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ADG3249BRJ-R2

P1-P3P4-P6P7-P9P10-P12P13-P13
REV. 0
ADG3249
–3–
ABSOLUTE MAXIMUM RATINGS*
(T
A
= 25°C, unless otherwise noted.)
V
CC
to GND . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to +4.6 V
Digital Inputs to GND . . . . . . . . . . . . . . . . . –0.5 V to +4.6 V
DC Input Voltage . . . . . . . . . . . . . . . . . . . . . –0.5 V to +4.6 V
DC Output Current . . . . . . . . . . . . . . . . . 25 mA per Channel
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . – 65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
␪
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 206°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . . . 300°C
IR Reflow, Peak Temperature (<20 sec) . . . . . . . . . . . . 235°C
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
PIN CONFIGURATION
8-Lead SOT-23
TOP VIEW
(Not to Scale)
8
7
6
5
1
2
3
4
ADG3249
GND
A1
EN
IN
SEL
V
CC
A0
B
ORDERING GUIDE
Model Temperature Range Package Description Package Branding
ADG3249BRJ-R2 –40°C to +85°CSOT-23 (Small Outline Transistor Package) RJ-8 SHA
ADG3249BRJ-REEL –40°C to +85°CSOT-23 (Small Outline Transistor Package) RJ-8 SHA
ADG3249BRJ-REEL7 –40°C to +85°CSOT-23 (Small Outline Transistor Package) RJ-8 SHA
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
ADG3249 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended
to avoid performance degradation or loss of functionality.
Table II. Truth Table
EN IN SEL* FUNCTION
HXX Disconnect
LLLA0 = B; 3.3 V to 1.8 V Level Shifting
LLHA0 = B; 3.3 V to 2.5 V/2.5 V to 1.8 V Level Shifting
LHLA1 = B; 3.3 V to 1.8 V Level Shifting
LHHA1 = B; 3.3 V to 2.5 V/2.5 V to 1.8 V Level Shifting
*SEL = 0 V only when V
DD
= 3.3 V 10%
Table I. Pin Function Descriptions
Pin No. Mnemonic Description
1 EN Enable (Active Low)
2A0 Port A0, Input or Output
3A1 Port A1, Input or Output
4 GND Ground Reference
5B Port B, Input or Output
6INChannel Select
7 SEL Level Translation Select
8V
CC
Positive Power Supply Voltage
REV. 0–4–
ADG3249
TERMINOLOGY
V
CC
Positive Power Supply Voltage.
GND Ground (0 V) Reference.
V
INH
Minimum Input Voltage for Logic 1.
V
INL
Maximum Input Voltage for Logic 0.
I
I
Input Leakage Current at the Control Inputs.
I
OZ
OFF State Leakage Current. It is the maximum leakage current at the switch pin in the OFF state.
I
OL
ON State Leakage Current. It is the maximum leakage current at the switch pin in the ON state.
V
P
Maximum Pass Voltage. The maximum pass voltage relates to the clamped output voltage of an NMOS device when
the switch input voltage is equal to the supply voltage.
R
ON
Ohmic Resistance Offered by a Switch in the ON State. It is measured at a given voltage by forcing a specified
amount of current through the switch.
⌬R
ON
ON Resistance Match between Any Two Channels, i.e., R
ON
max to R
ON
min.
C
X
OFF OFF Switch Capacitance.
C
X
ON ON Switch Capacitance.
C
IN
, C
SEL
, C
EN
Control Input Capacitance. This consists of IN, SEL, and EN.
I
CC
Quiescent Power Supply Current. This current represents the leakage current between the V
CC
and ground pins.
