NCP1250
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22
4
5
1
OPP
Vlatch
10
8
9
VCC
au x.
winding
OPP
ROPPL
2.5k
11
NT C
D2
1N4148
ROPPU
841k
D3
15V
OVP
Figure 49. With the NTC Back in Place, the Circuit Nicely Combines OVP, OTP and OPP on the Same Pin
In nominal V
CC
/ output conditions, when the Zener is not
activated, the NTC can drive the OPP pin and trigger the
adapter in case of an over temperature. During nominal
temperature if the loop is broken, the voltage runaway will
be detected and the controller will shut down the converter.
In case the OPP pin is not used for either OPP or OVP, it
can simply be grounded.
Filtering the Spikes
The auxiliary winding is the seat of spikes that can couple
to the OPP pin via the parasitic capacitances exhibited by the
Zener diode and the series diode. To prevent an adverse
triggering of the Over Voltage Protection circuitry, it is
possible to install a small RC filter before the detection
network. Typical values are those given in Figure 50 and
must be selected to provide the adequate filtering function
without degrading the standby power by an excessive
current circulation.
4
5
1
OP P
Vlatch
10
3
9
VCC
aux.
winding
OPP
ROPPL
2.5k
11
NT C
2
D2
1N4148
ROPPU
841k
D3
15V
OVP
R3
220
C1
330pF
ad d ition al fil ter
Figure 50. A Small RC Filter Avoids the Fast Rising Spikes from Reaching the Protection Pin of the NCP1250 in
Presence of Energetic Perturbations Superimposed on the Input Line
NCP1250
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23
PACKAGE DIMENSIONS
TSOP6
CASE 318G02
ISSUE V
23
456
D
1
e
b
E1
A1
A
0.05
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM
LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR
GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSIONS D
AND E1 ARE DETERMINED AT DATUM H.
5. PIN ONE INDICATOR MUST BE LOCATED IN THE INDICATED ZONE.
c
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
DIM
A
MIN NOM MAX
MILLIMETERS
0.90 1.00 1.10
A1 0.01 0.06 0.10
b 0.25 0.38 0.50
c 0.10 0.18 0.26
D 2.90 3.00 3.10
E 2.50 2.75 3.00
e 0.85 0.95 1.05
L 0.20 0.40 0.60
0.25 BSC
L2
0° 10°
1.30 1.50 1.70
E1
E
RECOMMENDED
NOTE 5
L
C
M
H
L2
SEATING
PLANE
GAUGE
PLANE
DETAIL Z
DETAIL Z
0.60
6X
3.20
0.95
6X
0.95
PITCH
DIMENSIONS: MILLIMETERS
M
NCP1250
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24
PACKAGE DIMENSIONS
PDIP8
CASE 62605
ISSUE N
14
58
b2
NOTE 8
D
b
L
A1
A
eB
E
A
TOP VIEW
C
SEATING
PLANE
0.010 CA
SIDE VIEW
END VIEW
END VIEW
WITH LEADS CONSTRAINED
DIM MIN MAX
INCHES
A −−−− 0.210
A1 0.015 −−−−
b 0.014 0.022
C 0.008 0.014
D 0.355 0.400
D1 0.005 −−−−
e 0.100 BSC
E 0.300 0.325
M −−−− 10
−−− 5.33
0.38 −−−
0.35 0.56
0.20 0.36
9.02 10.16
0.13 −−−
2.54 BSC
7.62 8.26
−−− 10
MIN MAX
MILLIMETERS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSIONS A, A1 AND L ARE MEASURED WITH THE PACK-
AGE SEATED IN JEDEC SEATING PLANE GAUGE GS3.
4. DIMENSIONS D, D1 AND E1 DO NOT INCLUDE MOLD FLASH
OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS ARE
NOT TO EXCEED 0.10 INCH.
5. DIMENSION E IS MEASURED AT A POINT 0.015 BELOW DATUM
PLANE H WITH THE LEADS CONSTRAINED PERPENDICULAR
TO DATUM C.
6. DIMENSION E3 IS MEASURED AT THE LEAD TIPS WITH THE
LEADS UNCONSTRAINED.
7. DATUM PLANE H IS COINCIDENT WITH THE BOTTOM OF THE
LEADS, WHERE THE LEADS EXIT THE BODY.
8. PACKAGE CONTOUR IS OPTIONAL (ROUNDED OR SQUARE
CORNERS).
E1 0.240 0.280 6.10 7.11
b2
eB −−−− 0.430 −−− 10.92
0.060 TYP 1.52 TYP
E1
M
8X
c
D1
B
A2 0.115 0.195 2.92 4.95
L 0.115 0.150 2.92 3.81
°°
H
NOTE 5
e
e/2
A2
NOTE 3
M
B
M
NOTE 6
M
PUBLICATION ORDERING INFORMATION
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USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81358171050
NCP1250/D
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 3036752175 or 8003443860 Toll Free USA/Canada
Fax: 3036752176 or 8003443867 Toll Free USA/Canada
Email: orderlit@onsemi.com
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
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SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed
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specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
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NCP1250BP65G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Switching Controllers ACDC SWITCH OCP AUTO
Lifecycle:
New from this manufacturer.
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