2.
3.
4.
5.
6.
DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
CONTROLLING DIMENSION: INCH.
DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
MAXIMUM MOLD PROTRUSION 0.15 (0.006).
ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
DIMENSION S TO CENTER OF LEAD WHEN
FORMED PARALLEL.
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P17

MPX5100DP

Mfr. #:
Buy MPX5100DP
Manufacturer:
NXP / Freescale
Description:
Board Mount Pressure Sensors PRES SEN INTEG 100KPA
Lifecycle:
New from this manufacturer.
Delivery:
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