Data Sheet ADA4930-1/ADA4930-2
Rev. B | Page 7 of 25
ABSOLUTE MAXIMUM RATINGS
Table 7.
Parameter Rating
Supply Voltage 5.5 V
Power Dissipation See Figure 4
Storage Temperature Range −65°C to +125°C
Operating Temperature Range −40°C to +105°C
Lead Temperature (Soldering, 10 sec) 300°C
Junction Temperature 150°C
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
θ
JA
is specified for the device (including exposed pad) soldered
to a high thermal conductivity 2s2p circuit board, as described
in EIA/JESD51-7.
Table 8. Thermal Resistance
Package Type θ
JA
Unit
16-Lead LFCSP (Exposed Pad) 98 °C/W
24-Lead LFCSP (Exposed Pad) 67 °C/W
MAXIMUM POWER DISSIPATION
The maximum safe power dissipation in the ADA4930-1/
ADA4930-2 packages is limited by the associated rise in
junction temperature (T
J
) on the die. At approximately 150°C,
which is the glass transition temperature, the plastic changes its
properties. Even temporarily exceeding this temperature limit
can change the stresses that the package exerts on the die,
permanently shifting the parametric performance of the
ADA4930-1/ADA4930-2. Exceeding a junction temperature of
150°C for an extended period can result in changes in the
silicon devices, potentially causing failure.
The power dissipated in the package (P
D
) is the sum of the
quiescent power dissipation and the power dissipated in the
package due to the load drive. The quiescent power is the voltage
between the supply pins (V
S
) times the quiescent current (I
S
).
The power dissipated due to the load drive depends upon the
particular application. The power due to load drive is calculated
by multiplying the load current by the associated voltage drop
across the device. RMS voltages and currents must be used in
these calculations.
Airflow increases heat dissipation, effectively reducing θ
JA
. In
addition, more metal directly in contact with the package leads/
exposed pad from metal traces, through holes, ground, and
power planes reduces θ
JA
.
Figure 4 shows the maximum safe power dissipation vs. the
ambient temperature for the ADA4930-1 single 16-lead LFCSP
(98°C/W) and the ADA4930-2 dual 24-lead LFCSP (67°C/W)
on a JEDEC standard 4-layer board.
3.5
0
–40 11090 100
MAXIMUM POWER DISSIPATION (W)
TEMPERATURE (°C)
0.5
1.0
1.5
2.0
2.5
3.0
–30–20–100 1020304050607080
ADA4930-2
ADA4930-1
09209-004
Figure 4. Maximum Power Dissipation vs. Ambient Temperature,
4-Layer Board
ESD CAUTION
