NIS5102
http://onsemi.com
14
PACKAGE DIMENSIONS
PLLP-12, 9x9 mm
CASE 488AB-01
ISSUE C
SOLDERING FOOTPRINT*
9.305
12 X
5.652
1.054
12 X
0.551
7.652
1.270 PITCH
Dimensions in mm
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
STYLE 1:
PIN 1. OVLO
2. UVLO
3. ENABLE/TIMER
4. GND
5. CCHARGE
6. CURRENT LIMIT
7. POWER GOOD
8. N/C
9. N/C
10. SOURCE
11. SOURCE
12. SOURCE
DIM MIN MAX
MILLIMETERS
A 1.750 1.950
A1 0.000 0.050
A3 0.254 REF
b 0.400 0.600
D 9.000 BSC
E 9.000 BSC
e 1.270 BSC
D2 5.400 5.600
E2 7.400 7.600
K 0.850 REF
L 0.850 0.950
NOTES:
1. DIMENSIONS AND TOLERANCING PER
ASME Y14.5M, 1994.
2. DIMENSIONS IN MILLIMETERS.
3. COPLANARITY APPLIES TO THE LEAD,
DIMENSION B, AND EXPOSED PAD.
D
E
B
A
4 X
PIN ONE
SEATING
LOCATION
0.08 C
0.15 C
D2
E2
b
K
12 X
L12 X
10 X e
e/2
12 X
A
M
0.10 BC
M
0.05 C
TOP VIEW
BOTTOM VIEW
SIDE VIEW
(A3)
A1
A
C
0.10
C
PLANE
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PUBLICATION ORDERING INFORMATION
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Phone: 81-3-5773-3850
NIS5102/D
The product described herein (NIS5102), may be covered by one or more of the following U.S. patents: 6,781,502; 6,865,063; 7,099,135. There may be other
patents pending. SMART HotPlug and SENSEFET are trademarks of Semiconductor Components Industries, LLC.
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