It is measured when all control inputs are at a logic high or low level and the switches are OFF.
⌬I
CC
Extra power supply current component for the EN control input when the input is not driven at the supplies.
t
PLH
, t
PHL
Data Propagation Delay through the Switch in the ON State. Propagation delay is related to the RC time constant
R
ON
× C
L
, where C
L
is the load capacitance.
t
PZH
, t
PZL
Bus Enable Times. These are the times taken to cross the V
T
voltage at the switch output when the switch turns on
in response to the control signal, EN.
t
PHZ
, t
PLZ
Bus Disable Times. These are the time taken to place the switch in the high impedance OFF state in response to the
control signal. They are measured as the time taken for the output voltage to change by V
⌬
from the original
quiescent level, with reference to the logic level transition at the control input. (Refer to Figure 3 for enable
and disable times.)
t
BBM
On or Off Time. Measured between the 90% points of both switches when switching fom one to another.
t
TRANS
Time taken to switch from one channel to the other, measured from 50% of the IN signal to 90% of the
OUT signal.
Max Data Rate Maximum Rate at which Data Can Be Passed through the Switch.
Channel Jitter Peak-to-Peak Value of the Sum of the Deterministic and Random Jitter of the Switch Channel.
REV. 0
Typical Performance Characteristics–ADG3249
–5–
V
A
/V
B
(V
)
R
ON
(
)
0
0 0.5
T
A
= 25C
SEL = V
CC
5
10
15
20
25
30
35
40
1.5 2.5 3.5
V
CC
= 3V
V
CC
= 3.3V
V
CC
= 3.6V
3.02.01.0
TPC 1. On Resistance vs.
Input Voltage
V
A
/V
B
(V)
R
ON
()
0
0 0.5
5
10
15
20
1.5
2.01.0
25C
85C
40C
= 3.3V
SEL = V
CC
V
CC
TPC 4. On Resistance vs. Input
Voltage for Different Temperatures
V
A
/V
B
(V)
V
OUT
(V)
0
0 0.5
0.5
1.5
2.5
1.5 2.5
V
CC
= 2.7V
V
CC
= 2.5V
V
CC
= 2.3V
T
A
= 25C
SEL = V
CC
I
O
= –5A
2.0
1.0
1.0 2.0 3.0
TPC 7. Pass Voltage vs. V
CC
V
A
/V
B
(V
)
R
ON
(
)
0
0 0.5
5
10
15
20
25
30
35
40
1.5 2.5
V
CC
= 2.3V
V
CC
= 2.5V
V
CC
= 2.7V
T
A
= 25C
SEL = V
CC
3.02.01.0
TPC 2. On Resistance vs.
Input Voltage
V
A
/V
B
(V)
R
ON
()
0
0 0.5
5
10
15
85C
25C
1.0
40C
= 2.5V
SEL = V
CC
V
CC
1.2
TPC 5. On Resistance vs. Input
Voltage for Different Temperatures
V
A
/V
B
(V)
V
OUT
(V)
0
0 0.5
0.5
1.5
2.5
1.5 2.5
V
CC
= 3.6V
V
CC
= 3.3V
V
CC
= 3V
3.5
T
A
= 25C
SEL = 0V
I
O
= –5A
2.0
1.0
1.0 2.0 3.0
TPC 8. Pass Voltage vs. V
CC
V
A
/V
B
(V
)
R
ON
(
)
0
0 0.5
5
10
15
20
25
30
35
40
1.5 2.5
V
CC
= 3V
V
CC
= 3.3V
V
CC
= 3.6V
3.5
T
A
= 25C
SEL = 0V
1.0 2.0 3.0
TPC 3. On Resistance vs.
Input Voltage
V
A
/V
B
(V)
V
OUT
(V)
0
0 0.5
0.5
1.5
2.5
1.5 2.5 3.5
V
CC
= 3.6V
V
CC
= 3.3V
V
CC
= 3V
3.0
2.0
1.0
1.0 2.0 3.0
T
A
= 25C
SEL = V
CC
I
O
= –5A
TPC 6. Pass Voltage vs. V
CC
300
051015 20 25 30 35 40 45
ENABLE FREQUENCY (MHz)
I
CC
(A)
50
50
100
150
200
250
0
V
CC
= 3.3V
SEL = 0V
V
CC
= SEL = 3.3V
V
CC
= SEL = 2.5V
T
A
= 25C
TPC 9. I
CC
vs. Enable Frequency
P1-P3P4-P6P7-P9P10-P12P13-P13

ADG3249BRJ-R2

Mfr. #:
Buy ADG3249BRJ-R2
Manufacturer:
Analog Devices Inc.
Description:
Multiplexer Switch ICs 2.5V/3.3V 2:1 w/ Bus Switch
Lifecycle:
New from this manufacturer.
Delivery:
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