M48T512Y, M48T512V Maximum ratings
Doc ID 5747 Rev 7 15/23
4 Maximum ratings
Stressing the device above the ratings listed in the absolute maximum ratings table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the operating sections of
this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
Table 6. Absolute maximum ratings
Caution: Negative undershoots below –0.3 V are not allowed on any pin while in the battery backup
mode.
Symbol Parameter Value Unit
T
A
Ambient operating temperature 0 to 70 °C
T
STG
Storage temperature (V
CC
off, oscillator off) –40 to 85 °C
T
SLD
(1)(2)
1. Soldering temperature of the IC leads is to not exceed 260 °C for 10 seconds. Furthermore, the devices
shall not be exposed to IR reflow nor preheat cycles (as performed as part of wave soldering). ST
recommends the devices be hand-soldered or placed in sockets to avoid heat damage to the batteries.
2. For DIP packaged devices, ultrasonic vibrations should not be used for post-solder cleaning to avoid
damaging the crystal.
Lead solder temperature for 10 seconds 260 °C
V
IO
Input or output voltages –0.3 to V
CC
+0.3 V
V
CC
Supply voltage
M48T512Y –0.3 to 7.0 V
M48T512V –0.3 to 4.6 V
I
O
Output current 20 mA
P
D
Power dissipation 1 W
Obsolete Product(s) - Obsolete Product(s)
