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MRF9002NR2
1
RF Device Data
Freescale Semiconductor
RF Power Field Effect Transistor Array
N-Channel Enhancement-Mode Lateral MOSFET
Designed for broadband commercial and industrial applications with frequen‐
cies to 1000 MHz. The high gain and broadband performance of this device
make it ideal for large-signal, common-source amplifier applications in 26 volt
base station equipment. The device is in a PFP-16 Power Flat Pack package
which gives excellent thermal performances through a solderable backside
contact.
Typical Performance at 960 MHz, 26 Volts
Output Power — 2 Watts Per Transistor
Power Gain — 18 dB
Efficiency — 50%
Capable of Handling 10:1 VSWR, @ 26 Vdc, 960 MHz, 2 Watts CW
Output Power
Features
Designed for Maximum Gain and Insertion Phase Flatness
Excellent Thermal Stability
Characterized with Series Equivalent Large-Signal Impedance Parameters
RoHS Compliant
In Tape and Reel. R2 Suffix = 1,500 Units per 16 mm, 13 inch Reel.
Table 1. Maximum Ratings
Rating Symbol Value Unit
Drain-Source Voltage V
DSS
-0.5, +65 Vdc
Gate-Source Voltage V
GS
-0.5, +15 Vdc
Total Dissipation Per Transistor @ T
C
= 25°C P
D
4 W
Storage Temperature Range T
stg
-65 to +150 °C
Operating Junction Temperature T
J
150 °C
Table 2. Thermal Characteristics
Characteristic Symbol Value
(1)
Unit
Thermal Resistance, Junction to Case, Single Transistor R
θ
JC
12 °C/W
Table 3. Moisture Sensitivity Level
Test Methodology Rating Package Peak Temperature Unit
Per JESD 22-A113, IPC/JEDEC J-STD-020 3 260 °C
1. MTTF calculator available at http://www.freescale.com/rf. Select Tools/Software/Application Software/Calculators to access
the MTTF calculators by product.
NOTE - CAUTION
- MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and
packaging MOS devices should be observed.
Document Number: MRF9002NR2
Rev. 8, 5/2006
Freescale Semiconductor
Technical Data
MRF9002NR2
1000 MHz, 2 W, 26 V
LATERAL N-CHANNEL
BROADBAND
RF POWER MOSFET
CASE 978-03
PLASTIC
PFP-16
Figure 1. Pin Connections
16
15
14
13
12
11
10
1
2
3
4
5
6
7
8
(Top View)
9
N.C.
GATE1
N.C.
GATE2
N.C.
GATE3
N.C.
DRAIN 1-1
DRAIN 1-2
DRAIN 2-1
DRAIN 2-2
N.C.
DRAIN 3-1
DRAIN 3-2
N.C.
N.C.
Note: Exposed backside flag is source
terminal for transistors.
16
1
Freescale Semiconductor, Inc., 2006, 2009. All rights reserved.
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RF Device Data
Freescale Semiconductor
MRF9002NR2
Table 4. Electrical Characteristics
(T
C
= 25°C unless otherwise noted)
Characteristic
Symbol Min Typ Max Unit
On Characteristics
Gate Threshold Voltage
(V
DS
= 10 Vdc, I
D
= 20 µAdc)
V
GS(th)
2.4 4 Vdc
Gate Quiescent Voltage
(V
DS
= 26 Vdc, I
D
= 25 mAdc)
V
GS(Q)
3 5 Vdc
Drain-Source On-Voltage
(V
GS
= 10 Vdc, I
D
= 0.1 Adc)
V
DS(on)
0.3 Vdc
Functional Tests (Per Transistor in Freescale Test Fixture, 50 ohm system)
Common-Source Amplifier Power Gain @ P1dB
(V
DD
= 26 Vdc, I
DQ
= 25 mA, f = 960.0 MHz)
G
ps
15 18 dB
Drain Efficiency @ P1dB
(V
DD
= 26 Vdc, I
DQ
= 25 mA, f = 960.0 MHz)
η 35 50 %
Input Return Loss @ P1dB
(V
DD
= 26 Vdc, I
DQ
= 25 mA, f = 960.0 MHz)
IRL -15 -9 dB
Power Output, 1 dB Compression Point
(V
DD
= 26 Vdc, I
DQ
= 25 mA, f = 960.0 MHz)
P
1dB
34 37 dBm
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MRF9002NR2
3
RF Device Data
Freescale Semiconductor
Figure 2. MRF9002NR2 Broadband Test Circuit Schematic
RF1
OUTPUT
Z1 Z2
V
GS1
C3
C2
DUT
V
DS1
Z3R1
Z4 Z5
C8
C4
C5
C1
L1
L4
C6
C7
C16
C14
RF1
INPUT
RF2
OUTPUT
RF3
OUTPUT
RF2
INPUT
RF3
INPUT
V
GS2
V
DS2
V
GS3
V
DS3
L2
L5
L3
L6
R2
R3
Z6 Z7 Z8
Z9 Z10
C10
C9
C18
C13
Z11 Z12 Z13
Z14 Z15
C12
C11
C17
C15
+
+
+
+
+
+
Table 5. MRF9002NR2 Broadband Test Circuit Component Designations and Values
Designators Description
C1-C6 33 pF Chip Capacitors (0805)
C7-C12 1.0 µF, 35 V Tantalum Capacitors, B Case, Kemet
C13 8.2 pF Chip Capacitor (0805)
C14, C15 10 pF Chip Capacitors (0805)
C16, C17 2.7 pF Chip Capacitors (0805)
C18 3.3 pF Chip Capacitor (0805)
L1-L6 12 nH Chip Inductors (0805)
R1-R3
0 W Chip Resistors (0805)
Z1, Z11 1.16 x 28.5 mm Microstrip
Z2, Z7, Z12 0.65 x 5.6 mm Microstrip
Z3, Z8, Z13 0.65 x 2.6 mm Microstrip
Z4, Z14 1.16 x 19.5 mm Microstrip
Z5, Z15 1.16 x 17.5 mm Microstrip
Z6 1.16 x 12.9 mm Microstrip
Z9 1.16 x 27.2 mm Microstrip
Z10 1.16 x 4.3 mm Microstrip
PCB Etched Circuit Board
Raw PCB Material
Rogers RO4350, 0.020, 2.5, x 2.5, e
r
= 3.5
Bedstead Copper Heatsink

MRF9002NR2

Mfr. #:
Manufacturer:
NXP / Freescale
Description:
RF MOSFET Transistors FR PWR FET ARRAY PFP-16N
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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