AR
HIVE INF
RMATI
N
ARCHIVE INFORMATION
8
RF Device Data
Freescale Semiconductor
MRF9002NR2
PACKAGE DIMENSIONS
CASE 978-03
ISSUE C
DIM MIN MAX
MILLIMETERS
A 2.000 2.300
A1 0.025 0.100
A2 1.950 2.100
D 6.950 7.100
D1 4.372 5.180
E 8.850 9.150
E1 6.950 7.100
E2 4.372 5.180
L 0.466 0.720
L1 0.250 BSC
b 0.300 0.432
b1 0.300 0.375
c 0.180 0.279
c1 0.180 0.230
e 0.800 BSC
h --- 0.600
q 0 7
aaa 0.200
bbb 0.200
ccc 0.100
NOTES:
1. CONTROLLING DIMENSION: MILLIMETER.
2. DIMENSIONS AND TOLERANCES PER ASME
Y14.5M, 1994.
3. DATUM PLANE -H- IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 PER SIDE. DIMENSIONS D AND E1 DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE -H-.
5. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION IS 0.127 TOTAL IN EXCESS OF THE
b DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. DATUMS -A- AND -B- TO BE DETERMINED AT
DATUM PLANE -H-.
BOTTOM VIEW
D1
E2
16
9
8
1
__
e/2
S
B
M
bbb C
D
X 45
_
h
e
14 x
E1
8X E
A2
A
SEATING
PLANE
DATUM
PLANE
GAUGE
L1
PLANE
1.000
L
W
W
0.039
A1
ccc
C
DETAIL Y
SECT W-W
c
c1
b1
b
S
A
M
aaa C
q
A
B
H
C
Y
PFP-16
PLASTIC
