PESDXL4UF_G_W_4 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 04 — 28 February 2008 12 of 17
NXP Semiconductors
PESDxL4UF/G/W
Low capacitance unidirectional quadruple ESD protection diode arrays
9. Packing information
[1] For further information and the availability of packing methods, see Section 13.
[2] T1: normal taping
[3] T4: 90° rotated reverse taping
[4] T2: reverse taping
10. Soldering
Table 10. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number Package Description Packing quantity
3000 4000 5000 8000 10000
PESD3V3L4UF SOT886 4 mm pitch, 8 mm tape and reel; T1
[2]
- - -115 - -
4 mm pitch, 8 mm tape and reel; T4
[3]
- - -132 - -
PESD5V0L4UF SOT886 4 mm pitch, 8 mm tape and reel; T1
[2]
- - -115 - -
4 mm pitch, 8 mm tape and reel; T4
[3]
- - -132 - -
PESD3V3L4UG SOT353 4 mm pitch, 8 mm tape and reel; T1
[2]
-115 - - - -135
4 mm pitch, 8 mm tape and reel; T2
[4]
-125 - - - -165
PESD5V0L4UG SOT353 4 mm pitch, 8 mm tape and reel; T1
[2]
-115 - - - -135
4 mm pitch, 8 mm tape and reel; T2
[4]
-125 - - - -165
PESD3V3L4UW SOT665 2 mm pitch, 8 mm tape and reel - - - -315 -
4 mm pitch, 8 mm tape and reel - -115 - - -
PESD5V0L4UW SOT665 2 mm pitch, 8 mm tape and reel - - - -315 -
4 mm pitch, 8 mm tape and reel - -115 - - -
Reflow soldering is the only recommended soldering method.
Fig 13. Reflow soldering footprint PESDxL4UF (SOT886)
sot886_fr
solder lands
occupied area
solder paste
Dimensions in mm
0.425
(6×)
1.250
0.675
1.700
0.325
(6×)
0.270
(6×)
0.370
(6×)
0.500
0.500
