MPX5100
Sensors
4 Freescale Semiconductor
Pressure
Maximum Ratings
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip in a Unibody Package.
Figure 1. Fully Integrated Pressure Sensor Schematic for Unibody Package Devices
Figure 2 shows a block diagram of the internal circuitry integrated on a pressure sensor chip in a Small Outline Package.
Figure 2. Fully Integrated Pressure Sensor Schematic for Small Outline Package Devices
Table 2. Maximum Ratings
(1)
1.Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Rating Symbol Value Unit
Maximum Pressure (P1 > P2) P
max
400 kPa
Storage Temperature T
stg
-40° to +125°°C
Operating Temperature T
A
-40° to +125°°C
Sensing
Element
Thin Film
Temperature
Compensation
and
Gain Stage #1
Gain Stage #2
and
Ground
Reference
Shift Circuitry
V
S
V
out
GND
Pins 4, 5, and 6 are NO CONNECTS.
3
1
2
Sensing
Element
Thin Film
Temperature
Compensation
and
Gain Stage #1
Gain Stage #2
and
Ground
Reference
Shift Circuitry
V
S
V
out
GND
Pins 1 and 5-8 are NO CONNECTS.
2
4
3
MPX5100
Sensors
Freescale Semiconductor 5
Pressure
On-chip Temperature Compensation and Calibration
Figure 3 shows the sensor output signal relative to
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
0° to 85°C using the decoupling circuit shown in Figure 5. The
output will saturate outside of the specified pressure range.
Figure 4 illustrates both the Differential/Gauge and the
Absolute Sensing Chip in the basic chip carrier (Case 867). A
fluorosilicone gel isolates the die surface and wire bonds from
the environment, while allowing the pressure signal to be
transmitted to the sensor diaphragm.
The MPX5100 series pressure sensor operating
characteristics, and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media,
other than dry air, may have adverse effects on sensor
performance and long-term reliability. Contact the factory for
information regarding media compatibility in your application.
Figure 3. Output vs. Pressure Differential
Figure 4. Cross Sectional Diagrams (not to scale)
Figure 5 shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D input
of a microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
Figure 5. Recommended Power Supply Decoupling and Output Filtering
(For additional output filtering, please refer to Application Note AN1646.)
Output Voltage (V)
5
4
3
MAX
0
10
20
30
40
50
60
70
80
90
100
2
1
0
110
Span Range (Typ)
Output Range (Typ)
Offset
Pressure (kPa)
(Typ)
MIN
TYP
V
out
= V
S
*(0.009*P+0.04)
± (Pressure Error * Temperature Factor * 0.009 * V
S
)
V
S
= 5.0 V ± 0.25 Vdc
PE = 2.5
TM = 1
TEMP = 0 to 85°C
Fluorosilicone
Gel Die Coat
Wire Bond
Lead Frame
Die
Epoxy Plastic
Case
Differential/Gauge Element
Die Bond
Fluorosilicone Gel
Die Coat
Wire Bond
Lead Frame
Die
Stainless Steel
Metal Cover
Epoxy Plastic
Case
Die Bond
Absolute Element
Stainless Steel
Metal Cover
470 pF
Vs
+5.0 V
0.01 μF
GND
V
OUT
IPS
OUTPUT
1.0 μF
IPS
OUTPUT
MPX5100
Sensors
6 Freescale Semiconductor
Pressure
Transfer Function (MPX5100D, MPX5100G, MPXV5100G
Nominal Transfer Value: V
OUT
= V
S
(P x 0.009 + 0.04)
± (Pressure Error x Temp. Mult. x 0.009 x V
S
)
V
S
= 5.0 V ± 0.25 V
Temperature Error Multiplier
MPX5100D/MPX5100G/MPXV5100G Series
Temp Multiplier
4.0
3.0
2.0
0.0
1.0
-40 -20 0 20 40 60
14012010080
- 40 3
0 to 85°C 1
+125° 3
Break Points
Temperature in °C
Note: The Temperature Multiplier is a linear response from 0° to -40°C and from 85° to 125°C.
Pressure Error Band
Pressure in kPa
3.0
2.0
1.0
-1.0
-2.0
-3.0
0.0
0 20 40 60 80 100
120
Pressure Error (max)
0 to 100 kPa ± 2.5 kPa
Error (kPa)
Error Limits for Pressure
MPX5100D/MPX5100G/MPXV5100G Series

MPX5100DP

Mfr. #:
Manufacturer:
NXP / Freescale
Description:
Board Mount Pressure Sensors PRES SEN INTEG 100KPA
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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