ADV7401
Rev. B | Page 20 of 20
COMPLIANT TO JEDEC STANDARDS MS-026-BED
OUTLINE DIMENSIONS
TOP VIEW
(PINS DOWN)
1
25
26
51
50
75
76100
0.50
BSC
LEAD PITCH
0.27
0.22
0.17
1.60 MAX
16.20
16.00 SQ
15.80
0.75
0.60
0.45
PIN 1
VIEW A
1.45
1.40
1.35
0.15
0.05
0.20
0.09
0.08
COPLANARITY
VIEW A
ROTATED 90° CCW
SEATING
PLANE
7°
3.5°
0°
14.20
14.00 SQ
13.80
051706-A
Figure 10. 100-Lead Low Profile Quad Flat Package [LQFP]
(ST-100-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
ADV7401BSTZ-80
2
−40°C to +85°C
100-Lead Low Profile Quad Flat Package (LQFP) ST-100-1
ADV7401BSTZ-110
2
−40°C to +85°C
100-Lead Low Profile Quad Flat Package (LQFP) ST-100-1
ADV7401WBSTZ-110
23
−40°C to +85°C
100-Lead Low Profile Quad Flat Package (LQFP) ST-100-1
ADV7401KSTZ-140
2
0°C to 70°C 100-Lead Low Profile Quad Flat Package (LQFP) ST-100-1
EVAL-ADV7401EBZ
2
Evaluation Board
1
The ADV7401 is a Pb-free, environmentally friendly product. It is manufactured using the most up-to-date materials and processes. The coating on the leads of each
device is 100% pure Sn electroplate. The device is suitable for Pb-free applications, and is able to withstand surface-mount soldering at up to 255°C (±5°C). In addition,
it is backward compatible with conventional SnPb soldering processes. This means that the electroplated Sn coating can be soldered with SnPb solder pastes at
conventional reflow temperatures of 220°C to 235°C.
2
Z = RoHS Compliant Part.
3
Automotive Product.
Purchase of licensed I
2
C components of Analog Devices or one of its sublicensed Associated Companies conveys a license for the purchaser under the Philips I
2
C Patent
Rights to use these components in an I
2
C system, provided that the system conforms to the I
2
C Standard Specification as defined by Philips.
©2005–2009 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D05340-0-10/09(B)
