1.4 Sensing Direction and Output Response
Figure 4. Sensitive Axes Orientation and Response to Gravity Stimulus
General Description
Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0,
7/2014.
7
Freescale Semiconductor, Inc.
2 Device Characteristics
2.1 Absolute Maximum Ratings
Absolute maximum ratings are the limits the device can be exposed to without
permanently damaging it. Absolute maximum ratings are stress ratings only; functional
operation at these ratings is not guaranteed. Exposure to absolute maximum ratings
conditions for extended periods may affect reliability.
This device contains circuitry to protect against damage due to high static voltage or
electrical fields. It is advised, however, that normal precautions be taken to avoid
application of any voltages higher than maximum-rated voltages to this high-impedance
circuit.
Table 2. Absolute maximum ratings
Rating Symbol Value Unit
Supply voltage V
DD
–0.3 to +3.6 V
Drop-test height, component D
drop
1.8 m
Operating temperature range T
OP
–40 to +105 °C
Storage temperature range T
STG
–40 to +125 °C
Table 3. ESD and latch-up protection characteristics
Rating Symbol Value Unit
Human body model (HBM) V
HBM
±2000 V
Machine model (MM) V
MM
±200 V
Charge device model (CDM) V
CDM
±500 V
Latch-up current at T = 85 °C I
LU
±100 mA
Caution
This device is sensitive to mechanical shock, improper handling can cause permanent damage to the part.
Caution
This is an ESD sensitive device, improper handling can cause permanent damage to the part.
Device Characteristics
8
Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0,
7/2014.
Freescale Semiconductor, Inc.
2.2 Mechanical Specifications
Table 4. Mechanical characteristics
Parameter Symbol Test Conditions Min Typ Max Unit
Full scale range (FXLN83X1)
FSR
±2 g mode ±2
g
±8 g mode ±8
Full scale range (FXLN83X2)
±4 g mode ±4
±16 g mode ±16
Nominal sensitivity SEN
±2 g range 229.0
mV/g
±4g range 114.5
±8 g range 57.25
±16 g range 28.62
Calibrated sensitivity SEN
CAL
±2 g
V
BYP
/(3.276*gRange) V/g
±4 g
±8 g
±16 g
Calibrated sensitivity error SEN
ERR
±2 g range –5 +5
%
±4 g range –6 +6
Sensitivity change vs.
temperature
1
TCS –0.07 +0.07 %/°C
Cross-axis sensitivity
1
CAS –4.2 +4.2 %
Self-test output change
1
STOC
35(XY)
300(Z)
mg
Zero-g level offset V
OFF
±2 g range 0.705 0.75 0.795
V
±4 g range
0.7125 0.75 0.7875±8 g range
±16 g range
Zero-g level change vs.
temperature
1
TCO
±2 g range –1.2 +1.2
mg/°C
±4 g range –2.0 +2.0
Zero-g level offset, post board
mount
1
OFF
PBM
1 mm (overall thickness),
2-layer, FR4-based PCB
–200 +200 mg
Noise Density
1, 2
N
D
FXLN8371QR1,
FXLN8372QR1
200(XY)
280(Z)
µg/√Hz
FXLN8361QR1,
FXLN8362QR1
130(XY)
200(Z)
µg/√Hz
Operating temperature range
1
T
OP
–40 +105 °C
Notes:
Test conditions (unless otherwise noted):
V
DD
= 2.8 V, unless otherwise noted
T = 25 °C, ±2 g range (for ±2/8 g product), ±4 g range (for ±4/16 g product)
Device Characteristics
Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0,
7/2014.
9
Freescale Semiconductor, Inc.

BRKOUT-FXLN8361Q

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
Sensor Development Tools Acceleration Sensor Development Tools Breakout board FXLN8361Q
Lifecycle:
New from this manufacturer.
Delivery:
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