FGH60T65SQD−F155
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2
ABSOLUTE MAXIMUM RATINGS
Symbol Description FGH60T65SQD−F155 Unit
V
CES
Collector to Emitter Voltage 650 V
V
GES
Gate to Emitter Voltage ±20 V
Transient Gate to Emitter Voltage ±30 V
I
C
Collector Current
@ TC < 25°C 120
A
@ TC < 100°C 60
I
LM
(Note 1)
Pulsed Collector Current @ TC < 25°C 240 A
I
CM
(Note 2)
Pulsed Collector Current 240 A
I
F
Diode Forward Current @ TC < 25°C 60 A
Diode Forward Current @ TC < 100°C 30 A
I
FM
(Note 2)
Repetitive Forward Surge Current 240 A
P
D
Maximum Power Dissipation
@ TC < 25°C 333 W
@ TC < 100°C 167 W
T
J
Operating Junction Temperature Range −55 to +175 °C
T
STG
Storage Temperature Range −55 to +175 °C
T
L
Maximum Lead Temp. For soldering Purposes, 18” from case for 5 sec 300 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. V
CC
= 400 V, V
GE
= 15 V, I
C
= 240 A, R
G
= 21 W, Inductive Load.
2. Repetitive rating: Pulse width limited by max. junction temperature.
THERMAL CHARACTERISTICS
Symbol Parameter FGH60T65SQD−F155 Unit
R
q
JC
(IGBT)
Thermal Resistance, Junction to Case, Max. 0.45
_C/W
R
q
JC
(Diode)
Thermal Resistance, Junction to Case, Max. 1.25
_C/W
R
q
JA
Thermal Resistance, Junction to Ambient, Max. 40
_C/W
PACKAGE MARKING AND ORDERING INFORMATION
Part Number Top Mark Package Packing Method Reel Size Tape Width Quantity
FGH60T65SQD−F155 FGH60T65SQD TO−247−3LD Tube − − 30