BelaSigna R262
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4
Table 2. ELECTRICAL CHARACTERISTICS (The typical parameters in Table 2 were measured at 20°C with a clean
3.3 V supply voltage (unless noted differently). Parameters marked as screened are tested on each chip. Other parameters are qualified
for all process corners but not tested on every part.)
Parameter
Symbol Test Conditions / Notes Min Typ Max Unit Screened
DIGITAL MICROPHONE OUTPUT
DMIC input clock frequency
With preset 0 selected on
CLOCK_SEL (Note 3)
2.048 MHz
With preset 3 selected on
CLOCK_SEL (Note 3)
2.4 MHz
With preset 4 selected on
CLOCK_SEL (Note 3)
2.8 MHz
With preset 5 selected on
CLOCK_SEL (Note 3)
3.072 MHz
Clock duty cycle Any clock configuration 40 50 60 %
Input clock jitter Maximum allowed jitter on the
DMIC_CLK
10 ns
Clock to output transition time DMIC_OUT 10 20 50 ns
ANALOG OUTPUT STAGE
Signal Range
Vout
One single ended DAC used 0 2 Vpp
Two DACs used as one
differential output
0 4 Vpp
Attenuator gain tolerance −2 2 dB
Output impedance Rout
@ 12 dB output attenuation 19
kW l
@ 0 dB output attenuation 3
kW
Channel cross coupling @ 1 kHz −50 dB
Analog Filter cut−off frequency
LPF Enabled (default) 13.0 13.5 kHz
LPF Disabled 25 26 kHz
Analog Filter passband flatness −1 1 dB
Analog filter stopband
attenuation
> 60 kHz 90 dB
Digital Filter cut−off frequency Fs/2 kHz
Digital Filter cut−off stopband
attenuation
80 dB
Total Harmonic Distortion +
Noise (Peak value)
THDN 63 65 dB
l
Dynamic Range DR 78 80 dB
l
Noise Floor 70 100
mV l
DIRECT DIGITAL OUTPUT (available only through custom configuration)
Supply voltage
VBATRCVR 1.8 3.3 3.63 V
Signal Range Vout
Differential Output @ 1 kHz 0 2*VBAT
RCVR
Vpp
Single ended Output @ 1 kHz 0 VBAT
RCVR
Vpp
Output Impedance Rout Load between
1 mA and 30 mA @ 0°C
2.5 10
W
Maximum Current 25 mA
Total Harmonic Distortion +
Noise (Peak value)
THDN 64 70 dB
l
3. Many other clock frequencies are available through custom configuration of the internal PLL and clocking subsystem. See later in this
document and in the BelaSigna R262 Communications and Configuration Guide for more information on custom mode usage.
BelaSigna R262
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5
Table 2. ELECTRICAL CHARACTERISTICS (continued) (The typical parameters in Table 2 were measured at 20°C with a clean
3.3 V supply voltage (unless noted differently). Parameters marked as screened are tested on each chip. Other parameters are qualified
for all process corners but not tested on every part.)
Parameter ScreenedUnitMaxTypMinTest Conditions / NotesSymbol
DIRECT DIGITAL OUTPUT (available only through custom configuration)
Dynamic Range
DR 80 86 dB
l
Noise Floor 50 75
mV l
LOW−SPEED A/D
Input voltage
Vin 0 2*VREG V
Sampling frequency For each LSAD channel 1.6 MCLK/28 4.8 kHz
Input impedance Rin 1
MW
Offset error Input at VREG −10 10 LSB
Gain error Input to VSSA or 2*VREG −10 10 LSB
INL INL −4 4 LSB
DNL DNL −2 2 LSB
DIGITAL PADS (VDDO = 1.8 V)
Voltage level for Low input
VIL −0.3 0.4 V
Voltage level for High input VIH 1.30 1.98 V
Pull−up resistance 63 114 162
kW
Pull−down resistance 87 153 205
kW
Rise and Fall Time 20 pF load 2 3 5 ns
DIGITAL PADS (VDDO = 3.3 V)
Voltage level for Low input
VIL −0.3 0.8 V
l
Voltage level for High input VIH 1.8 3.6 V
l
Pull−up resistance 34 46 74
kW l
Pull−down resistance 29 56 86
kW l
Rise and Fall Time 20 pF load 1.0 1.5 2.0 ns
DIGITAL PADS (Common parameters)
Drive Strength
12 mA
ESD Immunity
HBM Human Body Model 2 kV
MM Machine Model 200 V
Latch−up Immunity 25°C, V < GNDO, V > VDDO 150 mA
CLOCKING CIRCUITRY
External clock frequency
EXT_CLK With preset 6 selected on
CLOCK_SEL (Note 3)
26 MHz
Internal clock frequency INT_CLK
With preset 7 selected on
CLOCK_SEL (Note 3)
Bypass Mode
5.2 MHz
With preset 7 selected on
CLOCK_SEL (Note 3)
Active Mode
48.2 MHz
Reference clock duty cycle 40 50 60 %
External Input clock jitter Maximum allowed jitter on
EXT_CLK
10 ns
I
2
C INTERFACE
Maximum speed
400 kbps
3. Many other clock frequencies are available through custom configuration of the internal PLL and clocking subsystem. See later in this
document and in the BelaSigna R262 Communications and Configuration Guide for more information on custom mode usage.
BelaSigna R262
www.onsemi.com
6
Table 3. PIN CONNECTIONS
Pin Index Pin Name Description A/D/P I/O Active Pull
G1 MIC0 First microphone input A I
E1 MIC2 Second microphone input A I
E3 AI3/VMIC/LOUT0 Direct audio input / microphone bias /
line−out preamp 0
A I/O
E7 A_OUT1 Audio output 1 A O
G7 CAP0 Charge pump capacitor connection A I/O
F8 CAP1 Charge pump capacitor connection A I/O
A1 DEBUG_RX RS232 debug port serial input D I L U
B2 DEBUG_TX RS232 debug port serial output D O L
F2 RESERVED Reserved
A3 EXT_CLK External clock input D I U
A7 SPI_CLK/CLOCK_SEL SPI clock / Clock selection D/A O/I L/−
A9 SPI_CS/BOOT_SEL SPI chip select / Booting method selection D/A O/I
B8 SPI_SERO/CHAN_SEL SPI serial output / Channel selection D/A O/I
C9 SPI_SERI/ALPHA_SEL SPI serial input / Mixing ratio selection D/A I/I U/−
C7 DMIC_OUT Digital microphone output D O
C3 I2C_SDA I
2
C data D IO L U
C1 I2C_SCL I
2
C clock D IO L U
F6 VBAT Power supply P I
G9 VBATRCVR Output driver power supply P I
G5 VDDA Analog supply voltage P O
B6 VDDD Digital power supply P O
B4 VDDO Digital I/O power supply P I
G3 VREG Analog supply voltage P O
F4 VSSA Analog ground P I
A5 VSSD Digital ground P I
E9 VSSRCVR Output driver ground P I
A: Analog pin
D: Digital pin
P: Power pin
I: Input
O: Output
IO: Bi−directional
I/O & O/IL: Input or Output depending on the function being used
L: Active Low
H: Active High
U: Pulled up internally
D: Pulled down internally

BR262CPP01GEVK

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Audio DSPs
Lifecycle:
New from this manufacturer.
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