9ZXL1930
19-OUTPUT DB1900Z LOW-POWER DERIVATIVE
IDT®
19-OUTPUT DB1900Z LOW-POWER DERIVATIVE 7
9ZXL1930 REV D 112015
Electrical Characteristics–DIF Low-Power HCSL Differential Outputs
Electrical Characteristics–Current Consumption
TA = T
COM
; Supply Voltage VDD/VDDA = 3.3 V +/-5%, VDDIO = 1.05 to 3.3V +/-5%. See Test Loads for Loading Conditions
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS NOTES
Slew rate Trf Scope averaging on 1 3 4
V/ns
1, 2, 3
Slew rate matchin
g
Trf Slew rate matchin
g
, Scope avera
g
in
g
on 7.6 20
%
1, 2, 4
Voltage High VHigh 660 757 850 1
Voltage Low VLow -150 16 150 1
Max Volta
g
e Vmax 857 1150 1
Min Voltage Vmin -300 -36 1
Vswing Vswing Scope averaging off 300 mV 1, 2
Crossing Voltage (abs) Vcross_abs Scope averaging off 300 469 550 mV 1, 5
Crossing Voltage (var)
-Vcross Scope averaging off 14 140 mV 1, 6
2
Measured from differential waveform
6
The total variation of all Vcross measurements in any particular system. Note that this is a subset of Vcross_min/max (Vcross
absolute) allowed. The intent is to limit Vcross induced modulation by setting
-Vcross to be smaller than Vcross absolute.
mV
Statistical measurement on single-ended signal
using oscilloscope math function. (Scope
averaging on)
Measurement on single ended signal using
absolute value. (Scope averaging off)
mV
1
Guaranteed by design and characterization, not 100% tested in production. C
L
= 2pF with R
S
= 33
for Zo = 50
(100
differential
trace impedance).
3
Slew rate is measured through the Vswing voltage range centered around differential 0V. This results in a +/-150mV window around
differential 0V.
4
Matching applies to rising edge rate for Clock and falling edge rate for Clock#. It is measured using a +/-75mV window centered on
the average cross point where Clock rising meets Clock# falling. The median cross point is used to calculate the voltage thresholds the
oscilloscope is to use for the edge rate calculations.
5
Vcross is defined as voltage where Clock = Clock# measured on a component test board and only applies to the differential rising
edge (i.e. Clock rising and Clock# falling).
TA = T
COM
; Supply Voltage VDD/VDDA = 3.3 V +/-5%, VDDIO = 1.05 to 3.3V +/-5%. See Test Loads for Loading Conditions
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS NOTES
I
DDVDD
All outputs @100MHz, C
L
= 2pF; Zo=85
23 35
mA 1
I
DDVDDA/R
All outputs @100MHz, C
L
= 2pF; Zo=85
12 20
mA 1
I
DDVDDI O
All outputs @100MHz, C
L
= 2pF; Zo=85
151 175
mA 1
I
DDVDDPD
All differential pairs low/low 2.9 6 mA
1,2
I
DDVDDA/RPD
All differential pairs low/low 4.4 6 mA
1,2
I
DDVDDIOPD
All differential pairs low/low 0.05 1.5 mA
1,2
1
Guaranteed by desi
g
n and characterization, not 100% tested in production.
2
With input clock runnin
g
. Stoppin
g
the input clock will result in lower numbers.
Operating Supply Current
Powerdown Current
9ZXL1930
19-OUTPUT DB1900Z LOW-POWER DERIVATIVE
IDT®
19-OUTPUT DB1900Z LOW-POWER DERIVATIVE 8
9ZXL1930 REV D 112015
Electrical Characteristics–Skew and Differential Jitter Parameters
TA = T
COM
; Supply Voltage VDD/VDDA = 3.3 V +/-5%, VDDIO = 1.05 to 3.3V +/-5%. See Test Loads for Loading Conditions
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS NOTES
CLK_IN, DIF[x:0] t
SPO_PLL
Input-to-Output Skew in PLL mode
nominal value @ 25°C, 3.3V
-100 -44 100 ps 1,2,4,5,8
CLK_IN, DIF[x:0] t
PD_BYP
Input-to-Output Skew in Bypass mode
nominal value @ 25°C, 3.3V
2.5 3.6 4.5 ns 1,2,3,5,8
CLK_IN, DIF[x:0] t
DSPO_PLL
Input-to-Output Skew Varation in PLL mode
across volta
g
e and temperature
-50 -2 50 ps 1,2,3,5,8
CLK_IN, DIF[x:0] t
DSPO_BYP
Input-to-Output Skew Varation in Bypass mode
across voltage and temperature
-250 250 ps 1,2,3,5,8
CLK_IN, DIF[x:0] t
DTE
Random Differential Tracking error beween two
9ZX devices in Hi BW Mode
35
ps
(rms)
1,2,3,5,8
CLK_IN, DIF[x:0] t
DSSTE
Random Differential Spread Spectrum Tracking
error beween two 9ZX devices in Hi BW Mode
15 75 ps 1,2,3,5,8
DIF{x:0] t
SKEW_ALL
Output-to-Output Skew across all outputs
(Common to Bypass and PLL mode)
76 85 ps 1,2,3,8
PLL Jitter Peaking j
p
eak-hibw
LOBW#_BYPASS_HIBW = 1 0 1.75 2.5 dB 7,8
PLL Jitter Peaking j
p
eak-lobw
LOBW#_BYPASS_HIBW = 0 0 0.75 2 dB 7,8
PLL Bandwidth pll
HIBW
LOBW#_BYPASS_HIBW = 1 2 3.33 4 MHz 8,9
PLL Bandwidth pll
LOBW
LOBW#_BYPASS_HIBW = 0 0.7 1.18 1.4 MHz 8,9
Duty Cycle t
D
C
Measured differentially, PLL Mode 45 50.4 55 % 1
Duty Cycle Distortion t
DCD
Measured differentially, Bypass Mode
@100MHz
-2 0 2 % 1,10
PLL mode 24 50 ps 1,11
Additive Jitter in Bypass Mode 0 50 ps 1,11
Notes for preceding table:
6.
