Philips Semiconductors
PHP/PHB/PHD14NQ20T
TrenchMOS™ standard level FET
Product data Rev. 03 — 11 March 2002 4 of 14
9397 750 09535
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
4. Thermal characteristics
4.1 Transient thermal impedance
Table 3: Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
th(j-mb)
thermal resistance from junction to mounting
base
Figure 4 - - 1.2 K/W
R
th(j-a)
thermal resistance from junction to ambient vertical in still air; SOT78 package - 60 - K/W
SOT404 and SOT428 packages;
SOT404 minimum footprint; mounted on
a PCB
- 50 - K/W
Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse duration.
10
1
10
-1
10
-2
Z
th (j-mb)
(K/W)
11010
-1
10
-2
10
-3
10
-4
10
-5
10
-6
t
p
(s)
t
p
t
p
T
P
t
T
δ
=
δ = 0.5
δ = 0.2
δ = 0.1
δ = 0.02
δ = 0.05
single pulse
003aaa220
Philips Semiconductors
PHP/PHB/PHD14NQ20T
TrenchMOS™ standard level FET
Product data Rev. 03 — 11 March 2002 5 of 14
9397 750 09535
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
5. Characteristics
Table 4: Characteristics
T
j
=25
°
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Static characteristics
V
(BR)DSS
drain-source breakdown voltage I
D
= 250 µA; V
GS
=0V
T
j
=25°C 200 - - V
T
j
= 55 °C 178 - - V
V
GS(th)
gate-source threshold voltage I
D
= 1 mA; V
DS
=V
GS
;
Figure 9
T
j
=25°C234V
T
j
= 175 °C1--V
T
j
= 55 °C--6V
I
DSS
drain-source leakage current V
DS
= 200 V; V
GS
=0V
T
j
=25°C - 0.05 10 µA
T
j
= 175 °C - - 500 µA
I
GSS
gate-source leakage current V
GS
= ±10 V; V
DS
= 0 V - 10 100 nA
R
DSon
drain-source on-state resistance V
GS
= 10 V; I
D
=7A;
Figure 7 and 8
T
j
=25°C - 150 230 m
T
j
= 175 °C - - 633 m
Dynamic characteristics
g
fs
forward transconductance V
DS
=25V; I
D
=7A;
Figure 14
6 12.1 - S
Q
g(tot)
total gate charge I
D
= 14 A; V
DD
= 160 V;
V
GS
=10V;Figure 13
-38-nC
Q
gs
gate-source charge - 4 - nC
Q
gd
gate-drain (Miller) charge - 13.3 - nC
C
iss
input capacitance V
GS
=0V; V
DS
= 25V;
f = 1 MHz; Figure 11
- 1500 - pF
C
oss
output capacitance - 128 - pF
C
rss
reverse transfer capacitance - 60 - pF
t
d(on)
turn-on delay time V
DD
=30V; R
D
=10;
V
GS
= 10 V; R
GS
=50;
R
gen
=50
-25-ns
t
r
rise time - 40 - ns
t
d(off)
turn-off delay time - 83 - ns
t
f
fall time - 31 - ns
Source-drain diode
V
SD
source-drain (diode forward)
voltage
I
S
= 14 A; V
GS
=0V;
Figure 12
- 1.0 1.5 V
t
rr
reverse recovery time I
S
=14A;
dI
S
/dt = 100 A/µs;
V
GS
=0V; V
R
=30V
- 135 - ns
Q
r
recovered charge - 690 - nC
Philips Semiconductors
PHP/PHB/PHD14NQ20T
TrenchMOS™ standard level FET
Product data Rev. 03 — 11 March 2002 6 of 14
9397 750 09535
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
T
j
=25°CT
j
=25°C and 175 °C; V
DS
> I
D
× R
DSon
Fig 5. Output characteristics: drain current as a
function of drain-source voltage; typical values.
Fig 6. Transfer characteristics: drain current as a
function of gate-source voltage; typical values.
T
j
=25°C
Fig 7. Drain-source on-state resistance as a function
of drain current; typical values.
Fig 8. Normalized drain source on-state resistance
factor as a function of junction temperature.
6 V
5 V
V
GS
= 10 V
5.5 V
4.5 V
30
20
10
0
I
D
(A)
1086420
V
DS
(V)
003aaa221
8
16
24
0
30
0
2
4
6
8
I
D
(A)
T
j
= 25
ο
C
T
j
= 175
ο
C
V
GS
(V)
003aaa223
20010515
I
D
(A)
R
DSon
()
0.8
0.6
0.4
0.2
0
V
GS
= 10 V
6 V
4.5 V
5 V
5.5 V
003aaa222
180
-60
1
1.5
2
2.5
3
0.5
20
100
a
T
j
(
ο
C)
003aaa225
a
R
DSon
R
DSon 25°C()
------------------------------
=

PHD14NQ20T,118

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
MOSFET N-CH 200V 14A DPAK
Lifecycle:
New from this manufacturer.
Delivery:
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