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STA016T
HANDSHAKE SIGNALS
60 STB I Strobe signal From MCU
59 RQST O I2C data signal To MCU
I
2
C LINK
63 SCL I I2C clock signal From MCU
64 SDA I/O I2C data signal To MCU
MISCELLANEOUS
17 XTI I Oscillator input
18 XTO O Oscillator output
25 CLKOUT O Buffered output clock
15 -RESET I Reset
16 -TESTEN I Reserved for test purpose
40 FILT0 I PLL external filter
38 FILT1 PLL external filter
POWER SUPPLY
39 PLL_VCC Digital supply (2.5V Power Supply)
41 PLL_GND Ground
5 VDD_1 Digital supply (2.5V Power Supply)
10 VDD_2 Digital supply (2.5V Power Supply)
29 VDD_3 Digital supply (2.5V Power Supply)
36 VDD_4 Digital supply (2.5V Power Supply)
53 VDD_5 Digital supply (2.5V Power Supply)
62 VDD_6 Digital supply (2.5V Power Supply)
23 VCC_1 Digital supply (3.3V Power Supply)
42 VCC_2 Digital supply (3.3V Power Supply)
58 VCC_3 Digital supply (3.3V Power Supply)
6 VSS_1 Ground
11 VSS_2 Ground
24 VSS_3 Ground
30 VSS_4 Ground
37 VSS_5 Ground
43 VSS_6 Ground
52 VSS_7 Ground
57 VSS_8 Ground
61 VSS_9 Ground
PIN DESCRIPTION
(continued)
PIN Pin Name Type Description Sourde/Dest
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STA016T
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ELECTRICAL CHARACTERISTCS
(T
amb
= 25°C; R
g
= 50
unless otherwise specified)
DC OPERATING CONDITIONS
GENERAL INTERFACE ELECTRICAL CHARACTERISTICS
Note 1: The leakage currents are generally very small, < 1nA. The value given here is a maximum that can occur after an electrostatic stress
on the pin.
Note 2: Human Body Model.
DC ELECTRICAL CHARACTERISTICS
Note1: Takes into account 200mV voltage drop in both supply lines.
Note 2: X is the source/sink current under worst case conditions and is reflected in the name of the I/O cell according to the drive capability.
Note 1: Min. condition: VDD = 2.7V, 125°C Min process Max. condition: VDD = 3.6V, -20°C Max.
POWER DISSIPATION
Symbol Parameter Value Unit
V
DD
Power Supply Voltage 2.5 ± 0.25 V
V
CC
Power Supply Voltage 3.3 ± 0.3 V
PLL_V
CC
Power Supply Voltage 2.5 ± 0.25 V
Symbol Parameter Test Condition Min. Typ. Max. Unit Note
I
IL
Low Level Input
CurrentWithout pull-up device
V
i
= 0V -10 10 µA1
I
IH
High Level Input
CurrentWithout pull-up device
V
i
= V
DD
-10 10 µA1
V
esd
Electrostatic Protection Leakage < 1µA2000 V2
Symbol Parameter Test Condition Min. Typ. Max. Unit Note
V
IL
Low Level Input Voltage
0.2*V
CC
V
V
IH
High Level Input Voltage
0.8*V
CC
V
V
ol
Low Level Output Voltage I
ol
= Xma 0.4V V 1, 2
V
oh
High Level Output Voltage
0.85*V
CC
V1, 2
Symbol Parameter Test Condition Min. Typ. Max. Unit Note
I
pu
Pull-up current V
i
= 0V; pin numbers 7, 24
and 26
-25 -66 -125 µA1
R
pu
Equivalent Pull-up Resistance 50 k
Symbol Parameter Test Condition Min. Typ. Max. Unit Note
P
D
Power Dissipation@ V
DD
= 2.4V
Sampling_freq 24 kHz t.b.d. mW
Sampling_freq 32 kHz t.b.d. mW
Sampling_freq 48 kHz t.b.d. mW
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STA016T
2 HOST REGISTERS
The following table gives a description of STA016 register list.
The STA016 device includes 256 I
2
C registers. In this document, only the user-oriented registers are described.
The undocumented registers are reserved or unused. These registers must never be accessed (in Read or in
Write mode). The Read-Only registers must never be written
We can split the data flux in different time periods (see following diagram) meanwhile host registers can be read
or written :
DWT : During Whole Time (at any time during process).
DEC : During External Config (period between RUN=2 and RUN=1).
DBO : During Boot (period between RUN=0 and RUN=2).
ABO : After BOot (period after RUN=1).
AEC : After External Config (period after RUN=2).
EDF : Every Decoded Frame (each time a frame has been decoded).
EDB : Every Decoded Block (each time a block has been decoded).
HR RUN==0
SOFT_RESET = 1
CK_CMD = 0
RUN==2 RUN==1
block1
frame1
block2
frame1
block1
frame2
time
DWT
ABO
DECDBO
AEC
EDB EDB
EDF
EDB
D01AU1260
Obsolete Product(s) - Obsolete Product(s)

STA016T

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
IC DECODER AUDIO 2.5 64TQFP
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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