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AT88SA102S-TH-T

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P25
Atmel AT88SA102S [DATASHEET] 22
8584H−CRYPTO−9/2012
8. Packaging Information
3TS1 – 3-lead Shrink SOT
TITLE
DRAWING NO
.GPC
REV.
3TS1
12/11/09
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
End View
Side View
Top View
3TS1, 3-lead, 1.30mm Body, Plastic Thin
Shrink Small Outline Package (Shrink SOT)
BTBG
0.89
0.01
0.88
2.80
2.10
1.20
0.30
A
A1
A2
D
E
E1
L1
e1
b
-
-
-
2.90
-
1.30
0.54 REF
1.90 BSC
-
1.12
0.10
1.02
3.04
2.64
1.40
0.50
1,2
1,2
3
Notes: 1. Dimension D does not include mold flash, protrusions or gate burrs.
Mold flash, protrusions or gate burrs shall not exceed 0.25mm per
end. Dimension E1 does not include interlead flash or protrusion.
Interlead flash or protrusion shall not exceed 0.25mm per side.
2. The package top may be smaller than the package bottom.
Dimensions D and E1 are determined at the outermost extremes of
the plastic body exclusive of mold flash, tie bar burrs, gate burrs and
interlead flash, but including any mismatch between the top and
bottom of the plastic body.
3. These dimensions apply to the flat section of the lead between 0.08
mm and 0.15mm from the lead tip.
This drawing is for general information only. Refer to JEDEC Drawing
TO-236, Variation AB for additional information.
C
L
L1
3
E
E1
1
2
e1
SEATING
PLANE
b
A2
A
A1e
D
GND
SDA V
CC
Package Drawing Contact:
packagedrawings@atmel.com
Signal
Atmel AT88SA102S [DATASHEET] 23
8584H−CRYPTO−9/2012
8S1 – 8-lead JEDEC SOIC
DRAWING NO. REV.TITLE GPC
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
A1 0.10 – 0.25
A 1.35 – 1.75
b 0.31 – 0.51
C 0.17 – 0.25
D 4.80 – 5.05
E1 3.81 – 3.99
E 5.79 – 6.20
e 1.27 BSC
L 0.40 – 1.27
0° – 8°
Ø
E
1
N
TOP VIEW
C
E1
END VIEW
A
b
L
A1
e
D
SIDE VIEW
Package Drawing Contact:
packagedrawings@atmel.com
8S1 G
6/22/11
Notes: This drawing is for general information only.
Refer to JEDEC Drawing MS-012, Variation AA
for proper dimensions, tolerances, datums, etc.
8S1, 8-lead (0.150” Wide Body), Plastic Gull Wing
Small Outline (JEDEC SOIC)
SWB
Atmel AT88SA102S [DATASHEET] 24
8584H−CRYPTO−9/2012
9. Ordering Codes
Atmel AT88SA102S Ordering Information
Atmel Ordering Code Package Type Voltage Range Operating Range
AT88SA102S-TSU-T SOT, Tape and Reel 2.7 V–5.25 V Green compliant (exceeds RoHS)/Industrial
(−40°C to 85° C)
AT88SA102S-SH-T SOIC, Tape and Reel 2.7 V–5.25 V Green compliant (exceeds RoHS)/Industrial
(−40°C to 85° C)
10. Revision History
Doc. Rev. Date Comments
8584H 09/2012 Remove TSSOP package option.
Update Atmel logo and disclaimer page.
8584G 05/2012 Not recommended for new designs; Replaced by ATSH204.
8584G 09/2011 Correct references and sections numbers.
Section 5.1.3, Sleep Flag, change “ within 0.5V of V
CC
” to “within 0.3V of V
CC”.
BurnFuse – correct Fuse[87] to Fuse[86] and remove 24 from 24-status.
BurnSecure – change “can either be burned during the last repetition of BurnSecure or
it can be individual…” to “must be burned during the last repetition of BurnSecure as
it cannot be individual…”
8584F 08/2010 Update IO Timeout description.
8584E 06/2010 Update to Table 3: AC Parameters.
8584D 05/2010 Expansion of IO Timeout specification.
8584C 04/2010 Added 8ld TSSOP.
8584B 02/2010 Updated parameter tables and added 8ld SOIC.
8584A 03/2009 Initial document release.
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P25

AT88SA102S-TH-T

Mfr. #:
Buy AT88SA102S-TH-T
Manufacturer:
Microchip Technology / Atmel
Description:
Security ICs / Authentication ICs 58951-Eb CryptoAuth SHA-256 GRN
Lifecycle:
New from this manufacturer.
Delivery:
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