t is the period of the input clock
7
Measured as maximum pass band gain. At frequencies within the loop BW, highest point of magnification is called PLL jitter peaking.
8.
Guaranteed by desi
g
n and characterization, not 100% tested in production.
9
Measured at 3 db down or half power point.
10
Duty cycle distortion is the difference in duty cycle between the output and the input clock when the device is operated in bypass mode.
11
Measured from differential waveform
Jitter, Cycle to cycle t
jcyc-cyc
1
Measured into fixed 2 pF load cap. Input to output skew is measured at the first output edge following the corresponding input.
2
Measured from differential cross-point to differential cross-point. This parameter can be tuned with external feedback path, if present.
3
All Bypass Mode Input-to-Output specs refer to the timing between an input edge and the specific output edge created by it.
4
This parameter is deterministic for a given device
5
Measured with scope averaging on to find mean value.
9ZXL1930
19-OUTPUT DB1900Z LOW-POWER DERIVATIVE
IDT®
19-OUTPUT DB1900Z LOW-POWER DERIVATIVE 9
9ZXL1930 REV D 112015
Electrical Characteristics–Phase Jitter Parameters
TA = T
COM
; Supply Voltage VDD/VDDA = 3.3 V +/-5%, VDDIO = 1.05 to 3.3V +/-5%. See Test Loads for Loading Conditions
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Notes
t
jp
hPCIeG1
PCIe Gen 1 30 86 ps (p-p) 1,2,3
PCIe Gen 2 Lo Band
10kHz < f < 1.5MHz
1.0 3
ps
(rms)
1,2
PCIe Gen 2 High Band
1.5MHz < f < Nyquist (50MHz)
1.7
3.1
ps
(rms)
1,2
t
jphPCIeG3
PCIe Gen 3
(PLL BW of 2-4MHz, CDR = 10MHz)
0.38
1
ps
(rms)
1,2,4
QPI & SMI
(100MHz or 133MHz, 4.8Gb/s, 6.4Gb/s 12UI)
0.18 0.5
ps
(rms)
1,5
QPI & SMI
(100MHz, 8.0Gb/s, 12UI)
0.13 0.3
ps
(rms)
1,5
QPI & SMI
(100MHz, 9.6Gb/s, 12UI)
0.10 0.2
ps
(rms)
1,5
t
jp
hPCIeG1
PCIe Gen 1 0 10 ps (p-p) 1,2,3
PCIe Gen 2 Lo Band
10kHz < f < 1.5MHz
0.0 0.3
ps
(rms)
1,2,6
PCIe Gen 2 High Band
1.5MHz < f < Nyquist (50MHz)
0.0 0.7
ps
(rms)
1,2,6
t
jphPCIeG3
PCIe Gen 3
(PLL BW of 2-4MHz, CDR = 10MHz)
0.0
0.3
ps
(rms)
1,2,4,6
QPI & SMI
(100MHz or 133MHz, 4.8Gb/s, 6.4Gb/s 12UI)
0.12 0.3
ps
(rms)
1,5,6
QPI & SMI
(100MHz, 8.0Gb/s, 12UI)
0.00 0.1
ps
(rms)
1,5,6
QPI & SMI
(100MHz, 9.6Gb/s, 12UI)
0.00 0.1
ps
(rms)
1,5,6
1
Applies to all outputs.
6
For RMS figures, additive jitter is calculated by solving the following equation: (Additive jitter)^2 = (total jittter)^2 - (input jitter)^2
5
Calculated from Intel-supplied Clock Jitter Tool v 1.6.3
t
jphQPI_SMI
Phase Jitter, PLL Mode
t
jphPCIeG2
AdditivePhase Jitter,
Bypass mode
t
jphPCIeG2
t
jphQPI_SMI
2
See http://www.pcisig.com for complete specs
3
Sample size of at least 100K cycles. This figures extrapolates to 108ps pk-pk @ 1M cycles for a BER of 1-12.
4
Subject to final ratification by PCI SIG.

9ZXL1930BKLFT

Mfr. #:
Manufacturer:
IDT
Description:
Clock Buffer HIGH PERF. ZDB
Lifecycle:
New from this manufacturer.
Delivery:
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