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XC2C256-7FTG256C

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P23
XC2C256 CoolRunner-II CPLD
16 www.xilinx.com DS094 (v3.2) March 8, 2007
Product Specification
R
Ordering Information
Part Number
Pin/Ball
Spacing
θ
JA
(C/Watt)
θ
JC
(C/Watt) Package Type
Package Body
Dimensions I/O
Commercia
l (C)
Industrial
(I)
(1)
XC2C256-6VQ100C 0.5mm 43.1 10.9 Very Thin Quad Flat
Pack
14mm x 14mm 80 C
XC2C256-7VQ100C 0.5mm 43.1 10.9 Very Thin Quad Flat
Pack
14mm x 14mm 80 C
XC2C256-6CP132C 0.5mm 65.0 15.0 Chip Scale Package 8mm x 8mm 106 C
XC2C256-7CP132C 0.5mm 65.0 15.0 Chip Scale Package 8mm x 8mm 106 C
XC2C256-6TQ144C 0.5mm 37.2 7.2 Thin Quad Flat Pack 20mm x 20mm 118 C
XC2C256-7TQ144C 0.5mm 37.2 7.2 Thin Quad Flat Pack 20mm x 20mm 118 C
XC2C256-6PQ208C 0.5mm 36.9 9.7 Plastic Quad Flat
Pack
28mm x 28mm 173 C
XC2C256-7PQ208C 0.5mm 36.9 9.7 Plastic Quad Flat
Pack
28mm x 28mm 173 C
XC2C256-6FT256C 1.0mm 34.6 6.1 Fine Pitch Thin BGA 17mm x 17mm 184 C
XC2C256-7FT256C 1.0mm 34.6 6.1 Fine Pitch Thin BGA 17mm x 17mm 184 C
XC2C256-6VQG100C 0.5mm 43.1 10.9 Very Thin Quad Flat
Pack; Pb-free
14mm x 14mm 80 C
XC2C256-7VQG100C 0.5mm 43.1 10.9 Very Thin Quad Flat
Pack; Pb-free
14mm x 14mm 80 C
XC2C256-6CPG132C 0.5mm 65.0 15.0 Chip Scale Package;
Pb-free
8mm x 8mm 106 C
XC2C256-7CPG132C 0.5mm 65.0 15.0 Chip Scale Package;
Pb-free
8mm x 8mm 106 C
XC2C256-6TQG144C 0.5mm 37.2 7.2 Thin Quad Flat Pack;
Pb-free
20mm x 20mm 118 C
XC2C256-7TQG144C 0.5mm 37.2 7.2 Thin Quad Flat Pack;
Pb-free
20mm x 20mm 118 C
XC2C256-6PQG208C 0.5mm 36.9 9.7 Plastic Quad Flat
Pack; Pb-free
28mm x 28mm 173 C
XC2C256-7PQG208C 0.5mm 36.9 9.7 Plastic Quad Flat
Pack; Pb-free
28mm x 28mm 173 C
XC2C256-6FTG256C 1.0mm 34.6 6.1 Fine Pitch Thin BGA;
Pb-free
17mm x 17mm 184 C
XC2C256-7FTG256C 1.0mm 34.6 6.1 Fine Pitch Thin BGA;
Pb-free
17mm x 17mm 184 C
XC2C256-7VQ100I 0.5mm 43.1 10.9 Very Thin Quad Flat
Pack
14mm x 14mm 80 I
XC2C256-7CP132I 0.5mm 65.0 15.0 Chip Scale Package 8mm x 8mm 106 I
XC2C256-7TQ144I 0.5mm 37.2 7.2 Thin Quad Flat Pack 20mm x 20mm 118 I
XC2C256-7PQ208I 0.5mm 36.9 9.7 Plastic Quad Flat
Pack
28mm x 28mm 173 I
XC2C256-7FT256I 1.0mm 34.6 6.1 Fine Pitch Thin BGA 17mm x 17mm 184 I
XC2C256 CoolRunner-II CPLD
DS094 (v3.2) March 8, 2007 www.xilinx.com 17
Product Specification
R
Device Part Marking
Figure 5: Sample Package with Part Marking
Note: Due to the small size of chip scale packages, the complete ordering part number cannot be included on the package
marking. Part marking on chip scale packages by line are:
• Line 1 = X (Xilinx logo) then truncated part number
• Line 2 = Not related to device part number
• Line 3 = Not related to device part number
1. Line 4 = Package code, speed, operating temperature,
three digits not related to device part number. Package
codes: C5 = CP132, C6 = CPG132.
XC2C256-7VQG100I 0.5mm 43.1 10.9 Very Thin Quad Flat
Pack; Pb-free
14mm x 14mm 80 I
XC2C256-7CPG132I 0.5mm 65.0 15.0 Chip Scale Package;
Pb-free
8mm x 8mm 106 I
XC2C256-7TQG144I 0.5mm 37.2 7.2 Thin Quad Flat Pack;
Pb-free
20mm x 20mm 118 I
XC2C256-7PQG208I 0.5mm 36.9 9.7 Plastic Quad Flat
Pack; Pb-free
28mm x 28mm 173 I
XC2C256-7FTG256I 1.0mm 34.6 6.1 Fine Pitch Thin BGA;
Pb-free
17mm x 17mm 184 I
Notes:
1. C = Commercial (T
A
= 0°C to +70°C); I = Industrial (T
A
= –40°C to +85°C).
Part Number
Pin/Ball
Spacing
θ
JA
(C/Watt)
θ
JC
(C/Watt) Package Type
Package Body
Dimensions I/O
Commercia
l (C)
Industrial
(I)
(1)
Standard Example: XC2C128
Device
Speed Grade
Package Type
Number of Pins
Temperature Range
-6 TQ C144
Pb-
Free Example:
XC2C128 TQ G 144 C
Device
Speed Grade
Package Type
Pb
-Free
Number of Pins
-6
Temperature Range
XC2Cxxx
TQ144
7C
Device Type
Package
Speed
Operating Range
This line not
related to device
part number
R
Part marking for non-chip scale package
XC2C256 CoolRunner-II CPLD
18 www.xilinx.com DS094 (v3.2) March 8, 2007
Product Specification
R
Figure 6: VQ100 Very Thin Quad Flat Pack
VQ100
Top View
GND
I/O
(3)
VCCIO
2
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
V
CCIO
2
I/O
I/O
I/O
GND
TDO
I/O
I/O
I/O
I/O
I/O
I/O
I/O
VCC
I/O
(2)
I/O
(5)
I/O
I/O
GND
I/O
I/O
I/O
I/O
I/O
I/O
VCCIO1
I/O
I/O
I/O
I/O
I/O
I/O
TDI
I/O
TMS
TCK
I/O
I/O
GND
I/O
I/O
I/O
I/O
I/O
GND
I/O
I/O
I/O
I/O
I/O
I/O
GND
I/O
I/O
I/O
I/O
VCC
I/O
I/O
I/O
I/O
I/O
VCCIO
1
I/O
(1)
I/O
(1)
I/O
(1)
I/O
(1)
V
AUX
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
V
CCIO1
GND
I/O
(2)
I/O
(2)
I/O
(4)
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
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21
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76
(1) - Global Output Enab
le
(2) - Global Clock
(3) - Global Set/Reset
(4) - Clock Divide Reset
(5) - Data Gate
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P23

XC2C256-7FTG256C

Mfr. #:
Buy XC2C256-7FTG256C
Manufacturer:
Xilinx
Description:
CPLD - Complex Programmable Logic Devices XC2C256-7FTG256C
Lifecycle:
New from this manufacturer.
Delivery:
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