Integrated Silicon Solution, Inc.
PACKAGING INFORMATION
Plastic TSOP
Package Code: T (Type II)
Plastic TSOP (T - Type II) (MS 25)
Millimeters Inches
Symbol Min Max Min Max
Ref. Std.
N 24/26
A 1.20 0.0472
A1 0.05 0.15 0.002 0.0059
b 0.30 0.51 0.012 0.0201
c 0.12 0.21 0.005 0.0083
D 17.01 17.27 0.670 0.6899
E
1
7.49 7.75 0.295 0.3051
e 1.27 BSC 0.050 BSC
E 9.02 9.42 0.462 0.4701
L 0.40 0.60 0.016 0.0236
α 0° 5° 0° 5°
PK13197T40 Rev. C 08/013/99
Plastic TSOP (T - Type II) (MS 24)
Millimeters Inches
Symbol Min Max Min Max
Ref. Std.
N 40/44
A 1.20 0.0472
A1 0.05 0.15 0.002 0.0059
b 0.30 0.45 0.012 0.0157
c 0.12 0.21 0.005 0.0083
D 18.31 18.51 0.721 0.7287
E
1
10.06 10.26 0.396 0.4040
e 0.80 BSC 0.031 BSC
E 11.56 11.96 0.455 0.4709
L 0.40 0.60 0.016 0.0236
α 0° 8° 0° 8°
Plastic TSOP (T - Type II) (MS 24)
Millimeters Inches
Symbol Min Max Min Max
Ref. Std.
N 44/50
A 1.20 0.0472
A1 0.05 0.15 0.002 0.0059
b 0.30 0.45 0.012 0.0157
c 0.12 0.21 0.005 0.0083
D 20.85 21.05 0.821 0.8287
E
1
10.06 10.26 0.396 0.4040
e 0.80 BSC 0.031 BSC
E 11.56 11.96 0.455 0.4709
L 0.40 0.60 0.016 0.0236
α 0° 8° 0° 8°
ISSI
®
Notes:
1. Controlling dimension: millimeters, unless otherwise
specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D1 and E do not include mold flash protru-
sions and
should be measured from the bottom of the
package
.
4. Formed leads shall be planar with respect to one another
within 0.004 inches at the seating plane.
D
SEATING PLANE
b
e
c
1
N/2
N/2+1N
E1
A1
A
E
L
α
