BelaSigna R262
www.onsemi.com
22
hardware setup (for custom configuration of the various
hardware units like clocking, input/output stages),
algorithm setup (amplitude management, tuning selection)
and finally the low*level I
2
C protocol is also supported.
The I
2
C interface can also be used to communicate with
a slave I
2
C EEPROM. Using an I
2
C EEPROM instead of an
SPI EEPROM provides better flexibility as it avoids
potential conflicts between GPIO/LSAD pins and the SPI
pins. More details on this command interface can be found
in the BelaSigna R262 Communications and Configuration
Guide.
Interfaces Unused by the ROM−based Application
BelaSigna R262 also contains hardware provisions for a
high speed PCM interface, as well as a high speed UART.
These two interfaces are not used by the ROM−based
application, hence cannot be used by default. Custom
applications developed by ON Semiconductor could enable
the use of these interfaces, should this be required.
Miscellaneous
Chip Identification
Chip identification information can be retrieved by using
the Promira Serial Interface or Communications
Accelerator Adaptor (CAA) along with protocol software
provided by ON Semiconductor. For BelaSigna R262, the
key identifier components and values are as follows:
Chip Family Chip Version
0x02 (SK2) 0x3021
Long Term Storage Conditions
ON Semiconductor specifies a 24−month maximum
storage time for WLCSP devices in pocket tapes and
conditioned in dry bags, as stated in Table 14 below and
defined by ON Semiconductor’s guidelines on long term
storage.
Table 14. LONG TERM STORAGE CONDITIONS
Storage Condition Maximum Storage Time Remarks
Temperature 18−28°C,
Humidity 30−65%RH
24 months after die
singulation/sawing date
Maximum 12 months storage at condition 18−28°C, 30−65%RH. After-
wards storage in vacuum moisture bag with desiccant and humidity card.
Storage in nitrogen cabinet allowed.
Device Weight
BelaSigna R262 has an average weight of 10.84 mg.
Re−Flow Information
BelaSigna R262 is a Green, Pb−Free device. Download
SOLDERRM/D − Soldering and Mounting Techniques
Reference Guide.
Assembly / Design Notes
For PCB manufacture BelaSigna R262, any vias that
might be placed below the WLCSP should all be covered in
soldermask. The assembly process can use underfill under
the WLCSP; it will provide another physical dielectric
barrier, and will also enhance long term reliability over
temperature and physical shock.
ON Semiconductor can provide BelaSigna R262
mounting footprint guidelines to assist your PCB design
upon request. For additional information on the use of Chip
Scale Packages and for advanced guidelines on mounting
such devices to a PCB, please download AND8081/D −
Flip−Chip CSP Packages from www.onsemi.com.
Table 15. ORDERING INFORMATION
Device Marking Package Shipping
†
BR262W26A103E1G BR262W26 WLCSP26
(Pb−Free)
2500 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specification Brochure, BRD8011/D.
