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PCA2002U/AB/1,026

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30
PCA2002 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 8 — 25 November 2011 16 of 30
NXP Semiconductors
PCA2002
32 kHz watch circuit with programmable output period and pulse width
12. Bare die outline
Fig 10. Bare die outline of PCA2002U (for dimensions see Table 12, for pin location see Table 14)
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
PCA200xU
Wire bond die; 8 bonding pads PCA200xU
A
X
D
e
D
e
1
e
2
E
8
(1)
1
45
detail X
P
2
P
1
P
4
P
3
08-05-21
11-11-15
Notes
1. Die marking code. Figure not drawn to scale.
Table 12. Dimensions of PCA2002U
Original dimensions are in mm.
Unit (mm) A D E e
1
e
2
e
D
P
1
P
2
P
3
P
4
max 0.22 - - - - - 0.099 0.089 0.099 0.089
nom 0.20 1.16 0.86 0.17 0.32 0.96 0.096 0.086 0.096 0.086
min 0.18 - - - - - 0.093 0.083 0.093 0.083
PCA2002 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 8 — 25 November 2011 17 of 30
NXP Semiconductors
PCA2002
32 kHz watch circuit with programmable output period and pulse width
Fig 11. Bare die outline PCA2002CX (WLCSP8) (for dimensions see Table 13, for pin location see Table 14)
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
PCA200xCX
WLCSP8: wafer level chip-size package; 8 bumps PCA200xCX
X
detail X
A
A
2
A
1
10-08-18
11-11-15
D
b
E
e
D
e
1
e
2
(1)
Notes
1. Die marking code. Figure not drawn to scale.
8
1
45
Table 13. Dimensions of PCA200xCX
Original dimensions are in mm.
Unit (mm) A A
1
A
2
b D E e
1
e
2
e
D
PCA2002CX8/5/1
max -0.090-0.12-----
nom 0.762 0.075 0.69 0.10 1.16 0.86 0.17 0.32 0.96
min -0.060-0.08-----
PCA2002CX8/12/1
max 0.3100.0900.220.12-----
nom 0.275 0.075 0.20 0.10 1.16 0.86 0.17 0.32 0.96
min 0.2400.0600.180.08-----
PCA2002 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 8 — 25 November 2011 18 of 30
NXP Semiconductors
PCA2002
32 kHz watch circuit with programmable output period and pulse width
[1] All coordinates are referenced, in m, to the center of the die (see Figure 10 and Figure 11).
[2] The substrate (rear side of the chip) is connected to V
SS
. Therefore, the die pad must be either floating or
connected to V
SS
.
[3] Pad i.c. is used for factory test; in normal operation it must be left open-circuit, and it has an internal
pull-down resistor connected to V
SS
.
Table 14. Bonding pad and solder bump description
Symbol Pin X
[1]
Y
[1]
Type Description
V
SS
[2]
1 480 +330 supply ground
i.c.
[3]
2 480 +160 - internally connected
OSCIN 3 480 160 input oscillator input
OSCOUT 4 480 330 output oscillator output
V
DD
5+480330 supply supply voltage
MOT1 6 +480 160 output motor 1 output
MOT2 7 +480 +160 output motor 2 output
RESET 8 +480 +330 input reset input
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30

PCA2002U/AB/1,026

Mfr. #:
Buy PCA2002U/AB/1,026
Manufacturer:
NXP Semiconductors
Description:
Motor / Motion / Ignition Controllers & Drivers 32KHZ WATCH CIRCUIT
Lifecycle:
New from this manufacturer.
Delivery:
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